메모리 전략 브리핑 · 최초 기준본 · 2026-10-10

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Our industry leading server LPDDR SOCAMM portfolio revenue more than doubled sequentially in the fourth quarter of 2026.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Our 7600 PCIe Gen 5 and 9650 PCIe Gen 6 SSD high-performance products are now shipping to market-leading customers for KV-cache applications.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

We have completed multiple customer qualifications of our 1-gamma based, 8,800 MT/s high-speed server RDIMM modules.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

We are now shipping 6-channel 1-gamma LPDDR5X for flagship mobile devices.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

We began sampling the industry's first 512GB ultra dense high-capacity DDR5 RDIMM modules capable of speeds up to 9,200 MT/s.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Our 6600 ION SSD achieved a strong volume ramp in the fourth quarter of 2026.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

We began sampling 1-gamma based LPDDR6 products to multiple physical AI markets.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

We have secured design wins with every Tier 1 OEM customer for AI workstation product.

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Revenue of $54.23 billion versus $41.46 billion for the prior quarter and $11.32 billion for the same period last year

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Revenue of $133.19 billion versus $37.38 billion for the prior year

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Operating cash flow of $43.97 billion versus $25.39 billion for the prior quarter and $5.73 billion for the same period last year

발행일 2026.09.30 · 원문 v1 · 당시 검토 초안

Revenue$61.5 billion ± $1.5 billion$61.5 billion ± $1.5 billion

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The Business scaled up HBM4 sales with industry-leading performance and further strengthened technology competitiveness by shipping the industry’s first HBM4E samples to major customers.

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The Memory Business achieved another record-breaking quarter by proactively addressing AI demand despite limited capacity with a primary focus on server products. The continued industry-wide …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The Business also plans to lead the market by addressing strong demand with a focus on high-value-added products, such as HBM4, DDR5, SOCAMM2 and others, …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

In H2 2026, the Memory Business expects robust demand centered on servers stemming from continued AI infrastructure capex and broader adoption of agentic AI. Meanwhile, …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

Earnings for the Foundry Business improved significantly prior to incentive-related provisions, driven by HBM base-die demand and strong orders from customers in the U.S. Design …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

This follows the industry’s first HBM4E sample shipment, as well as the H1 2026 market penetration of PCIe Gen6 and UFS 5.0 solutions.

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The Company posted KRW 171.5 trillion in consolidated revenue, another all-time quarterly high, representing a quarter-on-quarter (QoQ) increase of 28%. Operating profit also reached another …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The DS Division posted KRW 127.5 trillion in consolidated revenue and KRW 89.2 trillion in operating profit for the second quarter.

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

This is projected to keep the market undersupplied, despite partial demand moderation in mobile and PCs.

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

Looking ahead to H2 2026, the Foundry Business plans to ramp up production of new mobile products based on the second-generation 2nm process and expand …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The MX and Networks Businesses posted KRW 33.2 trillion in consolidated revenue and reported an operating loss of KRW 0.7 trillion for the second quarter. …

발행일 2026.07.30 · 원문 v1 · 당시 검토 초안

The System LSI Business was impacted by flagship seasonality and soft mobile demand in China, yet managed to sustain quarterly revenue through expanded sales of …

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

Unveils 16-layer HBM4 with 48 GB for the first time and showcases conventional and AI-focused products such as SOCAMM2 and LPDDR6

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

the company will present its 321-layer 2 Tb QLC product, optimized for ultra-high capacity eSSDs

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with a customer

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

It is the next-generation product of the 12-layer HBM4 with 36 GB, which demonstrated the industry’s fastest speed of 11.7 Gbps, and is under development …

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

Custom HBM (cHBM): A product that integrates some functions located in GPUs and ASICs to the HBM base die, reflecting customer requirements.

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

SK hynix to operate customer exhibition booth to enhance customer connection

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

the company will present cHBM*optimized for specific AI chips or systems, PIM*-based AiMX*, CuD*which conducts computing in memory, CMM-Ax*thatintegrates computing capabilities into CXL* memory, and …

발행일 2026.01.05 · 원문 v1 · 당시 검토 초안

Under the theme ‘Innovative AI, Sustainable tomorrow,’ we plan to showcase a wide range of next-generation memory solutions optimized for AI

발행일 2026.10.08 · 원문 v2 · 당시 검토 초안

“We built Surface Laptop Ultra around NVIDIA RTX Spark. With up to 128 gigs of unified memory and up to a petaflop of AI compute, …

발행일 2026.10.08 · 원문 v2 · 당시 검토 초안

NVIDIA DGX Station for Windows runs on the GB300 Grace Blackwell Ultra Desktop Superchip, delivering 748GB of coherent memory and up to 20 petaFLOPS of …

발행일 2026.10.08 · 원문 v2 · 당시 검토 초안

RTX Spark combines an NVIDIA Blackwell RTX GPU with up to 6,144 cores, and an up to 20-core NVIDIA Grace CPU connected at 600 GB/s.

발행일 2026.10.08 · 원문 v2 · 당시 검토 초안

At a Microsoft event in San Francisco on Wednesday, Jensen Huang and Satya Nadella outlined how NVIDIA and Microsoft are co-engineering hardware and software for …

발행일 2026.10.08 · 원문 v2 · 당시 검토 초안

Turning Windows into a secure platform for agents, Microsoft announced general availability of Microsoft Execution Containers (MXC), the OS-level infrastructure that lets agents run safely …

발행일 2026.10.08 · 원문 v2 · 당시 검토 초안

Among the announcements Huang and Nadella outlined Wednesday, RTX Spark puts the full NVIDIA AI stack into Windows laptops and compact desktops, with laptop preorders …

발행일 2026.03.16 · 원문 v1 · 당시 검토 초안

Micron Technology, Inc. (Nasdaq: MU), has begun volume shipment of its HBM4 36GB 12H in the first quarter of calendar year 2026 and is designed …

발행일 2026.03.16 · 원문 v1 · 당시 검토 초안

Micron is the first company to mass-produce a PCIe Gen6 data center SSD.3 The Micron 9650 is optimized for energy efficiency and liquid-cooled environments, delivering …

발행일 2026.03.16 · 원문 v1 · 당시 검토 초안

With HBM4, Micron achieves over 11 Gb/s pin speeds,5 enabling a bandwidth greater than 2.8 TB/s, representing a 2.3 times bandwidth and greater than 20% …

발행일 2026.03.16 · 원문 v1 · 당시 검토 초안

Micron 7600 and 9550 SSDs offer customers PCIe Gen5 SSDs, increasing their architectural design choices.

발행일 2026.03.16 · 원문 v1 · 당시 검토 초안

Micron has demonstrated advanced packaging capability of stacking 16 die of HBM by shipping samples of HBM4 48GB 16H to customers. This milestone delivers a …

발행일 2026.03.16 · 원문 v1 · 당시 검토 초안

the Micron 9650 data center SSD delivers up to two times the read performance of Gen5 at 100% higher performance per watt 4 and optimized …

발행일 2026.07.29 · 원문 v1 · 당시 검토 초안

In 2026 the latest development is EMIB-T, which adds channels through that bridge to deliver power directly to the chips, instead of around it, which …

발행일 2026.07.29 · 원문 v1 · 당시 검토 초안

Inside Intel's Rio Rancho, New Mexico facilities, advanced packaging technologies are expanding the "reticle limit"—scaling packages to 8x the industry standard today, and over 12x …

발행일 2026.07.29 · 원문 v1 · 당시 검토 초안

Intel Foundry is building up with Foveros stacking, and across with EMIB interconnects.

발행일 2026.07.29 · 원문 v1 · 당시 검토 초안

What started in Rio Rancho, New Mexico as 25 employees in 1980, has now proudly grown to 2,700 employees and 500 suppliers bringing critical U.S. …

발행일 2026.07.29 · 원문 v1 · 당시 검토 초안

Only Intel Foundry can mix and match chiplets from different sources directly onto the industry’s largest substrates.

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

Micron Technology, Inc. (Nasdaq: MU), today announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on …

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

The module enables up to 12TB of DDR5 DRAM in a single 24-slot dual-socket server.

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

For memory-bound workloads such as Spark Support Vector Machines (SVM)-based data analytics, Micron 512GB RDIMMs can deliver up to 1.4 times higher performance compared to …

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

Higher-capacity memory technologies like Micron’s 512GB RDIMMs will help enterprises support larger in-memory workloads, improve resource utilization and enhance the flexibility needed to scale modern …

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

The new 512GB RDIMM also improves efficiency, reducing operating power by more than 60% compared with four 128GB RDIMMs.1

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

This product vertically stacks DRAM dies interconnected by through-silicon vias (TSVs) to maximize density within individual DRAM packages while preserving the performance modern data center …

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

Micron expects 512GB RDIMMs to be in volume production sometime in the second half of 2027 aligned to customer needs.

발행일 2026.09.15 · 원문 v1 · 당시 검토 초안

Leading semiconductor enablers, AMD and Intel, are both actively validating the module, which will deliver speeds up to 9,200 MT/s.

발행일 2026.10.09 · 원문 v1 · 당시 검토 초안

OpenAI's annualized revenue is $50 billion

발행일 2026.10.09 · 원문 v1 · 당시 검토 초안

The $70 billion ARR figure for OpenAI was an attempt to "gross up" its revenue number

발행일 2026.10.09 · 원문 v1 · 당시 검토 초안

He points out that the local leading chip foundries in China have larger capacity expansion plans than analysts expected.

발행일 2026.10.09 · 원문 v1 · 당시 검토 초안

At the same time, the semicap equipment makers (the tools for making semiconductor chips) have issued guidance for 40% year-on-year revenue increases over the next …

발행일 2026.10.09 · 원문 v1 · 당시 검토 초안

Our analysts expect the total addressable market for this technology to increase by nine times to $154 billion in 2028.

발행일 2026.10.09 · 원문 v1 · 당시 검토 초안

He notes that Chinese open-weight large language models (LLMs) are being housed on US hyperscaler cloud systems, which could mark a step forward for these …

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

Coming this month, [NVIDIA DGX Spark](https://www.nvidia.com/en-us/products/workstations/dgx-spark/) will be available with 64GB of unified memory from top manufacturer partners — Acer, ASUS, Dell, Gigabyte, HP and …

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

It supports up to 100-billion-parameter models and the agentic applications built on them, fully on device.

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

Plus, two units can connect directly with a QSFP cable, pooling their memory to 128GB and expanding model support to up to 200 billion parameters …

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

In NVIDIA’s Qwen 3.8 27B test, two clustered 64 GB systems delivered up to 1.7x performance compared with a single system, with room to keep …

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

DGX Spark 64GB is available from [Acer](https://www.acer.com/us-en/desktops-and-all-in-ones/veriton-workstations/veriton-gn100-ai-mini-workstation), [ASUS](https://www.asus.com/networking-iot-servers/desktop-ai-supercomputer/ultra-small-ai-supercomputers/asus-ascent-gx10/), Dell, [Gigabyte](https://www.gigabyte.com/AI-TOP-PC/GIGABYTE-AI-TOP-ATOM), HP and [MSI](https://ipc.msi.com/product_detail/Industrial-Computer-Box-PC/AI-Supercomputer/EdgeXpert-MS-C931)on Friday, Oct. 23, starting at $4,999.

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

DGX Spark combines NVIDIA Grace Blackwell compute, unified memory, [NVIDIA ConnectX-7 networking](https://www.nvidia.com/en-us/networking/ethernet-adapters/) and an [NVIDIA CUDA](https://developer.nvidia.com/cuda)-accelerated AI software stack in one system.

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

And coming at the end of the month, NVIDIA Sync Model Launcher makes running local AI as simple as clicking a few buttons.

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

Blender is among the first major creator application providers to support the platform, with a [prebuilt, downloadable installer coming soon](http://blender.org/download.).

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

New Windows PCs powered by [NVIDIA RTX Spark](https://blogs.nvidia.com/blog/local-ai-ifa-next-gen-agents-nv-pair-rtx-spark/) are coming this month from Acer, ASUS, Dell, HP, Lenovo, Microsoft and MSI.

발행일 2026.10.02 · 원문 v2 · 당시 검토 초안

It runs locally on NVIDIA RTX GPUs, DGX Spark and DGX Station, giving creators more ways to create and refine images on their own hardware.