MEMORY INDUSTRY INTELLIGENCE
CXL® 메모리 폼팩터 비교: 성장하는 표준을 위한 폼팩터 검토 - Compute Express Link
한국어 번역·요약·분석
원문 제목: CXL® Memory Form-Factor Comparison: Examination of Form-Factors for this Growing Standard - Compute Express Link
핵심 요약
이 글은 CXL(Compute Express Link) 메모리 확장을 위한 EDSFF와 AIC(Add-In-Card) 폼팩터를 비교한다. CXL은 PCIe 인프라를 기반으로 메모리 확장·풀링·공유·시스템 컴포저빌리티를 가능하게 하는 고대역폭·저지연 CPU-디바이스 인터커넥트 표준이며, Type 3 메모리 모듈이 초기 산업 초점이다. EDSFF는 SNIA가 관리하며 E1.S, E3.S, E3.L 등 다양한 폼팩터와 PCIe 레인 구성을 지원하고, AIC는 PCI-SIG의 CEM 규격으로 기존 DRAM 모듈을 사용하는 CXL 카드 설치를 가능하게 한다. 일반적으로 EDSFF는 용량·전력이 낮고 서버 전면 장착에 적합하며, AIC는 용량·전력이 높지만 내부 설치가 필요하고 공간을 더 차지한다. 결론적으로 CXL 모듈·카드는 기존 컴퓨터 섀시·타워·블레이드에 기계적·전기적 재설계 없이 추가될 수 있다.
메모리 산업 영향 분석
이 원문은 CXL 메모리 확장용 폼팩터(EDSFF E1.S·E3.S·E3.L, AIC)의 물리적·전력·용량 특성을 비교한 기술 개요로, 특정 메모리 제조사의 공급 계획이나 고객 채택을 확인한 자료가 아니다. 메모리 산업 관점에서 직접적인 함의는 CXL Type 3 메모리 모듈이 기존 DRAM DIMM을 AIC 형태로 수용할 수 있다는 점이며, 이는 서버 DDR 수요의 일부가 CXL 확장 모듈로 이동할 가능성을 시사하지만 원문은 실제 채택·양산·주문량을 제시하지 않는다. EDSFF는 전면 장착·저전력·저용량, AIC는 내부 설치·고전력·고용량이라는 상충 효과가 있어, 공급 배분 측면에서는 CXL 모듈용 DRAM 다이와 기존 서버 RDIMM용 다이 간 믹스 선택이, 고객 인증 측면에서는 서버 OEM의 폼팩터 채택 여부가, 투자 일정 측면에서는 CXL 지원 플랫폼 출시 시점이 핵심 변수다. 다만 원문은 CXL 메모리의 실제 DRAM 규격·사용처·계층 이동을 확인하지 않으므로, HBM·서버 DDR·서버 LPDDR 등 특정 제품의 수요 증감을 단정할 수 없고, CXL이 연결 프로토콜이라는 점에서 CXL 메모리 용량을 기존 DRAM 총량에 추가 합산해서는 안 된다. 판단 변경 조건은 CXL Type 3 모듈의 실제 서버 채택·인증·양산이 확인되는 경우이며, 그 전까지는 기술 관찰(watchlist) 범위에 머문다.
한국어 번역 읽기
수집된 원문 v1의 전체 본문 기준 · 4151자
By: Timothy Pezarro, Product Line and Technology Planning Manager at Microchip, and Torry Steed, Senior Product Marketing Manager at SMART Modular Technologies
## Introduction
Computer systems have used direct attached memory modules in the form of DIMMs for decades. These modules attach directly to the host motherboard and to the CPU using a parallel bus. Expanding the number of modules a system can utilize involves adding memory controllers and pins to the CPU which quickly becomes prohibitive.
As modern applications such as AI & Machine Learning, image processing, in-memory databases and real time analytics consume more memory than ever before, a new solution is needed to keep up with the demand for low latency, high bandwidth memory.
Compute Express Link® (CXL®) is a high-bandwidth, low latency, CPU-to-Device interconnect standard. It builds on existing PCI Express® (PCIe®) infrastructure, leveraging the PCIe physical and electrical interface while adding additional transfer protocols. Memory expansion, memory pooling, including sharing, and system composability are usage models enabled by CXL. CXL enables support for three types of devices:
* Type 1: Smart NICs & Accelerators
* Type 2: Accelerators with Cache
* Type 3: Memory
Due to the growing demand for high density and cost effective memory solutions, industry efforts are initially focusing on memory expansion with Type 3 Memory modules. These modules can be built in several different emerging form factors as described in this article. They include EDSFF (Enterprise and Datacenter Standard Form Factor) and AIC (Add-In-Card) form factors.
## EDSFF Form Factors
EDSFF is maintained by the Storage Networking Industry Association (SNIA) and defines a family of standardized form factors with several advantages over the current industry standard SSD form factors. EDSFF supports a number of different PCIe lane configurations (x4, x8, and x16) as well as several different physical form factors, all of which are suitable for CXL based designs as well.
## EDSFF E1.S
Figure 1 – left to right: E1.S 5.9mm (courtesy of SMART Modular Systems); E1.S Symmetric Enclosure (courtesy of Intel); E1.S (courtesy of KIOXIA); E1.S 5.9mm (courtesy of Micron); E1.S 15mm (courtesy of Micron)
Figure 2 – Supermicro® Server with 32 E1.L fitted in 1U chassis
## EDSFF E3.S and E3.L
Figure 3 – EDSFF Modules
Figure 4 – SMART Modular Technologies E3.S CXL Memory Module
## Add in Card (AIC) Form Factors
The AIC form factor, also referred to as CEM (Card Electromechanical), is the longest standing PCIe form factor which supports a wide variety of devices from graphics accelerators to network cards. The standard may be downloaded from the [PCI-SIG website](https://pcisig.com/specifications). AICs support different connector sizes and lane counts (x1, x2, x4, x8, and x16) and sizes with full and half height (referred to as “low profile”) as well as full and half-length. This form factor allows CXL AICs that use conventional DRAM memory modules to be installed making for good value memory expansion.
Figure 5 – SMART Modular 8-DIMM Add-In-Card
Figure 6 – SMART Modular 4-DIMM Add-In-Card
## Form Factor Comparison
In general, EDSFF devices have lower capacity and lower power than AIC devices, but fit in smaller form factors suitable for front loading on servers. AICs, by contrast, have higher capacities and power, but need to be installed internally in the system and take up more space.
Form Factor Capacity Cost/GB Power (watts)Size (H x L) mm
E1.S Low High 25 31.5 x 111.49
E3.S Moderate Moderate 25/40 76 x 112.75
E3.L Moderate Moderate 40/70 76 x 142.2
AIC (FHFL)High Low 75+167 x 312
AIC (HHHL)High Low 75+111 x 167
## Conclusion
There are several form factors available for CXL devices that leverage the PCIe ecosystem and framework. CXL modules and cards may be added to existing computer shelves, towers, and blades with no mechanical or electrical re-design requirement. Providing a reasonable comprise between footprint and capacity allows for a smooth integration of CXL devices into contemporary computer system designs.
## Introduction
Computer systems have used direct attached memory modules in the form of DIMMs for decades. These modules attach directly to the host motherboard and to the CPU using a parallel bus. Expanding the number of modules a system can utilize involves adding memory controllers and pins to the CPU which quickly becomes prohibitive.
As modern applications such as AI & Machine Learning, image processing, in-memory databases and real time analytics consume more memory than ever before, a new solution is needed to keep up with the demand for low latency, high bandwidth memory.
Compute Express Link® (CXL®) is a high-bandwidth, low latency, CPU-to-Device interconnect standard. It builds on existing PCI Express® (PCIe®) infrastructure, leveraging the PCIe physical and electrical interface while adding additional transfer protocols. Memory expansion, memory pooling, including sharing, and system composability are usage models enabled by CXL. CXL enables support for three types of devices:
* Type 1: Smart NICs & Accelerators
* Type 2: Accelerators with Cache
* Type 3: Memory
Due to the growing demand for high density and cost effective memory solutions, industry efforts are initially focusing on memory expansion with Type 3 Memory modules. These modules can be built in several different emerging form factors as described in this article. They include EDSFF (Enterprise and Datacenter Standard Form Factor) and AIC (Add-In-Card) form factors.
## EDSFF Form Factors
EDSFF is maintained by the Storage Networking Industry Association (SNIA) and defines a family of standardized form factors with several advantages over the current industry standard SSD form factors. EDSFF supports a number of different PCIe lane configurations (x4, x8, and x16) as well as several different physical form factors, all of which are suitable for CXL based designs as well.
## EDSFF E1.S
Figure 1 – left to right: E1.S 5.9mm (courtesy of SMART Modular Systems); E1.S Symmetric Enclosure (courtesy of Intel); E1.S (courtesy of KIOXIA); E1.S 5.9mm (courtesy of Micron); E1.S 15mm (courtesy of Micron)
Figure 2 – Supermicro® Server with 32 E1.L fitted in 1U chassis
## EDSFF E3.S and E3.L
Figure 3 – EDSFF Modules
Figure 4 – SMART Modular Technologies E3.S CXL Memory Module
## Add in Card (AIC) Form Factors
The AIC form factor, also referred to as CEM (Card Electromechanical), is the longest standing PCIe form factor which supports a wide variety of devices from graphics accelerators to network cards. The standard may be downloaded from the [PCI-SIG website](https://pcisig.com/specifications). AICs support different connector sizes and lane counts (x1, x2, x4, x8, and x16) and sizes with full and half height (referred to as “low profile”) as well as full and half-length. This form factor allows CXL AICs that use conventional DRAM memory modules to be installed making for good value memory expansion.
Figure 5 – SMART Modular 8-DIMM Add-In-Card
Figure 6 – SMART Modular 4-DIMM Add-In-Card
## Form Factor Comparison
In general, EDSFF devices have lower capacity and lower power than AIC devices, but fit in smaller form factors suitable for front loading on servers. AICs, by contrast, have higher capacities and power, but need to be installed internally in the system and take up more space.
Form Factor Capacity Cost/GB Power (watts)Size (H x L) mm
E1.S Low High 25 31.5 x 111.49
E3.S Moderate Moderate 25/40 76 x 112.75
E3.L Moderate Moderate 40/70 76 x 142.2
AIC (FHFL)High Low 75+167 x 312
AIC (HHHL)High Low 75+111 x 167
## Conclusion
There are several form factors available for CXL devices that leverage the PCIe ecosystem and framework. CXL modules and cards may be added to existing computer shelves, towers, and blades with no mechanical or electrical re-design requirement. Providing a reasonable comprise between footprint and capacity allows for a smooth integration of CXL devices into contemporary computer system designs.
브리프용 요약 초안
CXL 메모리 확장을 위한 EDSFF와 AIC 폼팩터 비교 기술 개요로, EDSFF는 전면 장착·저전력·저용량, AIC는 내부 설치·고전력·고용량 특성을 보인다. CXL Type 3 메모리 모듈이 기존 DRAM DIMM을 AIC로 수용할 수 있다는 점은 서버 DDR 수요 구조에 잠재적 영향을 주지만, 원문은 실제 채택·양산·주문량을 확인하지 않아 메모리 제품별 수요 증감을 단정할 수 없다.
원문 텍스트
원문 열기 ↗By: Timothy Pezarro, Product Line and Technology Planning Manager at Microchip, and Torry Steed, Senior Product Marketing Manager at SMART Modular Technologies
## Introduction
Computer systems have used direct attached memory modules in the form of DIMMs for decades. These modules attach directly to the host motherboard and to the CPU using a parallel bus. Expanding the number of modules a system can utilize involves adding memory controllers and pins to the CPU which quickly becomes prohibitive.
As modern applications such as AI & Machine Learning, image processing, in-memory databases and real time analytics consume more memory than ever before, a new solution is needed to keep up with the demand for low latency, high bandwidth memory.
Compute Express Link® (CXL®) is a high-bandwidth, low latency, CPU-to-Device interconnect standard. It builds on existing PCI Express® (PCIe®) infrastructure, leveraging the PCIe physical and electrical interface while adding additional transfer protocols. Memory expansion, memory pooling, including sharing, and system composability are usage models enabled by CXL. CXL enables support for three types of devices:
* Type 1: Smart NICs & Accelerators
* Type 2: Accelerators with Cache
* Type 3: Memory
Due to the growing demand for high density and cost effective memory solutions, industry efforts are initially focusing on memory expansion with Type 3 Memory modules. These modules can be built in several different emerging form factors as described in this article. They include EDSFF (Enterprise and Datacenter Standard Form Factor) and AIC (Add-In-Card) form factors.
## EDSFF Form Factors
EDSFF is maintained by the Storage Networking Industry Association (SNIA) and defines a family of standardized form factors with several advantages over the current industry standard SSD form factors. EDSFF supports a number of different PCIe lane configurations (x4, x8, and x16) as well as several different physical form factors, all of which are suitable for CXL based designs as well.
## EDSFF E1.S
Figure 1 – left to right: E1.S 5.9mm (courtesy of SMART Modular Systems); E1.S Symmetric Enclosure (courtesy of Intel); E1.S (courtesy of KIOXIA); E1.S 5.9mm (courtesy of Micron); E1.S 15mm (courtesy of Micron)
Figure 2 – Supermicro® Server with 32 E1.L fitted in 1U chassis
## EDSFF E3.S and E3.L
Figure 3 – EDSFF Modules
Figure 4 – SMART Modular Technologies E3.S CXL Memory Module
## Add in Card (AIC) Form Factors
The AIC form factor, also referred to as CEM (Card Electromechanical), is the longest standing PCIe form factor which supports a wide variety of devices from graphics accelerators to network cards. The standard may be downloaded from the [PCI-SIG website](https://pcisig.com/specifications). AICs support different connector sizes and lane counts (x1, x2, x4, x8, and x16) and sizes with full and half height (referred to as “low profile”) as well as full and half-length. This form factor allows CXL AICs that use conventional DRAM memory modules to be installed making for good value memory expansion.
Figure 5 – SMART Modular 8-DIMM Add-In-Card
Figure 6 – SMART Modular 4-DIMM Add-In-Card
## Form Factor Comparison
In general, EDSFF devices have lower capacity and lower power than AIC devices, but fit in smaller form factors suitable for front loading on servers. AICs, by contrast, have higher capacities and power, but need to be installed internally in the system and take up more space.
Form Factor Capacity Cost/GB Power (watts)Size (H x L) mm
E1.S Low High 25 31.5 x 111.49
E3.S Moderate Moderate 25/40 76 x 112.75
E3.L Moderate Moderate 40/70 76 x 142.2
AIC (FHFL)High Low 75+167 x 312
AIC (HHHL)High Low 75+111 x 167
## Conclusion
There are several form factors available for CXL devices that leverage the PCIe ecosystem and framework. CXL modules and cards may be added to existing computer shelves, towers, and blades with no mechanical or electrical re-design requirement. Providing a reasonable comprise between footprint and capacity allows for a smooth integration of CXL devices into contemporary computer system designs.
## Introduction
Computer systems have used direct attached memory modules in the form of DIMMs for decades. These modules attach directly to the host motherboard and to the CPU using a parallel bus. Expanding the number of modules a system can utilize involves adding memory controllers and pins to the CPU which quickly becomes prohibitive.
As modern applications such as AI & Machine Learning, image processing, in-memory databases and real time analytics consume more memory than ever before, a new solution is needed to keep up with the demand for low latency, high bandwidth memory.
Compute Express Link® (CXL®) is a high-bandwidth, low latency, CPU-to-Device interconnect standard. It builds on existing PCI Express® (PCIe®) infrastructure, leveraging the PCIe physical and electrical interface while adding additional transfer protocols. Memory expansion, memory pooling, including sharing, and system composability are usage models enabled by CXL. CXL enables support for three types of devices:
* Type 1: Smart NICs & Accelerators
* Type 2: Accelerators with Cache
* Type 3: Memory
Due to the growing demand for high density and cost effective memory solutions, industry efforts are initially focusing on memory expansion with Type 3 Memory modules. These modules can be built in several different emerging form factors as described in this article. They include EDSFF (Enterprise and Datacenter Standard Form Factor) and AIC (Add-In-Card) form factors.
## EDSFF Form Factors
EDSFF is maintained by the Storage Networking Industry Association (SNIA) and defines a family of standardized form factors with several advantages over the current industry standard SSD form factors. EDSFF supports a number of different PCIe lane configurations (x4, x8, and x16) as well as several different physical form factors, all of which are suitable for CXL based designs as well.
## EDSFF E1.S
Figure 1 – left to right: E1.S 5.9mm (courtesy of SMART Modular Systems); E1.S Symmetric Enclosure (courtesy of Intel); E1.S (courtesy of KIOXIA); E1.S 5.9mm (courtesy of Micron); E1.S 15mm (courtesy of Micron)
Figure 2 – Supermicro® Server with 32 E1.L fitted in 1U chassis
## EDSFF E3.S and E3.L
Figure 3 – EDSFF Modules
Figure 4 – SMART Modular Technologies E3.S CXL Memory Module
## Add in Card (AIC) Form Factors
The AIC form factor, also referred to as CEM (Card Electromechanical), is the longest standing PCIe form factor which supports a wide variety of devices from graphics accelerators to network cards. The standard may be downloaded from the [PCI-SIG website](https://pcisig.com/specifications). AICs support different connector sizes and lane counts (x1, x2, x4, x8, and x16) and sizes with full and half height (referred to as “low profile”) as well as full and half-length. This form factor allows CXL AICs that use conventional DRAM memory modules to be installed making for good value memory expansion.
Figure 5 – SMART Modular 8-DIMM Add-In-Card
Figure 6 – SMART Modular 4-DIMM Add-In-Card
## Form Factor Comparison
In general, EDSFF devices have lower capacity and lower power than AIC devices, but fit in smaller form factors suitable for front loading on servers. AICs, by contrast, have higher capacities and power, but need to be installed internally in the system and take up more space.
Form Factor Capacity Cost/GB Power (watts)Size (H x L) mm
E1.S Low High 25 31.5 x 111.49
E3.S Moderate Moderate 25/40 76 x 112.75
E3.L Moderate Moderate 40/70 76 x 142.2
AIC (FHFL)High Low 75+167 x 312
AIC (HHHL)High Low 75+111 x 167
## Conclusion
There are several form factors available for CXL devices that leverage the PCIe ecosystem and framework. CXL modules and cards may be added to existing computer shelves, towers, and blades with no mechanical or electrical re-design requirement. Providing a reasonable comprise between footprint and capacity allows for a smooth integration of CXL devices into contemporary computer system designs.