MEMORY INDUSTRY INTELLIGENCE
Broadcom·삼성: HBM 공급 협력과 2nm 파운드리 MOU
한국어 번역·요약·분석
원문 제목: Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
핵심 요약
삼성 공식 발표는 Broadcom과 메모리·파운드리 협력 확대 MOU를 체결했다고 밝힙니다. HBM을 포함한 메모리 공급 협력을 추진하며, 파운드리는 2nm 이하 공정과 첨단 패키징 협력을 설명합니다. 페이지 표시일 7월 24일, 본문 발표일 7월 25일, 메타데이터 8월 7일이 상충해 발행일은 미확인으로 보존합니다.
메모리 산업 영향 분석
분석: 삼성도 Broadcom 차세대 AI 가속기의 메모리 협력 경로로 관찰할 근거가 있습니다. SK하이닉스와의 기존 협력과 병행 가능성을 관찰하되, HBM4 최종 선정·양산 공급 확정 또는 공급사 교체로 해석하지 않습니다.
미확인: HBM 세대·용량·공급 비중·독점권·고객별 BOM·물량·계약 가격은 미공개입니다. 기사 발행일도 원문 표기가 상충합니다.
미확인: HBM 세대·용량·공급 비중·독점권·고객별 BOM·물량·계약 가격은 미공개입니다. 기사 발행일도 원문 표기가 상충합니다.
원문 인용 발췌 번역 읽기
수집된 원문 v1의 인용 발췌 기준 · 73자
삼성 공식 발표는 협력 확대를 위한 양해각서 체결이라고 명시합니다.
메모리 협력 범위에는 HBM이 포함되며 공급 협력을 추진할 계획입니다.
메모리 협력 범위에는 HBM이 포함되며 공급 협력을 추진할 계획입니다.
분석가가 확인한 인용 발췌의 번역입니다. 원문 전체 번역은 아닙니다.
브리프용 요약 초안
삼성 공식 발표는 Broadcom과 메모리·파운드리 협력 확대 MOU를 체결했다고 밝힙니다. HBM을 포함한 메모리 공급 협력을 추진하며, 파운드리는 2nm 이하 공정과 첨단 패키징 협력을 설명합니다. 페이지 표시일 7월 24일, 본문 발표일 7월 25일, 메타데이터 8월 7일이 상충해 발행일은 미확인으로 보존합니다.
원문 텍스트
원문 열기 ↗# Samsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry Technologies
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Jul 24, 2026
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_**Companies sign memorandum of understanding to broaden collaboration on
next-generation AI infrastructure, spanning leading-edge memory,
foundry technologies and advanced packaging**_
**SAN JOSE, Calif., and SEOUL, Korea – July 25, 2026 –** Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure.
The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung Electronics’ Foundry Business, Hock Tan, President and CEO of Broadcom, senior executives from both companies and representatives of the Korean government.
The companies expect the collaboration to be estimated at more than $200B across memory and foundry over the next five years through 2030.
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including High Bandwidth Memory (HBM), supporting Broadcom’s next-generation AI accelerators.
In foundry, the companies’ collaboration focuses on Samsung’s 2-nanometer (nm) and below process technologies for Broadcom’s products, including Wireless Broadband Communications (WBC) solutions. The collaboration is expected to extend to advanced packaging technologies built on Samsung’s 2nm process, including 2.3D and 2.5D integration, to enable higher-performance and more power-efficient AI and networking silicon.
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” said Young Hyun Jun, Vice Chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”
“As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important,” said Charlie Kawwas, President, Semiconductor Solutions Group of Broadcom. “By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”
With capabilities encompassing memory, logic, foundry and advanced packaging, Samsung is uniquely positioned to deliver integrated semiconductor solutions for the AI era. The expanded collaboration with Broadcom reflects Samsung’s continued focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications.
**About Samsung Electronics Co., Ltd.**
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, digital signage, smartphones, wearables, tablets, home appliances and network systems, as well as memory, system LSI and foundry. Samsung is also advancing medical imaging technologies, HVAC solutions and robotics, while creating innovative automotive and audio products through Harman. With its SmartThings ecosystem, open collaboration with partners, and integration of AI across its portfolio, Samsung delivers a seamless and intelligent connected experience. For the latest news, please visit the Samsung Newsroom at [news.samsung.com↗](https://news.samsung.com/global/ "Open link in a new tab").
* #Broadcom
* #HBM
* #AI Semiconductor
* #One-stop Turnkey Solutions
* #Foundry
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* [mail](mailto:?subject=Samsung%20Electronics%20and%20Broadcom%20Expand%20Strategic%20Collaboration%20Across%20Memory%20and%20Foundry%20Technologies%20|%20Samsung%20Semiconductor%20Global&body=https://semiconductor.samsung.com/news-events/news/samsung-electronics-and-broadcom-expand-strategic-collaboration-across-memory-and-foundry-technologies/ "share to email")
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Jul 24, 2026
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_**Companies sign memorandum of understanding to broaden collaboration on
next-generation AI infrastructure, spanning leading-edge memory,
foundry technologies and advanced packaging**_
**SAN JOSE, Calif., and SEOUL, Korea – July 25, 2026 –** Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure.
The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung Electronics’ Foundry Business, Hock Tan, President and CEO of Broadcom, senior executives from both companies and representatives of the Korean government.
The companies expect the collaboration to be estimated at more than $200B across memory and foundry over the next five years through 2030.
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including High Bandwidth Memory (HBM), supporting Broadcom’s next-generation AI accelerators.
In foundry, the companies’ collaboration focuses on Samsung’s 2-nanometer (nm) and below process technologies for Broadcom’s products, including Wireless Broadband Communications (WBC) solutions. The collaboration is expected to extend to advanced packaging technologies built on Samsung’s 2nm process, including 2.3D and 2.5D integration, to enable higher-performance and more power-efficient AI and networking silicon.
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” said Young Hyun Jun, Vice Chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”
“As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important,” said Charlie Kawwas, President, Semiconductor Solutions Group of Broadcom. “By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”
With capabilities encompassing memory, logic, foundry and advanced packaging, Samsung is uniquely positioned to deliver integrated semiconductor solutions for the AI era. The expanded collaboration with Broadcom reflects Samsung’s continued focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications.
**About Samsung Electronics Co., Ltd.**
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, digital signage, smartphones, wearables, tablets, home appliances and network systems, as well as memory, system LSI and foundry. Samsung is also advancing medical imaging technologies, HVAC solutions and robotics, while creating innovative automotive and audio products through Harman. With its SmartThings ecosystem, open collaboration with partners, and integration of AI across its portfolio, Samsung delivers a seamless and intelligent connected experience. For the latest news, please visit the Samsung Newsroom at [news.samsung.com↗](https://news.samsung.com/global/ "Open link in a new tab").
* #Broadcom
* #HBM
* #AI Semiconductor
* #One-stop Turnkey Solutions
* #Foundry