MEMORY INDUSTRY INTELLIGENCE
Broadcom: Fujitsu용 2nm 3.5D SoC 출하와 후속 XPU 계획
한국어 번역·요약·분석
원문 제목: Broadcom Ships 3.5D Face-to-Face Compute SoC Powering AI Revolution
핵심 요약
2026-02-26 Broadcom은 Fujitsu용 2nm 3.5D 맞춤형 컴퓨트 SoC의 출하 시작을 발표했습니다. Fujitsu는 FUJITSU-MONAKA 프로세서 계획과의 연계를 설명했습니다. 다른 고객의 XPU는 2026년 하반기 출하 계획으로 구분됩니다.
메모리 산업 영향 분석
분석: CPU·HPC SoC 구현과 AI XPU 설계가 Broadcom의 공통 패키징 기술을 사용할 수 있습니다. 이번 Fujitsu SoC에 HBM이 탑재됐다는 뜻은 아니며, 메모리 수요는 제품별 DRAM 구성 자료로 확인해야 합니다.
미확인: 이번 SoC의 HBM 채택·메모리 공급사·장치당 용량·실제 서버 배치 수량은 이 원문에서 확인되지 않습니다.
미확인: 이번 SoC의 HBM 채택·메모리 공급사·장치당 용량·실제 서버 배치 수량은 이 원문에서 확인되지 않습니다.
원문 인용 발췌 번역 읽기
수집된 원문 v1의 인용 발췌 기준 · 80자
Broadcom은 첫 2nm 맞춤형 3.5D 컴퓨트 SoC의 출하 시작을 발표했습니다.
해당 발표는 Fujitsu용 3.5D SoC라고 고객을 명시합니다.
더 넓은 고객군의 XPU는 2026년 하반기 출하 예정으로 설명합니다.
해당 발표는 Fujitsu용 3.5D SoC라고 고객을 명시합니다.
더 넓은 고객군의 XPU는 2026년 하반기 출하 예정으로 설명합니다.
분석가가 확인한 인용 발췌의 번역입니다. 원문 전체 번역은 아닙니다.
브리프용 요약 초안
2026-02-26 Broadcom은 Fujitsu용 2nm 3.5D 맞춤형 컴퓨트 SoC의 출하 시작을 발표했습니다. Fujitsu는 FUJITSU-MONAKA 프로세서 계획과의 연계를 설명했습니다. 다른 고객의 XPU는 2026년 하반기 출하 계획으로 구분됩니다.
원문 텍스트
원문 열기 ↗Product News Release|Feb 26, 2026
**Industry’s first 3.5D Face-to-Face (F2F) technology enables large-scale integration of XPUs delivering breakthrough performance, efficiency and scalability for AI clusters**
PALO ALTO, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced it has begun shipping the industry’s first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. A proven modular, multi-dimensional stacked die platform, 3.5D XDSiP combines 2.5D techniques and 3D-IC integration using Face-to-Face (F2F) technology.
3.5D XDSiP is foundational to next-generation XPUs. With 3.5D XDSiP, consumer AI customers can deliver the most advanced XPU with unparalleled signal density, superior power efficiency and low latency to meet the massive computational demands of gigawatt-scale AI clusters. Broadcom’s XDSiP platform allows compute, memory and network I/O to scale independently in a compact form factor, enabling high-efficiency, low-power computing at scale.
“We’re proud to deliver the first 3.5D custom compute SoC for Fujitsu – a testament to the outstanding execution and innovation by the Broadcom team,” said Frank Ostojic, senior vice president and general manager of Broadcom’s ASIC Products Division. “Since introducing our 3.5D XDSiP platform technology in 2024, Broadcom has expanded its 3.5D platform capabilities to support XPUs for our broader customer base that will ship from 2H '26. These developments underscore Broadcom’s unrivaled technology leadership in delivering high-complexity XPUs to enable transformative breakthroughs in AI.”
“The launch of Broadcom’s 3.5D XDSiP technology marks a transformative milestone in advanced semiconductor integration. By combining 2nm process innovation with Face-to-Face 3D integration, it unlocks unprecedented compute density and energy efficiency essential for the next era of AI and HPC,” Naoki Shinjo, SVP, Head of Advanced Technology Development Unit, Fujitsu. “This breakthrough is a key enabler for Fujitsu’s FUJITSU-MONAKA initiative to deliver cutting-edge, high-performance, and low-power processors. We highly value our strategic partnership with Broadcom and believe this technology will help power a more scalable and sustainable AI-driven society.”
For more information on Broadcom’s 3.5D XDSiP, please click [here](https://www.globenewswire.com/Tracker?data=UNohmCn8xiEDL0H4WdTDr6yu9rhSJ4GUplxi88ZeNMG4VdxKtt_UoFqJ5ffDuZkwsT1RfQZ35_bVNLiDUizSb0OubIU8RlRSnqli5IO2eiA=).
**About Broadcom**
Broadcom Inc. (NASDAQ: AVGO) is a technology leader that designs, develops, and supplies semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. Broadcom combines long-term R&D investment with superb execution to deliver the best technology, at scale. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, visit [www.broadcom.com](http://www.broadcom.com/).
_Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners._
Press Contact:
Khanh Lam
Global Communications
[press.relations@broadcom.com](mailto:press.relations@broadcom.com)
Telephone: +1 408 433 8649
[](https://www.globenewswire.com/NewsRoom/AttachmentNg/2fecbd2d-d0e5-4503-969d-90632b69ed65)
Source: Broadcom Inc.
## More News Releases
**Industry’s first 3.5D Face-to-Face (F2F) technology enables large-scale integration of XPUs delivering breakthrough performance, efficiency and scalability for AI clusters**
PALO ALTO, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced it has begun shipping the industry’s first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. A proven modular, multi-dimensional stacked die platform, 3.5D XDSiP combines 2.5D techniques and 3D-IC integration using Face-to-Face (F2F) technology.
3.5D XDSiP is foundational to next-generation XPUs. With 3.5D XDSiP, consumer AI customers can deliver the most advanced XPU with unparalleled signal density, superior power efficiency and low latency to meet the massive computational demands of gigawatt-scale AI clusters. Broadcom’s XDSiP platform allows compute, memory and network I/O to scale independently in a compact form factor, enabling high-efficiency, low-power computing at scale.
“We’re proud to deliver the first 3.5D custom compute SoC for Fujitsu – a testament to the outstanding execution and innovation by the Broadcom team,” said Frank Ostojic, senior vice president and general manager of Broadcom’s ASIC Products Division. “Since introducing our 3.5D XDSiP platform technology in 2024, Broadcom has expanded its 3.5D platform capabilities to support XPUs for our broader customer base that will ship from 2H '26. These developments underscore Broadcom’s unrivaled technology leadership in delivering high-complexity XPUs to enable transformative breakthroughs in AI.”
“The launch of Broadcom’s 3.5D XDSiP technology marks a transformative milestone in advanced semiconductor integration. By combining 2nm process innovation with Face-to-Face 3D integration, it unlocks unprecedented compute density and energy efficiency essential for the next era of AI and HPC,” Naoki Shinjo, SVP, Head of Advanced Technology Development Unit, Fujitsu. “This breakthrough is a key enabler for Fujitsu’s FUJITSU-MONAKA initiative to deliver cutting-edge, high-performance, and low-power processors. We highly value our strategic partnership with Broadcom and believe this technology will help power a more scalable and sustainable AI-driven society.”
For more information on Broadcom’s 3.5D XDSiP, please click [here](https://www.globenewswire.com/Tracker?data=UNohmCn8xiEDL0H4WdTDr6yu9rhSJ4GUplxi88ZeNMG4VdxKtt_UoFqJ5ffDuZkwsT1RfQZ35_bVNLiDUizSb0OubIU8RlRSnqli5IO2eiA=).
**About Broadcom**
Broadcom Inc. (NASDAQ: AVGO) is a technology leader that designs, develops, and supplies semiconductors and infrastructure software for global organizations’ complex, mission-critical needs. Broadcom combines long-term R&D investment with superb execution to deliver the best technology, at scale. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, visit [www.broadcom.com](http://www.broadcom.com/).
_Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners._
Press Contact:
Khanh Lam
Global Communications
[press.relations@broadcom.com](mailto:press.relations@broadcom.com)
Telephone: +1 408 433 8649
[](https://www.globenewswire.com/NewsRoom/AttachmentNg/2fecbd2d-d0e5-4503-969d-90632b69ed65)
Source: Broadcom Inc.
## More News Releases