MEMORY INDUSTRY INTELLIGENCE
플립 칩 언더필(봉지재) | 제품
한국어 번역·요약·분석
원문 제목: Flip Chip Underfills (encapsulants) | Product
핵심 요약
이 문서는 NAMICS의 플립 칩 언더필(절연 봉지재) 제품 페이지로, 모세관 현상을 통해 IC 칩과 기판 사이에 흘러 들어가는 재료의 특성과 응용 분야를 설명합니다. 주요 응용으로 CPU, LSI, 그래픽 장치가 언급되며, 사용자 맞춤형 제형도 제공됩니다. 8개 제품의 점도, 유리전이온도(Tg), 탄성계수, 열팽창계수(C.T.E) 데이터가 표로 제시됩니다. 관련 제품으로 고열전도성 언더필, 코너/엣지 본딩 페이스트, 칩온필름 언더필, 댐앤필 봉지재, CSP/BGA 보드 레벨 언더필이 나열됩니다. 메모리 산업과의 직접적 연결은 명시되지 않았습니다.
메모리 산업 영향 분석
이 문서는 NAMICS의 플립 칩 언더필 제품 페이지로, 메모리 산업과의 직접적 연결 근거가 부족합니다. 언더필은 CPU, LSI, 그래픽 장치 등 플립 칩 패키징에 사용되는 절연 봉지재로, HBM이나 DRAM, NAND 등 메모리 제품에 대한 언급은 없습니다. 메모리 산업 영향은 간접적일 수 있으나, 원문에서 확인되지 않으므로 분석가 가설로만 제시합니다. 관련 제품·고객, 직접 효과·계층 이동·사용량 효과·적용 범위는 원문에 근거가 없어 미확인으로 표기합니다. 반대 근거나 확인할 지표도 원문에 없습니다.
한국어 번역 읽기
수집된 원문 v1의 전체 본문 기준 · 6959자
# 플립 칩 언더필(봉지재)
플립 칩 언더필 응용 분야
## 주요 특징
플립 칩 언더필은 직접 전기적 연결을 포함하는 실장 기술에 사용되는 절연 재료입니다. 언더필은 모세관 현상에 의해 전도성 범프가 있는 IC 칩 회로와 실장 기판 사이의 간극으로 흘러 들어갑니다.
나믹스는 플립 칩 패키징의 요구에 대응하여 광범위한 제품 라인업을 개발했습니다. 대표적인 응용 분야로는 CPU, LSI, 그래픽 장치가 있습니다. 사용자 특정 응용을 위한 맞춤 제형 재료도 제공됩니다.
동영상 플레이어
[동영상 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
미디어 오류: 지원되지 않는 형식 또는 소스를 찾을 수 없음
[파일 다운로드: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[볼륨 조절에는 위아래 화살표 키를 사용하세요.](javascript:void(0);)
## 물성 데이터
이 표는 옆으로 스크롤하여 볼 수 있습니다.
| 제품 번호 | 특징 | 점도 [Pa･s] | Tg [℃] | 탄성계수 [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | 저점도; 좁은 공간용 | 10 | 135 | 6.5 | 42 |
| U8410-73C | 저유전율, 무연 범프 및 좁은 공간용 | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | 저유전율, Cu-필러 및 무연 범프 및 좁은 공간용 | 33 | 88 | 8.8 | 31 |
| U8410-99 | 저유전율, 무연 범프용 | 50 | 100 | 11 | 29 |
| U8410-302 | 저유전율, Cu-필러 및 무연 범프용 | 55 | 95 | 12 | 22 |
| U8410-377 | 저점도; 좁은 공간용 | 15 | 128 | 8.6 | 30 |
| U8439-1 | 저유전율 및 대형 IC용 | 60 | 70 | 8 | 36 |
| U8439-105 | 저유전율, 대형 IC 및 좁은 공간용 | 55 | 70 | 8.5 | 34 |
## 관련 제품
* [고열전도성 언더필(봉지재)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [코너/엣지 본딩 페이스트](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
* [댐앤필 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [CSP/BGA 보드 레벨 언더필(봉지재)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## 문의
제품에 대한 문의나 상담은 다음 페이지에서 연락해 주십시오.
[문의](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
[댐앤필 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [홈](https://www.namics.co.jp/en/)>
* [제품](https://www.namics.co.jp/en/products/)>
* [플립 칩 언더필(봉지재)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[페이지 상단](https://www.namics.co.jp/en/products/underfill-flipchip/#)
* [인사이트](https://www.namics.co.jp/en/insight/)
* [인사이트 톱](https://www.namics.co.jp/en/insight/)
* [작지만 글로벌: 유일무이, 넘버원 기술로 세계로!](https://www.namics.co.jp/en/insight/small-but-global/)
* [나믹스의 궤적, 그리고 미래로](https://www.namics.co.jp/en/insight/history/)
* [나믹스의 제품이 생활을 지원합니다](https://www.namics.co.jp/en/insight/life/)
* [나믹스의 글로벌 확장](https://www.namics.co.jp/en/insight/global/)
* [나믹스가 종사하는 다섯 가지 성장 분야](https://www.namics.co.jp/en/insight/research/)
* [보육 사업은 지역에 기여하고 일하는 사람들을 지원합니다](https://www.namics.co.jp/en/insight/contribution/)
* [탈탄소화를 위한 노력: SBTi 인증 및 재생 에너지 도입](https://www.namics.co.jp/en/insight/sbt/)
* [축적된 생산 기술 활용: 나믹스 스마트 농업](https://www.namics.co.jp/en/insight/agriculture/)
* [등굣길 어린이 안전을 지원하는 커뮤니티 육성](https://www.namics.co.jp/en/insight/school-safety/)
* [제품](https://www.namics.co.jp/en/products/)
* [제품 톱](https://www.namics.co.jp/en/products/)
* [제품별 검색](https://www.namics.co.jp/en/products/)
* [기능별 검색](https://www.namics.co.jp/en/products/?type=function)
* [용도별 검색](https://www.namics.co.jp/en/products/?type=use)
* [연구개발 사례](https://www.namics.co.jp/en/case/)
* [연구개발 사례 톱](https://www.namics.co.jp/en/case/)
* [최신 개발 사례](https://www.namics.co.jp/en/case/#pl1)
* [아카이브](https://www.namics.co.jp/en/case/#pl2)
* [뉴스](https://www.namics.co.jp/en/news/)
* [뉴스 톱](https://www.namics.co.jp/en/news/)
* [정보](https://www.namics.co.jp/en/news/category/information/)
* [보도자료](https://www.namics.co.jp/en/news/category/press-release/)
* [전시회](https://www.namics.co.jp/en/news/category/exibition/)
* [회사 정보](https://www.namics.co.jp/en/company/)
* [회사 정보 톱](https://www.namics.co.jp/en/company/)
* [대표이사 인사말](https://www.namics.co.jp/en/company/message/)
* [철학](https://www.namics.co.jp/en/company/philosophy/)
* [회사 개요](https://www.namics.co.jp/en/company/outline/)
* [네트워크](https://www.namics.co.jp/en/company/office/)
* [개발 접근 방식](https://www.namics.co.jp/en/company/technology/)
* [품질 접근 방식](https://www.namics.co.jp/en/company/quality/)
* [제품 내 화학물질 관리 이니셔티브](https://www.namics.co.jp/en/company/chemical/)
* [자재 공급](https://www.namics.co.jp/en/company/procurement/)
* [녹색 구매 활동](https://www.namics.co.jp/en/company/green/)
* [나믹스 동영상](https://www.namics.co.jp/en/company/movie/)
* [지속가능성](https://www.namics.co.jp/en/sustainability/)
* [지속가능성 톱](https://www.namics.co.jp/en/sustainability/)
* [SDGs 접근 방식](https://www.namics.co.jp/en/sustainability/sdgs/)
* [CSR 접근 방식](https://www.namics.co.jp/en/sustainability/csr/)
* [환경 접근 방식](https://www.namics.co.jp/en/sustainability/environment/)
* [뉴스](https://www.namics.co.jp/en/news/)
* [문의](https://www.namics.co.jp/en/contact/)
* [상표](https://www.namics.co.jp/en/trademark/)
* [개인정보 보호](https://www.namics.co.jp/en/privacy/)
* [사이트맵](https://www.namics.co.jp/en/sitemap/)
이 웹사이트 내용의 무단 사용 또는 복제는 금지됩니다.
저작권 © NAMICS CORPORATION. 모든 권리 보유.
원문
이 번역 평가
귀하의 피드백은 Google 번역 개선에 사용됩니다.
플립 칩 언더필 응용 분야
## 주요 특징
플립 칩 언더필은 직접 전기적 연결을 포함하는 실장 기술에 사용되는 절연 재료입니다. 언더필은 모세관 현상에 의해 전도성 범프가 있는 IC 칩 회로와 실장 기판 사이의 간극으로 흘러 들어갑니다.
나믹스는 플립 칩 패키징의 요구에 대응하여 광범위한 제품 라인업을 개발했습니다. 대표적인 응용 분야로는 CPU, LSI, 그래픽 장치가 있습니다. 사용자 특정 응용을 위한 맞춤 제형 재료도 제공됩니다.
동영상 플레이어
[동영상 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
미디어 오류: 지원되지 않는 형식 또는 소스를 찾을 수 없음
[파일 다운로드: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[볼륨 조절에는 위아래 화살표 키를 사용하세요.](javascript:void(0);)
## 물성 데이터
이 표는 옆으로 스크롤하여 볼 수 있습니다.
| 제품 번호 | 특징 | 점도 [Pa･s] | Tg [℃] | 탄성계수 [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | 저점도; 좁은 공간용 | 10 | 135 | 6.5 | 42 |
| U8410-73C | 저유전율, 무연 범프 및 좁은 공간용 | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | 저유전율, Cu-필러 및 무연 범프 및 좁은 공간용 | 33 | 88 | 8.8 | 31 |
| U8410-99 | 저유전율, 무연 범프용 | 50 | 100 | 11 | 29 |
| U8410-302 | 저유전율, Cu-필러 및 무연 범프용 | 55 | 95 | 12 | 22 |
| U8410-377 | 저점도; 좁은 공간용 | 15 | 128 | 8.6 | 30 |
| U8439-1 | 저유전율 및 대형 IC용 | 60 | 70 | 8 | 36 |
| U8439-105 | 저유전율, 대형 IC 및 좁은 공간용 | 55 | 70 | 8.5 | 34 |
## 관련 제품
* [고열전도성 언더필(봉지재)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [코너/엣지 본딩 페이스트](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
* [댐앤필 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [CSP/BGA 보드 레벨 언더필(봉지재)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## 문의
제품에 대한 문의나 상담은 다음 페이지에서 연락해 주십시오.
[문의](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
[댐앤필 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [홈](https://www.namics.co.jp/en/)>
* [제품](https://www.namics.co.jp/en/products/)>
* [플립 칩 언더필(봉지재)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[페이지 상단](https://www.namics.co.jp/en/products/underfill-flipchip/#)
* [인사이트](https://www.namics.co.jp/en/insight/)
* [인사이트 톱](https://www.namics.co.jp/en/insight/)
* [작지만 글로벌: 유일무이, 넘버원 기술로 세계로!](https://www.namics.co.jp/en/insight/small-but-global/)
* [나믹스의 궤적, 그리고 미래로](https://www.namics.co.jp/en/insight/history/)
* [나믹스의 제품이 생활을 지원합니다](https://www.namics.co.jp/en/insight/life/)
* [나믹스의 글로벌 확장](https://www.namics.co.jp/en/insight/global/)
* [나믹스가 종사하는 다섯 가지 성장 분야](https://www.namics.co.jp/en/insight/research/)
* [보육 사업은 지역에 기여하고 일하는 사람들을 지원합니다](https://www.namics.co.jp/en/insight/contribution/)
* [탈탄소화를 위한 노력: SBTi 인증 및 재생 에너지 도입](https://www.namics.co.jp/en/insight/sbt/)
* [축적된 생산 기술 활용: 나믹스 스마트 농업](https://www.namics.co.jp/en/insight/agriculture/)
* [등굣길 어린이 안전을 지원하는 커뮤니티 육성](https://www.namics.co.jp/en/insight/school-safety/)
* [제품](https://www.namics.co.jp/en/products/)
* [제품 톱](https://www.namics.co.jp/en/products/)
* [제품별 검색](https://www.namics.co.jp/en/products/)
* [기능별 검색](https://www.namics.co.jp/en/products/?type=function)
* [용도별 검색](https://www.namics.co.jp/en/products/?type=use)
* [연구개발 사례](https://www.namics.co.jp/en/case/)
* [연구개발 사례 톱](https://www.namics.co.jp/en/case/)
* [최신 개발 사례](https://www.namics.co.jp/en/case/#pl1)
* [아카이브](https://www.namics.co.jp/en/case/#pl2)
* [뉴스](https://www.namics.co.jp/en/news/)
* [뉴스 톱](https://www.namics.co.jp/en/news/)
* [정보](https://www.namics.co.jp/en/news/category/information/)
* [보도자료](https://www.namics.co.jp/en/news/category/press-release/)
* [전시회](https://www.namics.co.jp/en/news/category/exibition/)
* [회사 정보](https://www.namics.co.jp/en/company/)
* [회사 정보 톱](https://www.namics.co.jp/en/company/)
* [대표이사 인사말](https://www.namics.co.jp/en/company/message/)
* [철학](https://www.namics.co.jp/en/company/philosophy/)
* [회사 개요](https://www.namics.co.jp/en/company/outline/)
* [네트워크](https://www.namics.co.jp/en/company/office/)
* [개발 접근 방식](https://www.namics.co.jp/en/company/technology/)
* [품질 접근 방식](https://www.namics.co.jp/en/company/quality/)
* [제품 내 화학물질 관리 이니셔티브](https://www.namics.co.jp/en/company/chemical/)
* [자재 공급](https://www.namics.co.jp/en/company/procurement/)
* [녹색 구매 활동](https://www.namics.co.jp/en/company/green/)
* [나믹스 동영상](https://www.namics.co.jp/en/company/movie/)
* [지속가능성](https://www.namics.co.jp/en/sustainability/)
* [지속가능성 톱](https://www.namics.co.jp/en/sustainability/)
* [SDGs 접근 방식](https://www.namics.co.jp/en/sustainability/sdgs/)
* [CSR 접근 방식](https://www.namics.co.jp/en/sustainability/csr/)
* [환경 접근 방식](https://www.namics.co.jp/en/sustainability/environment/)
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원문
이 번역 평가
귀하의 피드백은 Google 번역 개선에 사용됩니다.
브리프용 요약 초안
NAMICS가 플립 칩 언더필 제품 라인업과 물성 데이터를 공개했습니다. 이는 CPU, LSI, 그래픽 장치 등 플립 칩 패키징용 절연 봉지재로, 메모리 산업과의 직접적 연결은 확인되지 않습니다. 메모리 산업 영향 분석은 추가 정보 없이는 어렵습니다.
원문 텍스트
원문 열기 ↗# Flip Chip Underfills (encapsulants)
Flip Chip Underfill applications
## Key Features
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. Underfill flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.
Namics has developed an extensive lineup of products in response to the demands towards of flip chip packaging. Some typical applications include CPU, LSI, and Graphic Devices. Custom formulated materials are also available for user specific applications.
動画プレーヤー
[Video 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
Media error: Format(s) not supported or source(s) not found
[ファイルをダウンロード: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[ボリューム調節には上下矢印キーを使ってください。](javascript:void(0);)
## Property Data
You can view this table by scrolling sideways.
| Product Number | Characteristics | Viscosity [Pa･s] | Tg [℃] | Modulus of Elasticity [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | Low viscosity; for tight spaces | 10 | 135 | 6.5 | 42 |
| U8410-73C | For low K, Pb-free bumps and tight spaces | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | For low-K, Cu-pillar and Pb-free bumps and tight spaces | 33 | 88 | 8.8 | 31 |
| U8410-99 | For low-K, Pb-free bumps | 50 | 100 | 11 | 29 |
| U8410-302 | For low-K, Cu-pillar and Pb-free bumps | 55 | 95 | 12 | 22 |
| U8410-377 | Low viscosity; for tight spaces | 15 | 128 | 8.6 | 30 |
| U8439-1 | For low K and large ICs | 60 | 70 | 8 | 36 |
| U8439-105 | For low K, large ICs and tight spaces | 55 | 70 | 8.5 | 34 |
## Related Products
* [ High Thermal-conductivity Underfills (encapsulants)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [ Corner / Edge Bonding Pastes](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [ Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
* [ Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [ CSP/BGA Board Level Underfills (encapsulants)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.
[Inquiry](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
[Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [Home](https://www.namics.co.jp/en/)>
* [Product](https://www.namics.co.jp/en/products/)>
* [Flip Chip Underfills (encapsulants)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[PAGE TOP](https://www.namics.co.jp/en/products/underfill-flipchip/#)
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* [NAMICS' products support living](https://www.namics.co.jp/en/insight/life/)
* [The global expansion of NAMICS](https://www.namics.co.jp/en/insight/global/)
* [Five growth areas the development of which NAMICS is engaged in](https://www.namics.co.jp/en/insight/research/)
* [Daycare business contributes to the region and supports working people](https://www.namics.co.jp/en/insight/contribution/)
* [Efforts Toward Decarbonization SBTi Certification and Adoption of Renewable Energy](https://www.namics.co.jp/en/insight/sbt/)
* [Leveraging Our Cultivated Production Technologies NAMICS Smart Agriculture](https://www.namics.co.jp/en/insight/agriculture/)
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Unauthorized use or reproduction of the content of
this website is prohibited.
Copyright © NAMICS CORPORATION. All Rights Reserved.
Original text
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Flip Chip Underfill applications
## Key Features
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. Underfill flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.
Namics has developed an extensive lineup of products in response to the demands towards of flip chip packaging. Some typical applications include CPU, LSI, and Graphic Devices. Custom formulated materials are also available for user specific applications.
動画プレーヤー
[Video 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
Media error: Format(s) not supported or source(s) not found
[ファイルをダウンロード: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[ボリューム調節には上下矢印キーを使ってください。](javascript:void(0);)
## Property Data
You can view this table by scrolling sideways.
| Product Number | Characteristics | Viscosity [Pa･s] | Tg [℃] | Modulus of Elasticity [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | Low viscosity; for tight spaces | 10 | 135 | 6.5 | 42 |
| U8410-73C | For low K, Pb-free bumps and tight spaces | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | For low-K, Cu-pillar and Pb-free bumps and tight spaces | 33 | 88 | 8.8 | 31 |
| U8410-99 | For low-K, Pb-free bumps | 50 | 100 | 11 | 29 |
| U8410-302 | For low-K, Cu-pillar and Pb-free bumps | 55 | 95 | 12 | 22 |
| U8410-377 | Low viscosity; for tight spaces | 15 | 128 | 8.6 | 30 |
| U8439-1 | For low K and large ICs | 60 | 70 | 8 | 36 |
| U8439-105 | For low K, large ICs and tight spaces | 55 | 70 | 8.5 | 34 |
## Related Products
* [ High Thermal-conductivity Underfills (encapsulants)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [ Corner / Edge Bonding Pastes](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [ Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
* [ Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [ CSP/BGA Board Level Underfills (encapsulants)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.
[Inquiry](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
[Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [Home](https://www.namics.co.jp/en/)>
* [Product](https://www.namics.co.jp/en/products/)>
* [Flip Chip Underfills (encapsulants)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[PAGE TOP](https://www.namics.co.jp/en/products/underfill-flipchip/#)
* [INSIGHT](https://www.namics.co.jp/en/insight/)
* [INSIGHT top](https://www.namics.co.jp/en/insight/)
* [Small but Global : To the world with technology that is Only one, Number one!](https://www.namics.co.jp/en/insight/small-but-global/)
* [Trajectory of NAMICS, and to the future](https://www.namics.co.jp/en/insight/history/)
* [NAMICS' products support living](https://www.namics.co.jp/en/insight/life/)
* [The global expansion of NAMICS](https://www.namics.co.jp/en/insight/global/)
* [Five growth areas the development of which NAMICS is engaged in](https://www.namics.co.jp/en/insight/research/)
* [Daycare business contributes to the region and supports working people](https://www.namics.co.jp/en/insight/contribution/)
* [Efforts Toward Decarbonization SBTi Certification and Adoption of Renewable Energy](https://www.namics.co.jp/en/insight/sbt/)
* [Leveraging Our Cultivated Production Technologies NAMICS Smart Agriculture](https://www.namics.co.jp/en/insight/agriculture/)
* [Fostering a Community that Supports the Safety of Children on Their Way to School](https://www.namics.co.jp/en/insight/school-safety/)
* [Product](https://www.namics.co.jp/en/products/)
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* [R&D Example Cases](https://www.namics.co.jp/en/case/)
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* [Latest Development Example](https://www.namics.co.jp/en/case/#pl1)
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* [News](https://www.namics.co.jp/en/news/)
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* [Information](https://www.namics.co.jp/en/news/category/information/)
* [Press Release](https://www.namics.co.jp/en/news/category/press-release/)
* [Exibition](https://www.namics.co.jp/en/news/category/exibition/)
* [Company Info](https://www.namics.co.jp/en/company/)
* [Company Info top](https://www.namics.co.jp/en/company/)
* [Greetings from the President](https://www.namics.co.jp/en/company/message/)
* [Philosophy](https://www.namics.co.jp/en/company/philosophy/)
* [Company Profile](https://www.namics.co.jp/en/company/outline/)
* [Network](https://www.namics.co.jp/en/company/office/)
* [Development Approach](https://www.namics.co.jp/en/company/technology/)
* [Quality Approach](https://www.namics.co.jp/en/company/quality/)
* [Initiatives for the Management of Chemicals in Products](https://www.namics.co.jp/en/company/chemical/)
* [Materials Supply](https://www.namics.co.jp/en/company/procurement/)
* [Green Procurement Activities](https://www.namics.co.jp/en/company/green/)
* [NAMICS Video](https://www.namics.co.jp/en/company/movie/)
* [Sustainability](https://www.namics.co.jp/en/sustainability/)
* [Sustainability top](https://www.namics.co.jp/en/sustainability/)
* [SDGs Approach](https://www.namics.co.jp/en/sustainability/sdgs/)
* [CSR Approach](https://www.namics.co.jp/en/sustainability/csr/)
* [Environment Approach](https://www.namics.co.jp/en/sustainability/environment/)
* [News](https://www.namics.co.jp/en/news/)
* [Inquiry](https://www.namics.co.jp/en/contact/)
* [Our Trademarks](https://www.namics.co.jp/en/trademark/)
* [Personal Information Protection](https://www.namics.co.jp/en/privacy/)
* [Site Map](https://www.namics.co.jp/en/sitemap/)
Unauthorized use or reproduction of the content of
this website is prohibited.
Copyright © NAMICS CORPORATION. All Rights Reserved.
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