MEMORY INDUSTRY INTELLIGENCE
플립칩 언더필(봉지재) | 제품
한국어 번역·요약·분석
원문 제목: Flip Chip Underfills (encapsulants) | Product
핵심 요약
이 문서는 NAMICS의 플립칩 언더필(encapsulants) 제품 페이지로, 언더필이 전도성 범프가 있는 IC 칩 회로와 실장 기판 사이의 갭에 모세관 현상으로 흘러 들어가는 절연 재료라고 설명합니다. NAMICS는 플립칩 패키징 수요에 대응해 CPU, LSI, 그래픽 디바이스 등 전형적 응용을 포함한 광범위한 제품 라인업을 개발했으며 사용자 특정 응용을 위한 맞춤형 재료도 제공합니다. 제품 특성 표에는 U8443-14, U8410-73C, U8410-73CF3, U8410-99, U8410-302, U8410-377, U8439-1, U8439-105 등 8개 제품의 점도(Pa·s), Tg(℃), 탄성계수(GPa), C.T.E ≦Tg(ppm) 수치가 제시되어 있습니다. 관련 제품으로 고열전도성 언더필, 코너/엣지 본딩 페이스트, 칩온필름 언더필, Dam-and-Fill 봉지재, CSP/BGA 보드 레벨 언더필이 나열되어 있습니다. 이 문서는 메모리 산업, HBM, DRAM, NAND 등 특정 메모리 제품이나 고객사와의 거래 관계를 언급하지 않습니다.
메모리 산업 영향 분석
이 문서는 NAMICS의 플립칩 언더필 제품 페이지로, 메모리 산업과의 직접 연결 근거가 부족합니다. 언더필은 CPU, LSI, 그래픽 디바이스 등 플립칩 패키징 응용을 대상으로 하며, HBM·DRAM·NAND 등 메모리 제품이나 고객사와의 거래 관계는 원문에 언급되지 않았습니다. 분석가 가설로는 HBM 적층 패키징에 언더필이 사용될 수 있다는 가능성이 있으나, 원문은 이를 확인하지 않으므로 미확인입니다. 확인할 지표로는 NAMICS의 메모리 고객사 채택 여부, HBM 패키징 공정에서의 언더필 사용량, 관련 제품 매출 비중 등이 있으나 원문에서 확인되지 않습니다.
한국어 번역 읽기
수집된 원문 v2의 전체 본문 기준 · 6858자
# 플립칩 언더필(봉지재)
플립칩 언더필 응용
## 주요 특징
플립칩 언더필은 직접 전기 연결을 수반하는 실장 기술에 사용되는 절연 재료입니다. 언더필은 모세관 현상에 의해 전도성 범프가 있는 IC 칩 회로와 실장 기판 사이의 갭으로 흘러 들어갑니다.
Namics는 플립칩 패키징에 대한 요구에 대응하여 광범위한 제품 라인업을 개발했습니다. 전형적인 응용으로는 CPU, LSI, 그래픽 디바이스 등이 있습니다. 사용자 특정 응용을 위한 맞춤형 배합 재료도 제공됩니다.
동영상 플레이어
[Video 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
미디어 오류: 지원되지 않는 형식 또는 소스를 찾을 수 없음
[파일 다운로드: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[볼륨 조절에는 위아래 화살표 키를 사용하세요.](javascript:void(0);)
## 물성 데이터
이 표는 옆으로 스크롤하여 볼 수 있습니다.
| 제품 번호 | 특성 | 점도 [Pa･s] | Tg [℃] | 탄성계수 [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | 저점도; 좁은 공간용 | 10 | 135 | 6.5 | 42 |
| U8410-73C | 저유전율(low K), 무연 범프 및 좁은 공간용 | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | 저유전율(low-K), Cu-필러 및 무연 범프와 좁은 공간용 | 33 | 88 | 8.8 | 31 |
| U8410-99 | 저유전율(low-K), 무연 범프용 | 50 | 100 | 11 | 29 |
| U8410-302 | 저유전율(low-K), Cu-필러 및 무연 범프용 | 55 | 95 | 12 | 22 |
| U8410-377 | 저점도; 좁은 공간용 | 15 | 128 | 8.6 | 30 |
| U8439-1 | 저유전율(low K) 및 대형 IC용 | 60 | 70 | 8 | 36 |
| U8439-105 | 저유전율(low K), 대형 IC 및 좁은 공간용 | 55 | 70 | 8.5 | 34 |
## 관련 제품
* [고열전도성 언더필(봉지재)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [코너/엣지 본딩 페이스트](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
* [Dam-and-Fill 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [CSP/BGA 보드 레벨 언더필(봉지재)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## 문의
제품에 대한 문의나 상담은 다음 페이지에서 연락해 주십시오.
[문의](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
[Dam-and-Fill 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [홈](https://www.namics.co.jp/en/)>
* [제품](https://www.namics.co.jp/en/products/)>
* [플립칩 언더필(봉지재)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[페이지 상단](https://www.namics.co.jp/en/products/underfill-flipchip/#)
* [INSIGHT](https://www.namics.co.jp/en/insight/)
* [INSIGHT top](https://www.namics.co.jp/en/insight/)
* [Small but Global : To the world with technology that is Only one, Number one!](https://www.namics.co.jp/en/insight/small-but-global/)
* [Trajectory of NAMICS, and to the future](https://www.namics.co.jp/en/insight/history/)
* [NAMICS' products support living](https://www.namics.co.jp/en/insight/life/)
* [The global expansion of NAMICS](https://www.namics.co.jp/en/insight/global/)
* [Five growth areas the development of which NAMICS is engaged in](https://www.namics.co.jp/en/insight/research/)
* [Daycare business contributes to the region and supports working people](https://www.namics.co.jp/en/insight/contribution/)
* [Efforts Toward Decarbonization SBTi Certification and Adoption of Renewable Energy](https://www.namics.co.jp/en/insight/sbt/)
* [Leveraging Our Cultivated Production Technologies NAMICS Smart Agriculture](https://www.namics.co.jp/en/insight/agriculture/)
* [Fostering a Community that Supports the Safety of Children on Their Way to School](https://www.namics.co.jp/en/insight/school-safety/)
* [제품](https://www.namics.co.jp/en/products/)
* [제품 top](https://www.namics.co.jp/en/products/)
* [제품별 검색](https://www.namics.co.jp/en/products/)
* [기능별 검색](https://www.namics.co.jp/en/products/?type=function)
* [용도별 검색](https://www.namics.co.jp/en/products/?type=use)
* [R&D 사례](https://www.namics.co.jp/en/case/)
* [R&D 사례 top](https://www.namics.co.jp/en/case/)
* [최신 개발 사례](https://www.namics.co.jp/en/case/#pl1)
* [아카이브](https://www.namics.co.jp/en/case/#pl2)
* [뉴스](https://www.namics.co.jp/en/news/)
* [뉴스 top](https://www.namics.co.jp/en/news/)
* [정보](https://www.namics.co.jp/en/news/category/information/)
* [보도자료](https://www.namics.co.jp/en/news/category/press-release/)
* [전시](https://www.namics.co.jp/en/news/category/exibition/)
* [회사 정보](https://www.namics.co.jp/en/company/)
* [회사 정보 top](https://www.namics.co.jp/en/company/)
* [대표이사 인사말](https://www.namics.co.jp/en/company/message/)
* [철학](https://www.namics.co.jp/en/company/philosophy/)
* [회사 개요](https://www.namics.co.jp/en/company/outline/)
* [네트워크](https://www.namics.co.jp/en/company/office/)
* [개발 접근법](https://www.namics.co.jp/en/company/technology/)
* [품질 접근법](https://www.namics.co.jp/en/company/quality/)
* [제품 내 화학물질 관리 이니셔티브](https://www.namics.co.jp/en/company/chemical/)
* [재료 공급](https://www.namics.co.jp/en/company/procurement/)
* [그린 조달 활동](https://www.namics.co.jp/en/company/green/)
* [NAMICS 비디오](https://www.namics.co.jp/en/company/movie/)
* [지속가능성](https://www.namics.co.jp/en/sustainability/)
* [지속가능성 top](https://www.namics.co.jp/en/sustainability/)
* [SDGs 접근법](https://www.namics.co.jp/en/sustainability/sdgs/)
* [CSR 접근법](https://www.namics.co.jp/en/sustainability/csr/)
* [환경 접근법](https://www.namics.co.jp/en/sustainability/environment/)
* [뉴스](https://www.namics.co.jp/en/news/)
* [문의](https://www.namics.co.jp/en/contact/)
* [당사 상표](https://www.namics.co.jp/en/trademark/)
* [개인정보 보호](https://www.namics.co.jp/en/privacy/)
* [사이트맵](https://www.namics.co.jp/en/sitemap/)
이 웹사이트 내용의 무단 사용 또는 복제는 금지됩니다.
Copyright © NAMICS CORPORATION. All Rights Reserved.
플립칩 언더필 응용
## 주요 특징
플립칩 언더필은 직접 전기 연결을 수반하는 실장 기술에 사용되는 절연 재료입니다. 언더필은 모세관 현상에 의해 전도성 범프가 있는 IC 칩 회로와 실장 기판 사이의 갭으로 흘러 들어갑니다.
Namics는 플립칩 패키징에 대한 요구에 대응하여 광범위한 제품 라인업을 개발했습니다. 전형적인 응용으로는 CPU, LSI, 그래픽 디바이스 등이 있습니다. 사용자 특정 응용을 위한 맞춤형 배합 재료도 제공됩니다.
동영상 플레이어
[Video 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
미디어 오류: 지원되지 않는 형식 또는 소스를 찾을 수 없음
[파일 다운로드: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[볼륨 조절에는 위아래 화살표 키를 사용하세요.](javascript:void(0);)
## 물성 데이터
이 표는 옆으로 스크롤하여 볼 수 있습니다.
| 제품 번호 | 특성 | 점도 [Pa･s] | Tg [℃] | 탄성계수 [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | 저점도; 좁은 공간용 | 10 | 135 | 6.5 | 42 |
| U8410-73C | 저유전율(low K), 무연 범프 및 좁은 공간용 | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | 저유전율(low-K), Cu-필러 및 무연 범프와 좁은 공간용 | 33 | 88 | 8.8 | 31 |
| U8410-99 | 저유전율(low-K), 무연 범프용 | 50 | 100 | 11 | 29 |
| U8410-302 | 저유전율(low-K), Cu-필러 및 무연 범프용 | 55 | 95 | 12 | 22 |
| U8410-377 | 저점도; 좁은 공간용 | 15 | 128 | 8.6 | 30 |
| U8439-1 | 저유전율(low K) 및 대형 IC용 | 60 | 70 | 8 | 36 |
| U8439-105 | 저유전율(low K), 대형 IC 및 좁은 공간용 | 55 | 70 | 8.5 | 34 |
## 관련 제품
* [고열전도성 언더필(봉지재)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [코너/엣지 본딩 페이스트](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
* [Dam-and-Fill 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [CSP/BGA 보드 레벨 언더필(봉지재)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## 문의
제품에 대한 문의나 상담은 다음 페이지에서 연락해 주십시오.
[문의](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[칩온필름 언더필(봉지재)](https://www.namics.co.jp/en/products/chip-on-film/)
[Dam-and-Fill 봉지재](https://www.namics.co.jp/en/products/dam-and-fill/)
* [홈](https://www.namics.co.jp/en/)>
* [제품](https://www.namics.co.jp/en/products/)>
* [플립칩 언더필(봉지재)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[페이지 상단](https://www.namics.co.jp/en/products/underfill-flipchip/#)
* [INSIGHT](https://www.namics.co.jp/en/insight/)
* [INSIGHT top](https://www.namics.co.jp/en/insight/)
* [Small but Global : To the world with technology that is Only one, Number one!](https://www.namics.co.jp/en/insight/small-but-global/)
* [Trajectory of NAMICS, and to the future](https://www.namics.co.jp/en/insight/history/)
* [NAMICS' products support living](https://www.namics.co.jp/en/insight/life/)
* [The global expansion of NAMICS](https://www.namics.co.jp/en/insight/global/)
* [Five growth areas the development of which NAMICS is engaged in](https://www.namics.co.jp/en/insight/research/)
* [Daycare business contributes to the region and supports working people](https://www.namics.co.jp/en/insight/contribution/)
* [Efforts Toward Decarbonization SBTi Certification and Adoption of Renewable Energy](https://www.namics.co.jp/en/insight/sbt/)
* [Leveraging Our Cultivated Production Technologies NAMICS Smart Agriculture](https://www.namics.co.jp/en/insight/agriculture/)
* [Fostering a Community that Supports the Safety of Children on Their Way to School](https://www.namics.co.jp/en/insight/school-safety/)
* [제품](https://www.namics.co.jp/en/products/)
* [제품 top](https://www.namics.co.jp/en/products/)
* [제품별 검색](https://www.namics.co.jp/en/products/)
* [기능별 검색](https://www.namics.co.jp/en/products/?type=function)
* [용도별 검색](https://www.namics.co.jp/en/products/?type=use)
* [R&D 사례](https://www.namics.co.jp/en/case/)
* [R&D 사례 top](https://www.namics.co.jp/en/case/)
* [최신 개발 사례](https://www.namics.co.jp/en/case/#pl1)
* [아카이브](https://www.namics.co.jp/en/case/#pl2)
* [뉴스](https://www.namics.co.jp/en/news/)
* [뉴스 top](https://www.namics.co.jp/en/news/)
* [정보](https://www.namics.co.jp/en/news/category/information/)
* [보도자료](https://www.namics.co.jp/en/news/category/press-release/)
* [전시](https://www.namics.co.jp/en/news/category/exibition/)
* [회사 정보](https://www.namics.co.jp/en/company/)
* [회사 정보 top](https://www.namics.co.jp/en/company/)
* [대표이사 인사말](https://www.namics.co.jp/en/company/message/)
* [철학](https://www.namics.co.jp/en/company/philosophy/)
* [회사 개요](https://www.namics.co.jp/en/company/outline/)
* [네트워크](https://www.namics.co.jp/en/company/office/)
* [개발 접근법](https://www.namics.co.jp/en/company/technology/)
* [품질 접근법](https://www.namics.co.jp/en/company/quality/)
* [제품 내 화학물질 관리 이니셔티브](https://www.namics.co.jp/en/company/chemical/)
* [재료 공급](https://www.namics.co.jp/en/company/procurement/)
* [그린 조달 활동](https://www.namics.co.jp/en/company/green/)
* [NAMICS 비디오](https://www.namics.co.jp/en/company/movie/)
* [지속가능성](https://www.namics.co.jp/en/sustainability/)
* [지속가능성 top](https://www.namics.co.jp/en/sustainability/)
* [SDGs 접근법](https://www.namics.co.jp/en/sustainability/sdgs/)
* [CSR 접근법](https://www.namics.co.jp/en/sustainability/csr/)
* [환경 접근법](https://www.namics.co.jp/en/sustainability/environment/)
* [뉴스](https://www.namics.co.jp/en/news/)
* [문의](https://www.namics.co.jp/en/contact/)
* [당사 상표](https://www.namics.co.jp/en/trademark/)
* [개인정보 보호](https://www.namics.co.jp/en/privacy/)
* [사이트맵](https://www.namics.co.jp/en/sitemap/)
이 웹사이트 내용의 무단 사용 또는 복제는 금지됩니다.
Copyright © NAMICS CORPORATION. All Rights Reserved.
브리프용 요약 초안
NAMICS가 플립칩 언더필 제품 라인업과 물성 데이터를 공개했습니다. 언더필은 CPU, LSI, 그래픽 디바이스 등 플립칩 패키징에 사용되는 절연 재료입니다. 메모리 산업과의 직접 연결은 원문에서 확인되지 않습니다.
원문 텍스트
원문 열기 ↗# Flip Chip Underfills (encapsulants)
Flip Chip Underfill applications
## Key Features
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. Underfill flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.
Namics has developed an extensive lineup of products in response to the demands towards of flip chip packaging. Some typical applications include CPU, LSI, and Graphic Devices. Custom formulated materials are also available for user specific applications.
動画プレーヤー
[Video 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
Media error: Format(s) not supported or source(s) not found
[ファイルをダウンロード: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[ボリューム調節には上下矢印キーを使ってください。](javascript:void(0);)
## Property Data
You can view this table by scrolling sideways.
| Product Number | Characteristics | Viscosity [Pa･s] | Tg [℃] | Modulus of Elasticity [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | Low viscosity; for tight spaces | 10 | 135 | 6.5 | 42 |
| U8410-73C | For low K, Pb-free bumps and tight spaces | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | For low-K, Cu-pillar and Pb-free bumps and tight spaces | 33 | 88 | 8.8 | 31 |
| U8410-99 | For low-K, Pb-free bumps | 50 | 100 | 11 | 29 |
| U8410-302 | For low-K, Cu-pillar and Pb-free bumps | 55 | 95 | 12 | 22 |
| U8410-377 | Low viscosity; for tight spaces | 15 | 128 | 8.6 | 30 |
| U8439-1 | For low K and large ICs | 60 | 70 | 8 | 36 |
| U8439-105 | For low K, large ICs and tight spaces | 55 | 70 | 8.5 | 34 |
## Related Products
* [ High Thermal-conductivity Underfills (encapsulants)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [ Corner / Edge Bonding Pastes](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [ Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
* [ Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [ CSP/BGA Board Level Underfills (encapsulants)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.
[Inquiry](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
[Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [Home](https://www.namics.co.jp/en/)>
* [Product](https://www.namics.co.jp/en/products/)>
* [Flip Chip Underfills (encapsulants)](https://www.namics.co.jp/en/products/underfill-flipchip/)
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Unauthorized use or reproduction of the content of
this website is prohibited.
Copyright © NAMICS CORPORATION. All Rights Reserved.
Flip Chip Underfill applications
## Key Features
Flip Chip Underfill is an insulating material used in mounting technologies involving direct electrical connections. Underfill flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.
Namics has developed an extensive lineup of products in response to the demands towards of flip chip packaging. Some typical applications include CPU, LSI, and Graphic Devices. Custom formulated materials are also available for user specific applications.
動画プレーヤー
[Video 2](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
Media error: Format(s) not supported or source(s) not found
[ファイルをダウンロード: https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1](https://www.namics.co.jp/en/wp-content/uploads/sites/2/2018/12/m_chipcoat01.mp4?_=1)
00:00
00:00
00:00
[ボリューム調節には上下矢印キーを使ってください。](javascript:void(0);)
## Property Data
You can view this table by scrolling sideways.
| Product Number | Characteristics | Viscosity [Pa･s] | Tg [℃] | Modulus of Elasticity [GPa] | C.T.E ≦Tg [ppm] |
| --- | --- | --- | --- | --- | --- |
| U8443-14 | Low viscosity; for tight spaces | 10 | 135 | 6.5 | 42 |
| U8410-73C | For low K, Pb-free bumps and tight spaces | 50 | 88 | 11.5 | 31 |
| U8410-73CF3 | For low-K, Cu-pillar and Pb-free bumps and tight spaces | 33 | 88 | 8.8 | 31 |
| U8410-99 | For low-K, Pb-free bumps | 50 | 100 | 11 | 29 |
| U8410-302 | For low-K, Cu-pillar and Pb-free bumps | 55 | 95 | 12 | 22 |
| U8410-377 | Low viscosity; for tight spaces | 15 | 128 | 8.6 | 30 |
| U8439-1 | For low K and large ICs | 60 | 70 | 8 | 36 |
| U8439-105 | For low K, large ICs and tight spaces | 55 | 70 | 8.5 | 34 |
## Related Products
* [ High Thermal-conductivity Underfills (encapsulants)](https://www.namics.co.jp/en/products/high-thermal-conductivity-underfills-encapsulants/)
* [ Corner / Edge Bonding Pastes](https://www.namics.co.jp/en/products/corner-bonding-paste/)
* [ Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
* [ Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [ CSP/BGA Board Level Underfills (encapsulants)](https://www.namics.co.jp/en/products/csp-bga-underfill-suf/)
## CONTACT
For inquiries or consultation regarding our products, please contact us on the following page.
[Inquiry](https://www.namics.co.jp/en/form/contact/?mode=21&product=624&referer=)
[Chip-on-Film Underfills (encapsulants)](https://www.namics.co.jp/en/products/chip-on-film/)
[Dam-and-Fill Encapsulants](https://www.namics.co.jp/en/products/dam-and-fill/)
* [Home](https://www.namics.co.jp/en/)>
* [Product](https://www.namics.co.jp/en/products/)>
* [Flip Chip Underfills (encapsulants)](https://www.namics.co.jp/en/products/underfill-flipchip/)
[PAGE TOP](https://www.namics.co.jp/en/products/underfill-flipchip/#)
* [INSIGHT](https://www.namics.co.jp/en/insight/)
* [INSIGHT top](https://www.namics.co.jp/en/insight/)
* [Small but Global : To the world with technology that is Only one, Number one!](https://www.namics.co.jp/en/insight/small-but-global/)
* [Trajectory of NAMICS, and to the future](https://www.namics.co.jp/en/insight/history/)
* [NAMICS' products support living](https://www.namics.co.jp/en/insight/life/)
* [The global expansion of NAMICS](https://www.namics.co.jp/en/insight/global/)
* [Five growth areas the development of which NAMICS is engaged in](https://www.namics.co.jp/en/insight/research/)
* [Daycare business contributes to the region and supports working people](https://www.namics.co.jp/en/insight/contribution/)
* [Efforts Toward Decarbonization SBTi Certification and Adoption of Renewable Energy](https://www.namics.co.jp/en/insight/sbt/)
* [Leveraging Our Cultivated Production Technologies NAMICS Smart Agriculture](https://www.namics.co.jp/en/insight/agriculture/)
* [Fostering a Community that Supports the Safety of Children on Their Way to School](https://www.namics.co.jp/en/insight/school-safety/)
* [Product](https://www.namics.co.jp/en/products/)
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* [R&D Example Cases](https://www.namics.co.jp/en/case/)
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* [Latest Development Example](https://www.namics.co.jp/en/case/#pl1)
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* [Press Release](https://www.namics.co.jp/en/news/category/press-release/)
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* [Company Info](https://www.namics.co.jp/en/company/)
* [Company Info top](https://www.namics.co.jp/en/company/)
* [Greetings from the President](https://www.namics.co.jp/en/company/message/)
* [Philosophy](https://www.namics.co.jp/en/company/philosophy/)
* [Company Profile](https://www.namics.co.jp/en/company/outline/)
* [Network](https://www.namics.co.jp/en/company/office/)
* [Development Approach](https://www.namics.co.jp/en/company/technology/)
* [Quality Approach](https://www.namics.co.jp/en/company/quality/)
* [Initiatives for the Management of Chemicals in Products](https://www.namics.co.jp/en/company/chemical/)
* [Materials Supply](https://www.namics.co.jp/en/company/procurement/)
* [Green Procurement Activities](https://www.namics.co.jp/en/company/green/)
* [NAMICS Video](https://www.namics.co.jp/en/company/movie/)
* [Sustainability](https://www.namics.co.jp/en/sustainability/)
* [Sustainability top](https://www.namics.co.jp/en/sustainability/)
* [SDGs Approach](https://www.namics.co.jp/en/sustainability/sdgs/)
* [CSR Approach](https://www.namics.co.jp/en/sustainability/csr/)
* [Environment Approach](https://www.namics.co.jp/en/sustainability/environment/)
* [News](https://www.namics.co.jp/en/news/)
* [Inquiry](https://www.namics.co.jp/en/contact/)
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* [Personal Information Protection](https://www.namics.co.jp/en/privacy/)
* [Site Map](https://www.namics.co.jp/en/sitemap/)
Unauthorized use or reproduction of the content of
this website is prohibited.
Copyright © NAMICS CORPORATION. All Rights Reserved.