Dell PowerEdge R770 기술 가이드

Dell PowerEdge R770
Technical Guide
Part Number: E111S
Regulatory Type: E111S001
June 2026
Rev. A09

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
Copyright © Dell Inc. All Rights Reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
Chapter 1: PowerEdge R770 system configurations and features ...................................................5
Key workloads ...................................................................................................................................................................... 5
New technologies ................................................................................................................................................................ 6
Chapter 2: Product comparison .....................................................................................................8
Chapter 3: Chassis views and features ......................................................................................... 11
System configurations - front view for PowerEdge R770 system ......................................................................... 11
Left Control Panel (LCP) - Secondary ....................................................................................................................17
Right Control Panel (RCP) - Primary ......................................................................................................................18
System configurations - rear view for PowerEdge R770 system .......................................................................... 19
System configurations - inside view for PowerEdge R770 system ...................................................................... 26
QR code for PowerEdge R770 system resources .....................................................................................................29
Chassis configurations ..................................................................................................................................................... 29
Chapter 4: Processor .................................................................................................................. 30
Processor features .......................................................................................................................................................... 30
Supported processors ................................................................................................................................................ 30
Chapter 5: Memory subsystem .................................................................................................... 32
Supported memory ........................................................................................................................................................... 32
System memory guidelines ..............................................................................................................................................32
CXL memory .......................................................................................................................................................................34
Chapter 6: Storage ......................................................................................................................36
Storage controllers ........................................................................................................................................................... 36
Supported Drives ...............................................................................................................................................................36
Internal storage configuration ........................................................................................................................................36
Chapter 7: NVIDIA support .......................................................................................................... 37
Chapter 8: Networking ................................................................................................................ 38
Overview ............................................................................................................................................................................. 38
OCP 3.0 support ................................................................................................................................................................38
Supported OCP cards ................................................................................................................................................ 38
OCP NIC 3.0 vs 2.0 .....................................................................................................................................................39
Chapter 9: PCIe subsystem ......................................................................................................... 40
PCIe risers ...........................................................................................................................................................................40
Chapter 10: Power, thermal, and acoustics .................................................................................. 51
Power ....................................................................................................................................................................................51
Power Supply Units ..................................................................................................................................................... 51
Contents
Contents 3
Thermal ................................................................................................................................................................................54
Thermal design .............................................................................................................................................................54
Acoustics .............................................................................................................................................................................54
Acoustical configurations of R770 .......................................................................................................................... 54
Chapter 11: Rack, rails, and cable management ............................................................................57
Rails and cable management information ....................................................................................................................57
Chapter 12: Operating Systems and Virtualization ....................................................................... 69
Supported operating system .......................................................................................................................................... 69
Chapter 13: Dell Systems Management ........................................................................................ 70
Integrated Dell Remote Access Controller (iDRAC) ................................................................................................. 70
Systems Management software support matrix ........................................................................................................ 71
Chapter 14: Appendix A: Additional specifications ........................................................................73
Chassis dimensions .......................................................................................................................................................... 73
System weight ....................................................................................................................................................................74
NIC port specifications .................................................................................................................................................... 75
Video specifications .......................................................................................................................................................... 75
USB Ports ............................................................................................................................................................................75
PSU rating ...........................................................................................................................................................................76
Environmental specifications ..........................................................................................................................................78
Particulate and gaseous contamination specifications .......................................................................................79
Thermal restriction matrix .........................................................................................................................................80
Chapter 15: Appendix B. Standards compliance .......................................................................... 101
Chapter 16: Appendix C: Additional resources ............................................................................ 102
Chapter 17: Appendix D: Service and support ............................................................................. 103
Why attach service contracts ...................................................................................................................................... 103
ProSupport Infrastructure Suite .................................................................................................................................103
Specialty Support Services ........................................................................................................................................... 105
ProDeploy Infrastructure Suite .................................................................................................................................... 106
Supplemental Deployment Services ...........................................................................................................................109
Unique Deployment Scenarios .......................................................................................................................................110
DAY 2 – Automation Services with Ansible ................................................................................................................ 111
Dell Technologies Consulting Services .........................................................................................................................111
4 Contents
PowerEdge R770 system configurations and
features
The PowerEdge R770 system is a 2U server that supports:
● Two Intel Xeon 6 processors with up to 144 E-Cores or 86 P-cores
● Optional Direct Liquid Cooling (DLC) for required CPU SKU and/or configurations
● 32 DIMM slots
● Two AC or DC power supply units
● No backplane configuration
● Up to 8x EDSFF E3.S NVMe drives FIO configuration
● Up to 16x EDSFF E3.S NVMe drives FIO configuration
● Up to 16 x EDSFF E3.S NVMe drives
● Up to 32 x EDSFF E3.S NVMe drives
● Up to 40 x EDSFF E3.S NVMe drives
● Up to 4 x EDSFF E3.S NVMe drives on the rear
● Up to 8 x 2.5-inch SATA/NVMe drives
● Up to 8 x 2.5-inch Universal drives
● Up to 16 x 2.5-inch SATA drives
● Up to 24 x 2.5 inch SATA drives
● Up to 24 x 2.5 inch SATA/NVMe (8 NVMe + 16 SATA) drives
NOTE: For more information about how to hot swap NVMe PCIe SSD device, see the Dell Express Flash NVMe PCIe SSD
User's Guide at Dell Support page > Browse all products > Infrastructure > Data Center Infrastructure >  Storage
Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Select This Product > Documentation
> Manuals and Documents .
NOTE: All instances of SAS, SATA drives are referred to as drives in this document, unless specified otherwise.
NOTE: Universal backplanes support SAS/SATA and NVMe drives. For full factory validation, systems with a Universal
backplane must be ordered with at least one SAS/SATA drive and one NVMe drive.
CAUTION: Do not install GPUs, network cards, or other PCIe devices on your system that are not validated
and tested by Dell. Damage caused by unauthorized and invalidated hardware installation will null and void the
system warranty.
Topics:
• Key workloads
• New technologies
Key workloads
The Dell PowerEdge R770 offers powerful performance in a purpose-built, cyber resilient, mainstream server. Ideal for:
● Virtualization workloads where density, power efficiency, and performance are essential.
● Artificial Intelligence workloads where the latest GPUs, NVMe storage, and I/O devices are needed to excel in high
throughput AI deployments.
● Web and Microservices such as Cloud-Native applications, Consumer Digital Services, and Application DevOps, where
flexibility, scalability, and iterative features are paramount.
● Hyperscale workloads involving massive amounts of data generated by applications such as cloud services, social media, and
large-scale analytics.
● Scale-out Database in which both high-bandwidth network and storage are needed or in routine/non-critical task that can be
managed efficiently freeing up expensive/power-hungry performance-based resources.
1
PowerEdge R770 system configurations and features 5
New technologies
Table 1. New technologies 
Technology Detailed Description
Intel Xeon 6 processors Core count: Up to 144 E-cores or 86 P-cores processor
UPI speed: 16 GT/s, 20 GT/s, 24 GT/s
Maximum number of PCIe lanes per CPU: Integrated 88 PCIe
5.0 lanes
Speeds up to 3.6 GHz
Maximum TDP: 350 W
CXL 2.0: support
NOTE: CXL 2.0 is supported only on Intel Xeon 6 P-core
processors
6400 MT/s DDR5 Memory Max 16 DIMMs per processor and 32 DIMMs per system
Supports RDIMM, DDR5 with ECC up to 6400 MT/s
PCIe Gen Gen5 @32 GT/s
PCIe Slot Up to 8x Gen5 PCIe slots and max 6 slots for x16 width
Flex I/O OCP NIC card 3.0 : 2 slots on the front (for front
I/O configuration) or 2 slots on the rear (for Rear I/O
configuration)
Rear I/O with:
● 1 x Dedicated ethernet port for iDRAC management
● 2 x USB 3.1
● 1 x VGA
Front I/O with:
● 1 x USB 2.0 Type C port
● 1 x USB 2.0 (optional)
● 1 x Mini-DisplayPort (optional)
● 1 x DB9 Serial (with front I/O configuration)
● 1 x Dedicated ethernet port for iDRAC management
Data Center Secured Control Module (DC-SCM) Dedicated ethernet port for idrac management
M-PESTI Half-duplex protocol between MCU and CPLD, the modular
sideband interface as part of the DC-MHS.
Dedicated PERC N/A
Software RAID N/A
Power Supplies The 60 mm dimension is the new PSU form factor on a 17G
design
800 W Platinum
1100 W Platinum
1500 W Titanium
800 W Titanium
1100 W Titanium
3200 W Titanium
1400 W -48VDC
6 PowerEdge R770 system configurations and features
Table 1. New technologies (continued)
Technology Detailed Description
3200 W 277Vac & HVDC Titanium
1800 W HLAC Titanium
2400 W Titanium
1500 W 277Vac & HVDC Titanium
PowerEdge R770 system configurations and features 7
Product comparison
Table 2. Comparison of PowerEdge R770 and R760 
Feature PowerEdge R770 PowerEdge R760
Processor Two Intel Xeon 6 processors, 144 E-
Cores or 86 P-cores per processor
1. Up to two 4 th Generation Intel ®
Xeon ® Scalable or Intel ® Xeon ®
Max processors, with up to 56 cores
per processor
2. Up to two 5 th Generation Intel ®
Xeon ® Scalable processors, with up
to 64 cores per processor
Chipset N/A Intel C620 series chipset
Accelerators Up to 2x double width 450 W and 6 x
single width 75 W accelerators
Up to two double width 350 W, or six
single width 75 W accelerators
Memory
DIMM speed Up to 6400 MT/s Up to 5600 MT/s
Memory type RDIMM RDIMM
Memory module slots 32 DDR5 DIMM slots 32 DDR5 DIMM slots
NOTE: Supports registered ECC
DDR5 DIMMs only.
NOTE: Supports registered ECC
DDR5 DIMMs only.
Storage
Front bays ● No backplane configuration
● Up to 8 x EDSFF E3.S NVMe max
491.52 TB.
● Up to 16 x EDSFF E3.S NVMe max
983.04 TB.
● Up to 32 x EDSFF E3.S NVMe max
1966.08 TB.
● Up to 8 x 2.5-inch NVMe max 491.52
TB.
● Up to 8 x 2.5-inch Universal max
491.52 TB.
● Up to 16 x 2.5-inch SATA max 61.44
TB.
● Up to 24 x 2.5 inch SATA max 92.16
TB.
● Up to 24 x 2.5 inch SATA/NVMe (8
NVMe + 16 SATA) max 552.96 TB.
● Up to 40 x EDSFF E3.S NVMe max
2457.6 TB.
Up to 12 x 3.5-inch SAS/SATA (HDD/
SSD)
Up to 8 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 16 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 16 x EDSFF E3.S Gen5 NVMe
(SSD)
Up to 24 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Rear bays ● Up to 4 x EDSFF E3.S NVMe max
245.76 TB.
Up to 2 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 4 x 2.5-inch SAS/SATA/NVMe
(HDD/SSD)
Up to 4 x EDSFF E3.S Gen5 NVMe
(SSD)
2
8 Product comparison
Table 2. Comparison of PowerEdge R770 and R760 (continued)
Feature PowerEdge R770 PowerEdge R760
Storage controllers
Internal controllers H965i Front DC-MHS PERC H965i
PERC H755i
PERC H755N
H365i Front DC-MHS PERC H355
H975i Front DC-MHS
NOTE: For the ESXi operating
system, H975i is supported on 9.0 or
later versions.
HBA355e
External controllers H965e H840P
HBA465e PERC H965e
Software RAID N/A S160
Internal boot Boot Optimized Storage Subsystem
(BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2
NVMe SSDs 480 GB or 960 GB or M.2
Interposer board (DC-MHS): 2 x M.2
NVMe SSDs
Boot Optimized Storage Subsystem
(BOSS-N1): HW RAID 1, 2 x M.2 NVMe
SSDs 480 GB or 960 GB
Internal USB Internal USB
System management iDRAC10, iDRAC Direct, iDRAC RESTful
API with Redfish
iDRAC with Lifecycle Controller, Quick
Sync 2.0, iDRAC Direct, OpenManage
Enterprise
Power supply 800 W Platinum 3200 W Titanium 277 VAC or 336 VDC
1100 W Platinum 2800 W Titanium 200-240 HLAC or 240
VDC1500 W Titanium
800 W Titanium
1100 W Titanium
3200 W Titanium
1400 W -48VDC
3200 W 277Vac & HVDC Titanium
1800 W HLAC Titanium
2400 W Titanium
1500 W 277Vac & HVDC Titanium
2400 W Platinum 100-240 VAC or 240
VDC
1800 W Titanium 200-240 HLAC or 240
VDC
1400 W Platinum 100-240 VAC or 240
VDC
1400 W Titanium 277 VAC or 336 VDC
1100 W Titanium 100-240 VAC or 240
VDC
1100 W -(48-60) VDC
800 W Platinum 100-240 VAC or 240
VDC
700 W Titanium 200-240 HLAC or 240
VDC
Ports
Network options OCP NIC card 3.0 : Up to 2 slots on
the front (for front I/O configuration)
or 2 slots on the rear (for rear I/O
configuration)
2 x 1GbE LOM card (optional)
1 x OCP NIC card 3.0 (optional)
Front ports 1 x USB 2.0 Type C port (supports Host
mode)
1 x Dedicated iDRAC Direct USB
Product comparison 9
Table 2. Comparison of PowerEdge R770 and R760 (continued)
Feature PowerEdge R770 PowerEdge R760
1 x USB 2.0 (optional) 2 x USB 2.0
1 x Mini-DisplayPort (optional) 1 x VGA
1 x DB9 Serial
1 x Dedicated iDRAC Ethernet port
Rear ports 1 x Dedicated iDRAC Ethernet port
1 x VGA 1 x USB 2.0
2 x USB 3.1 1 x USB 3.0
1 x Serial (optional)
1 x VGA (optional for Direct Liquid
Cooling configuration)
Internal ports 1 x USB 3.1 1 x USB 3.0 (optional)
Slots
PCIe Up to 8x Gen5 PCIe slot and max 6 slots
for x 16 width
Up to 8 x PCIe Gen4/Gen5 slots
Form factor 2U rack server 2U rack server
Dimensions and weight
Height 86.8 mm (3.41 inches) 86.8 mm (3.41 inches)
Width 482.0 mm (18.97 inches) 482.0 mm (18.97 inches)
Depth For cold aisle (front I/O configuration):
814.52 mm (32.07 inches) without bezel
NOTE: The front I/O configuration
does not support the bezel.
772.13 mm (30.39 inches) with bezel
758.29 mm (29.85 inches) without bezel
For hot aisle (rear I/O configuration):
802.40 mm (31.59 inches) with bezel
801.51 mm (31.56 inches) without bezel
Weight 28.53 kg (62.89 lb) 36.1 kg (79.58 lb)
10 Product comparison
Chassis views and features
Topics:
• System configurations - front view for PowerEdge R770 system
• System configurations - rear view for PowerEdge R770 system
• System configurations - inside view for PowerEdge R770 system
• QR code for PowerEdge R770 system resources
• Chassis configurations
System configurations - front view for PowerEdge
R770 system
Figure 1. Front view of 8 x 2.5-inch drive system
Table 3. Front view of the 8 x 2.5-inch drive system  
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive N/A Enables you to install drives that are supported on your system.
3 Drive blank. N/A Drive blank is available in eight drive configuration and should not be
removed.
4 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
5 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
3
Chassis views and features 11
Figure 2. Front view of 16 x 2.5-inch drive system
Table 4. Front view of the 16 x 2.5-inch drive system  
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive N/A Enables you to install drives that are supported on your system.
3 Drive blank. N/A Drive blank is available in 16 drive configuration and should not be
removed.
4 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
5 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
Figure 3. Front view of 24 x 2.5-inch drive system
Table 5. Front view of 24 x 2.5-inch drive system  
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive N/A Enables you to install drives that are supported on your system.
3 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
4 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
12 Chassis views and features
Figure 4. Front view of 8 x EDSFF E3.S drive system with front I/O configuration
Table 6. Front view of 8 x EDSFF E3.S drive system with front I/O configuration 
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 PCIe front expansion
card riser 1 (slot 31,
slot 32 and slot 33)
N/A The expansion card riser enables you to connect PCI Express expansion
cards.
3 Drive N/A Enables you to install drives that are supported on your system.
4 PCIe front expansion
card riser 3 (slot 35,
slot 36 and slot 37)
N/A The expansion card riser enables you to connect PCI Express expansion
cards.
5 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
6 Primary OCP NIC
(slot 38 in front riser
4)
N/A The OCP NIC slot supports the OCP 3.0 complaint networking card . The
NIC ports are integrated on the OCP card which is connected to the
system board.
NOTE: The primary OCP NIC card shares a NIC port with the
iDRAC.
7 Dedicated iDRAC
Ethernet port (part of
front riser 4)
N/A Enables you to access iDRAC port.
8 Drive blank. N/A Drive blank is available in eight drive configuration and should not be
removed.
9 Serial COM port (part
of front riser 2)
Enables you to connect a serial device to the system.
10 OCP NIC or BOSS-N1
DC-MHS (Slot 34 in
front riser 2)
N/A Enables you to install a secondary OCP or BOSS-N1 DC-MHS controller,
based on riser configuration.
NOTE: Secondary OCP does not support the shared NIC feature.
Chassis views and features 13
Figure 5. Front view of 16 x EDSFF E3.S drive system with front I/O configuration
Table 7. Front view of 16 x EDSFF E3.S drive system with front I/O configuration 
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 PCIe front expansion
card riser 1 (slot 31,
slot 32 and slot 33)
N/A The expansion card riser enables you to connect PCI Express expansion
cards.
3 Drive N/A Enables you to install drives that are supported on your system.
4 PCIe front expansion
card riser 3 (slot 35,
slot 36 and slot 37)
N/A The expansion card riser enables you to connect PCI Express expansion
cards.
5 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
6 Primary OCP NIC
(slot 38 in front riser
4)
N/A The OCP NIC slot supports the OCP 3.0 complaint networking card . The
NIC ports are integrated on the OCP card which is connected to the
system board.
NOTE: The primary OCP NIC card shares a NIC port with the
iDRAC.
7 Dedicated iDRAC
Ethernet port (part of
front riser 4)
N/A Enables you to access the iDRAC port.
8 Serial COM port (part
of front riser 2)
Enables you to connect a serial device to the system.
9 OCP NIC or BOSS-N1
DC-MHS (Slot 34 in
front riser 2)
N/A Enables you to install a secondary OCP or BOSS-N1 DC-MHS controller,
based on riser configuration.
NOTE: Secondary OCP does not support the shared NIC feature.
Figure 6. Front view of 16 x EDSFF E3.S drive system with rear I/O configuration
14 Chassis views and features
Table 8. Front view of 16 x EDSFF E3.S drive system with rear I/O configuration 
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Left control panel blank.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 PCIe front expansion
card riser 1 blank
N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser bay.
3 Drive N/A Enables you to install drives that are supported on your system.
4 PCIe front expansion
card riser 3 blank
N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser bay.
5 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
6 PCIe front expansion
card riser 4 blank
N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser bay.
7 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
8 PCIe front expansion
card riser 2 blank
N/A In the rear I/O configuration, the riser blank is installed in the expansion
card riser bay.
Figure 7. Front view of 16 x EDSFF E3.S drive system
Table 9. Front view of the 16 x EDSFF E3.S drive system 
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive N/A Enables you to install drives that are supported on your system.
3 Drive blank. N/A Drive blank is available in 16 drive configuration and should not be
removed.
4 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
5 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
Chassis views and features 15
Figure 8. Front view of 32 x EDSFF E3.S drive system
Table 10. Front view of 32 x EDSFF E3.S drive system 
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Left control panel blank.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive N/A Enables you to install drives that are supported on your system.
3 Blank Panel N/A Blank panel is available in 32 drive configuration and should not be
removed.
4 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
5 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
Figure 9. Front view of 40 x EDSFF E3.S drive system
Table 11. Front view of 40 x EDSFF E3.S drive system  
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Left control panel blank.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive N/A Enables you to install drives that are supported on your system.
3 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
4 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
16 Chassis views and features
Figure 10. Front view of no BP configuration system
Table 12. Front view of no BP configuration system 
Item Ports, panels, and
slots
Icon Description
1 Left Control Panel
(LCP) - Secondary
N/A Contains the USB port and Mini-Displayport.
NOTE: The KVM module is optional, and LCP - Secondary blank is
default in the left control panel.
2 Drive blank. N/A Drive blank is available in no BP configuration and should not be
removed.
3 Right Control Panel
(RCP) - Primary
N/A Contains the system health LED, system ID, power button, Type-C USB
port, and the host status LED.
4 Express Service Tag N/A The Express Service Tag is a slide-out label panel that contains system
information such as Service Tag, NIC, MAC address, and so on.
Left Control Panel (LCP) - Secondary
The LCP supports an optional KVM module.
The LCP is offered in two SKUs:
● Blank
● KVM module
Figure 11. Left Control Panel (LCP) - Secondary
Chassis views and features 17
Figure 12. Left Control Panel (LCP) - Secondary with optional Quick Sync 2.0
1. Quick Sync 2.0 button
Right Control Panel (RCP) - Primary
The right control panel encompasses many of the features that are no longer supported by the left control panel.
Features of the right control panel include:
● Power button with integrated power LED
● USB 2.0 Type C port
● System ID button
● Ambient temperature sensor
● Status LED for Host
NOTE: LED off when the Type C USB port is owned by Host.
● System health indicator
Figure 13. Right Control Panel (RCP) - Primary
The following table describes the system health and system ID indicators on the RCP.
Table 13. System health and system ID indicator codes 
System health and system ID
indicator code
Condition
Solid blue Indicates that the system is powered on, is healthy, and system ID mode is not active. Press
the system ID button to switch to system ID mode.
Blinking blue Indicates that the system ID mode is active. Press the system ID button to switch to system
health mode.
Blinking amber Indicates that the system is experiencing a fault. Check the System Event Log for specific
error messages at EEMI Guide
18 Chassis views and features
System configurations - rear view for PowerEdge
R770 system
Figure 14. Rear view of the system with front I/O configuration
Table 14. Rear view of the system with front I/O configuration 
Item Ports, panels, or slots Icon Description
1 PCIe expansion card riser
1 blank
N/A In front I/O configuration, the riser blank is installed in the expansion
card riser bay.
2 PCIe expansion card riser
3 blank
N/A
3 PCIe expansion card riser
5 blank
N/A
4 Power supply unit
(PSU2)
PSU2 is the secondary PSU of the system.
5 OCP NIC card filler
bracket
N/A In the front I/O configuration, an OCP filler bracket is installed in the
OCP NIC card bay.
6 BOSS filler bracket N/A In the front I/O configuration, the BOSS file bracket is installed in
BOSS-N1 DC-MHS bay.
7 SID LED N/A Rear system identification LED
8 iDRAC dedicated port
Enables you to remotely access iDRAC. When the front iDRAC port
is connected to the network, the rear iDRAC port is automatically
disabled.
9 2x USB 3.1 ports
The USB port is 9-pin and 3.0-compliant. This port enables you to
connect USB devices to the system.
10 VGA port
Enables you to connect a display device to the system.
11 Power supply unit (PSU1)
PSU1 is the primary PSU of the system.
Figure 15. Rear view of the system with rear I/O configuration
Chassis views and features 19
Table 15. Rear view of the system with rear I/O configuration 
items Ports, panels, or slots Icon Description
1 PCIe expansion card riser 1
(slot 1)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
2 PCIe expansion card riser 1
(slot 2)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
3 PCIe expansion card riser 2
(slot 3)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
4 PCIe expansion card riser 3
(slot 5)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
5 OCP NIC card (slot 4 in PCIe
expansion card riser 3)
N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
6 PCIe expansion card riser 4
(slot 9)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
7 PCIe expansion card riser 5
(slot 7)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
8 PCIe expansion card riser 5
(slot 8)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
9 Power supply unit (PSU2)
PSU2 is the secondary PSU of
the system.
10 OCP NIC card (slot 10) N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
11 BOSS-N1 DC-MHS module
(slot 6)
N/A BOSS module for internal
system boot.
12 SID LED N/A Rear system identification
LED
13 iDRAC dedicated port
Enables you to remotely
access iDRAC. When the
front iDRAC port is connected
to the network, the rear
iDRAC port is automatically
disabled.
14 2x USB 3.1 ports
The USB port is 9-pin
and 3.0-compliant. This port
enables you to connect USB
devices to the system.
20 Chassis views and features
Table 15. Rear view of the system with rear I/O configuration (continued)
items Ports, panels, or slots Icon Description
15 VGA port
Enables you to connect a
display device to the system.
16 Power supply unit (PSU1)
PSU1 is the primary PSU of
the system.
Figure 16. Rear view of the system with rear I/O configuration and M.2 Interposer board
Table 16. Rear view of the system with rear I/O configuration 
items Ports, panels, or slots Icon Description
1 PCIe expansion card riser 1
(slot 1)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
2 PCIe expansion card riser 1
(slot 2)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
3 PCIe expansion card riser 2
(slot 3)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
4 PCIe expansion card riser 3
(slot 5)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
5 OCP NIC card (slot 4 in PCIe
expansion card riser 3)
N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
6 PCIe expansion card riser 4
(slot 9)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
7 PCIe expansion card riser 5
(slot 7)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
8 PCIe expansion card riser 5
(slot 8)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
9 Power supply unit (PSU2)
PSU2 is the secondary PSU of
the system.
Chassis views and features 21
Table 16. Rear view of the system with rear I/O configuration (continued)
items Ports, panels, or slots Icon Description
10 OCP NIC card (slot 10) N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
11 M.2 Interposer board N/A M.2 Interposer board for
internal system boot.
12 SID LED N/A Rear system identification
LED
13 iDRAC dedicated port
Enables you to remotely
access iDRAC. When the
front iDRAC port is connected
to the network, the rear
iDRAC port is automatically
disabled.
14 2x USB 3.1 ports
The USB port is 9-pin
and 3.0-compliant. This port
enables you to connect USB
devices to the system.
15 VGA port
Enables you to connect a
display device to the system.
16 Power supply unit (PSU1)
PSU1 is the primary PSU of
the system.
Figure 17. Rear view of the system with 4 x EDSFF E3.S rear drives
Table 17. Rear view of the system with 4 x EDSFF E3.S rear drives 
items Ports, panels, or slots Icon Description
1 Drive N/A Enables you to install drives
that are supported on your
system.
2 PCIe expansion card riser 3
(slot 4)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
3 PCIe expansion card riser 3
(slot 5)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
22 Chassis views and features
Table 17. Rear view of the system with 4 x EDSFF E3.S rear drives (continued)
items Ports, panels, or slots Icon Description
4 PCIe expansion card riser 5
(slot 7)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
5 PCIe expansion card riser 5
(slot 8)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
6 Power supply unit (PSU2)
PSU2 is the secondary PSU of
the system.
7 OCP NIC card (slot 10) N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
8 PCIe expansion card riser 4
(slot 9)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
9 BOSS-N1 DC-MHS module
(slot 6)
N/A BOSS module for internal
system boot.
10 PCIe expansion card riser 2
blank
N/A The riser blank is installed in
the expansion card riser bay.
11 SID LED N/A Rear system identification
LED
12 iDRAC dedicated port
Enables you to remotely
access iDRAC. When the
front iDRAC port is connected
to the network, the rear
iDRAC port is automatically
disabled.
13 2x USB 3.1 ports
The USB port is 9-pin
and 3.0-compliant. This port
enables you to connect USB
devices to the system.
14 VGA port
Enables you to connect a
display device to the system.
15 PCIe expansion card riser 2
(slot 3)
N/A Enables you to connect a
display device to the system.
16 Power supply unit (PSU1)
PSU1 is the primary PSU of
the system.
Chassis views and features 23
Figure 18. Rear view of the liquid cooling configuration
Table 18. Rear view of the liquid cooling configuration 
items Ports, panels, or slots Icon Description
1 PCIe expansion card riser 1
(slot 1)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
2 PCIe expansion card riser 1
(slot 2)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
3 PCIe expansion card riser 3
(slot 5)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
4 OCP NIC card (slot 4 in PCIe
expansion card riser 3)
N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
5 PCIe expansion card riser 5
(slot 7)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
6 PCIe expansion card riser 5
(slot 8)
N/A The expansion card riser
enables you to connect PCI
Express expansion cards.
7 Power supply unit (PSU2)
PSU2 is the secondary PSU of
the system.
8 OCP NIC card (slot 10) N/A The OCP NIC card supports
OCP 3.0. The NIC ports
are integrated on the OCP
card which is connected to
the system board and also
supports the iDRAC shared
NIC feature.
9 PCIe expansion card riser 4
blank
N/A The liquid cooling blank is
installed in the expansion card
riser bay.
10 BOSS-N1 DC-MHS module
(slot 6)
N/A BOSS module for internal
system boot.
11 Liquid cooling module tubes N/A Cold coolant flows into the
system from one tube and
hot coolant leaves the system
from another tube.
24 Chassis views and features
Table 18. Rear view of the liquid cooling configuration (continued)
items Ports, panels, or slots Icon Description
12 SID LED N/A Rear system identification
LED
13 iDRAC dedicated port
Enables you to remotely
access iDRAC. When the
front iDRAC port is connected
to the network, the rear
iDRAC port is automatically
disabled.
14 2x USB 3.1 ports
The USB port is 9-pin
and 3.0-compliant. This port
enables you to connect USB
devices to the system.
15 VGA port
Enables you to connect a
display device to the system.
16 Power supply unit (PSU1)
PSU1 is the primary PSU of
the system.
Chassis views and features 25
System configurations - inside view for PowerEdge
R770 system
Figure 19. Inside the system with front I/O configuration
1. System handle 2. Rear riser 1 blank
3. Rear riser 3 blank 4. Power supply unit (PSU1)
5. System board or Host Processor Module (HPM) 6. Dust cover for processor 1
7. Memory module slots (DIMM) 8. Cooling cage cable holder
9. Cooling fan 10. Front riser 3
11. Express Service Tag 12. Front riser 1
13. E3.S backplane module 14. Cooling fan cage
15. Dust cover for processor 0 16. Power supply unit (PSU2)
17. Rear riser 2 and riser 4 blank 18. Rear riser 5 blank
26 Chassis views and features
Figure 20. Inside the system with rear I/O configuration
1. System handle 2. Rear riser 2
3. Rear riser 1 4. Power supply unit (PSU1)
5. System board or Host Processor Module (HPM) 6. Processor heat sink module for processor 1
7. Memory module slots (DIMM) 8. Cooling cage cable holder
9. Cooling fan 10. Express Service Tag
11. E3.S backplane module 12. Cooling fan cage
13. Processor heat sink module for processor 0 14. Power supply unit (PSU2)
15. Rear riser 3 16. Rear riser 5
Chassis views and features 27
Figure 21. Inside the system with processor liquid cooling module
1. System handle 2. Rear riser 1 blank
3. Rear riser 3 blank 4. Power supply unit (PSU1)
5. System board or Host Processor Module (HPM) 6. Processor liquid cooling module
7. Memory module slots (DIMM) 8. Cooling cage cable holder
9. Cooling fan 10. Front riser 3
11. Express Service Tag 12. Front riser 1
13. E3.S backplane module 14. Cooling fan cage
15. Power supply unit (PSU2) 16. DLC blank
17. Rear riser 5 blank
28 Chassis views and features
QR code for PowerEdge R770 system resources
Figure 22. QR code for PowerEdge R770 system
Chassis configurations
The PowerEdge ™R770 system supports:
● No backplane configuration
● Up to 8 x EDSFF E3.S NVMe drives FIO configuration
● Up to 16 x EDSFF E3.S NVMe drives FIO configuration
● Up to 16 x EDSFF E3.S NVMe drives
● Up to 32 x EDSFF E3.S NVMe drives
● Up to 40 x EDSFF E3.S NVMe drives
● Up to 4 x EDSFF E3.S NVMe drives on the rear
● Up to 8 x 2.5-inch SATA/NVMe drives
● Up to 8 x 2.5-inch Universal drives
● Up to 16 x 2.5-inch SATA drives
● Up to 24 x 2.5 inch SATA drives
● Up to 24 x 2.5 inch SATA/NVMe (8 NVMe + 16 SATA) drives
Chassis views and features 29
Processor
Topics:
• Processor features
Processor features
The Intel ® Xeon ® 6 series processor stack is comprised entirely of efficiency cores (E-Cores) providing ultra-high core counts
optimized for Cloud Service Providers and HPC server applications. Intel ® Xeon ® 6700E offers improved performance per
watt, boosted performance per rack, upgraded memory speeds, enhanced I/O, expanded UPI speeds and added software
extension security.
The following lists the features and functions that are in the Intel ® Xeon ® 6700E Processor offering:
● High core counts with up to 144 cores with up to 330 W TDP
● Enhanced DDR5 memory with speed up to 6400 MT/s in one DIMM per channel (1DPC) and 5200 MT/s in two DIMM per
channel (2DPC)
● Faster UPI 2.0 with up to four Intel Ultra Path Interconnect (Intel ® UPI) at up to 24 GT/s, increasing multi-socket
bandwidth
● PCIe 5.0 with up to 88 lanes
● Security features leveraging Software Guard Extensions (SGX) for Application Isolation
Supported processors
The following table shows the Intel Xeon 6 processors SKUs that are supported on the R770 .
Table 19. Intel ® Xeon ® 6 processors supported in R770 - E-Core 
Processor Clock
Speed
(GHz)
Cache
(M)
UPI
(GT/s)
Cores Threads Turbo Memory
Speed
(MT/s)
Memory
Capacity
TDP
6780E 2.2 108 24 144 144 Turbo 6400 1 TB 330 W
6766E 1.9 108 24 144 144 Turbo 6400 1 TB 250 W
6756E 1.8 96 24 128 128 Turbo 6400 1 TB 225 W
6746E 2 96 24 112 112 Turbo 6400 1 TB 250 W
6740E 2.4 96 24 96 96 Turbo 6400 1 TB 250 W
6710E 2.4 96 24 64 64 Turbo 6400 1 TB 205 W
Table 20. Intel ® Xeon ® 6 processors supported in R770 - P-Core 
Processor Clock
Speed
(GHz)
Cache
(M)
UPI
(GT/s)
Cores Threads Turbo Memory
Speed
(MT/s)
Memory
Capacity
TDP
6787P 2 336 24 86 172 Turbo 6400 4 TB 350 W
6767P 2.4 336 24 64 128 Turbo 6400 4 TB 350 W
6760P 2.2 320 24 64 128 Turbo 6400 4 TB 330 W
6747P 2.7 288 24 48 96 Turbo 6400 4 TB 330 W
6740P 2.1 288 24 48 96 Turbo 6400 4 TB 270 W
4
30 Processor
Table 20. Intel ® Xeon ® 6 processors supported in R770 - P-Core (continued)
Processor Clock
Speed
(GHz)
Cache
(M)
UPI
(GT/s)
Cores Threads Turbo Memory
Speed
(MT/s)
Memory
Capacity
TDP
6736P 2 144 24 36 72 Turbo 6400 4 TB 205 W
6737P 2.9 144 24 32 64 Turbo 6400 4 TB 270 W
6730P 2.5 288 24 32 64 Turbo 6400 4 TB 250 W
6530P 2.3 144 24 32 64 Turbo 6400 4 TB 225 W
6527P 3.0 144 24 24 48 Turbo 6400 4 TB 255 W
6520P 2.4 144 24 24 48 Turbo 6400 4 TB 210 W
6724P 3.6 72 24 16 32 Turbo 6400 4 TB 210 W
6517P 3.2 72 24 16 32 Turbo 6400 4 TB 190 W
6515P 2.3 72 24 16 32 Turbo 6400 4 TB 150 W
6505P 2.2 48 24 12 24 Turbo 6400 4 TB 150 W
6714P 4.0 48 24 8 16 Turbo 6400 4 TB 165 W
6507P 3.5 48 24 8 16 Turbo 6400 4 TB 150 W
NOTE: Mixing the processors is not supported.
Processor 31
Memory subsystem
Topics:
• Supported memory
• System memory guidelines
• CXL memory
Supported memory
Table 21. Memory technology  
Feature PowerEdge R770 (DDR5)
DIMM type RDIMM
Transfer speed 6400 MT/s (1DPC) and 5200 MT/s (2DPC)
NOTE: Maximum DIMM transfer speed support
dependent on CPU SKU and DIMM population
Voltage 1.1 V
Table 22. Supported DIMMs 
DIMM type Rated DIMM
Speed (MT/s)
DIMM Type DIMM
Capacity (GB)
Ranks per
DIMM
Data Width DIMM Volts
(V)
RDIMM 6400 RDIMM 16 1 x8 1.1
6400 RDIMM 32 2 x8 1.1
6400 RDIMM 64 2 x4 1.1
6400 RDIMM 96 2 x4 1.1
6400 RDIMM 128 2 x4 1.1
6400 RDIMM 256 8 x4 1.1
Table 23. Supported DIMMs 
DIMM PN Rated DIMM
Speed (MT/s)
DIMM Type DIMM
Capacity (GB)
Ranks per
DIMM
Data Width DIMM Volts
(V)
DXMWH 6400 RDIMM 16 1 x8 1.1
G9PYX 6400 RDIMM 32 2 x8 1.1
N66RP 6400 RDIMM 64 2 x4 1.1
JRGVT 6400 RDIMM 96 2 x4 1.1
9C0R6 6400 RDIMM 128 2 x4 1.1
2CRGW 6400 RDIMM 256 8 x4 1.1
System memory guidelines
The PowerEdge R770 system supports DDR5 registered DIMMs (RDIMMs).
5
32 Memory subsystem
Your system memory is organized into eight channels per processor (two memory sockets per channel), 16 memory sockets per
processor and 32 memory sockets per system.
Figure 23. Memory channels
Memory channels are organized as follows:
Table 24. Memory channels 
Processor Channel
A
Channel B Channel C Channel D Channel E Channel F Channel G Channel H
Processor
0
Slots A1
and A9
Slots A5
and A13
Slots A3
and A11
Slots A7 and
A15
Slots A2 and
A10
Slots A6
and A14
Slots A4 and
A12
Slots A8 and
A16
Processor
1
Slots B1
and B9
Slots B5
and B13
Slots B3
and B11
Slots B7 and
B15
Slots B2 and
B10
Slots B6
and B14
Slots B4 and
B12
Slots B8 and
B16
Table 25. Supported memory matrix  
DIMM type Rank Capacity DIMM rated
voltage and
speed
Operating Speed
Intel ® Xeon 6 E- core
processor
Intel ® Xeon 6 P- core
processor
1 DIMM per
channel
(DPC)
2 DIMM per
channel (DPC)
1 DIMM per
channel (DPC)
2 DIMM per
channel (DPC)
RDIMM 1R 16 GB DDR5 (1.1
V), 6400
MT/s
N/A N/A Up to 6400
MT/s
N/A
2 R 32 GB DDR5 (1.1
V), 6400
MT/s
Up to 6400
MT/s
N/A Up to 6400
MT/s
Up to 5200
MT/s
Memory subsystem 33
Table 25. Supported memory matrix  (continued)
DIMM type Rank Capacity DIMM rated
voltage and
speed
Operating Speed
Intel ® Xeon 6 E- core
processor
Intel ® Xeon 6 P- core
processor
1 DIMM per
channel
(DPC)
2 DIMM per
channel (DPC)
1 DIMM per
channel (DPC)
2 DIMM per
channel (DPC)
64 GB DDR5 (1.1
V), 6400
MT/s
Up to 6400
MT/s
Up to 5200
MT/s
Up to 6400
MT/s
Up to 5200
MT/s
96 GB DDR5 (1.1
V), 6400
MT/s
N/A N/A Up to 6400
MT/s
Up to 5200
MT/s
128 GB DDR5 (1.1
V), 6400
MT/s
N/A N/A Up to 6400
MT/s
Up to 5200
MT/s
8 R 256 GB DDR5 (1.1
V), 6400
MT/s
N/A N/A N/A Up to 5200
MT/s
Table 26. Supported memory matrix 
DIMM
Capacity
DIMMs per CPU
1 4 8 12 16
6700E
32 GB x N/A x N/A N/A
64 GB N/A N/A x N/A x
6500/6700P
16 GB x x x N/A N/A
32 GB x x x x x
64 GB N/A x x N/A x
128 GB N/A N/A x N/A x
256 GB N/A N/A N/A N/A x
NOTE:
● DIMMs with capacities 32 GB, and 64 GB are supported on E- core processors.
● DIMMs with capacities 16 GB, 32 GB, 64 GB, 96 GB, 128 GB, and 256 GB are supported on P- core processors.
NOTE: The processor may reduce the performance of the rated DIMM speed.
CXL memory
Table 27. CXL memory 
Platform RC# CPU0 Port CPU1 Port Total Native
DIMM
configuratio
n
Total Native
DIMM
capacity
Total CXL
AIC
configuratio
n
Total system
memory
capacity
R770 RC7 Slot 7/8 Slot 1/2 32 x 96 GB 3072 GB 4 x AIC (96
GB x 4)
4608 GB
34 Memory subsystem
Table 27. CXL memory (continued)
Platform RC# CPU0 Port CPU1 Port Total Native
DIMM
configuratio
n
Total Native
DIMM
capacity
Total CXL
AIC
configuratio
n
Total system
memory
capacity
R770 RC7 Slot 7/8 Slot 1/2 32 x 128 GB 4096 GB 4 x AIC (128*
GB x 4)
6144 GB
NOTE: *Feature not available at product launch in June, 2025. Please refer to the product configurator page on Dell.com to
confirm feature availability.
NOTE:
● Only the above Native DIMM configurations are supported.
● CXL requires fully populated Native DIMMs.
● Cannot select under 4x DIMMs on AIC.
● Cannot support more than two AICs per CPU.
● 256 GB within AIC cannot be thermally supported.
● x8 AIC refers to lane electrical connectivity only. Must still be populated in a x16 sized physical CEM slot.
Memory subsystem 35
Storage
Topics:
• Storage controllers
• Supported Drives
• Internal storage configuration
Storage controllers
The R770 system supports Front PERC H975i.
NOTE: The size of the RAID 1 drives must be less than that of the second RAID container.
NOTE: For the ESXi operating system, H975i is supported on 9.0 or later versions.
Supported Drives
The table that is shown below lists the internal drives that are supported in R770. See Agile for the latest SDL.
Table 28. Supported drives 
Form Factor Type Speed Rotational
Speed
Capacities
EDSFF E3.S DC NVMe Gen5 SSD 1.6 TB, 3.2 TB, 1.92 TB, 3.84 TB
EDSFF E3.S NVMe Gen5 SSD 3.2 TB, 6.4 TB, 3.84 TB, 7.68 TB, 15.36 TB, 30.72 TB, 61.44 TB
2.5 inches SATA 6 Gb SSD 480 GB, 960 GB, 1.92 TB, 3.84 TB
2.5 inches NVMe Gen4 SSD 400 GB, 800 GB, 960 GB, 1.6 TB, 1.92 TB, 3.2 TB, 3.84 TB, 6.4
TB, 7.68 TB, 12.8 TB, 15.63 TB, 30.72 TB, 61.44 TB
Internal storage configuration
R770 available internal storage configurations:
● Up to 8x EDSFF E3.S NVMe drives FIO configuration
● Up to 16x EDSFF E3.S NVMe drives FIO configuration
● Up to 16 x EDSFF E3.S NVMe drives
● Up to 32 x EDSFF E3.S NVMe drives
● Up to 40 x EDSFF E3.S NVMe drives
● Up to 4 x EDSFF E3.S NVMe drives on the rear
● Up to 8 x 2.5-inch SATA/NVMe drives
● Up to 8 x 2.5-inch Universal drives
● Up to 16 x 2.5-inch SATA drives
● Up to 24 x 2.5 inch SATA drives
● Up to 24 x 2.5 inch SATA/NVMe (8 NVMe + 16 SATA) drives
6
36 Storage
NVIDIA support
The R770 supports the following NVIDIA GPUs:
Table 29. R770 NVIDIA GPU support list 
Platform support details GPU details
GPU Name Maximum
Qty.
Riser configuration support PCIe Form Factor Power
NVIDIA L4 2 RC 1, RC 2, RC 7 x16 SW 72 W
4 RC 6-1, RC 6-2 , RC 11-1, RC 11-2 x16 SW 72 W
6 RC 12 x16 SW 72 W
NVIDIA H100 NVL 2 RC 6-2, RC 11-2 x16 DW 400 W
NVIDIA L40s 2 RC 6-2, RC 11-2 x16 DW 350 W
NVIDIA A16 2 RC 6-2, RC 11-2 x16 DW 250 W
NVIDIA H200 NVL 2 RC 6-2, RC 11-2 x16 DW 450 W
NVIDIA RTX Pro
4500
2 RC 6-2, RC 11-2 x16 SW 165 W
4 RC 18 x16 SW 165 W
NVIDIA RTX Pro
6000
2 RC 6-2, RC 11-2 x16 SW 450 W
NOTE: The NVIDIA H200 NVL and NVIDIA RTX Pro 6000 are designed to support up to 600 W, however, they are power
capped to 450 W support on R770.
NOTE: The NVIDIA H200 NVL and NVIDIA RTX Pro 6000 require Ubuntu OS 24.04.02 with Kernel 6.11 or later.
NOTE: Minimum requirements for supporting NVIDIA H200 NVL and NVIDIA RTX Pro 6000 GPUs:
● All fan modules must be High performance Platinum Fan (HPR Platinum) type.
● The iDRAC version must be at least 1.20.60.55; otherwise, a potential FAN type mismatch error may appear in the LC
log, and the FAN speed will be limited to 50% capacity.
● The puck power cables that are required for GPU installations are specific to the slot: DPN: DCNHT for slot 2 and DPN:
K8FW0 for slot 7.
7
NVIDIA support 37
Networking
Topics:
• Overview
• OCP 3.0 support
Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are
chosen and these adapters are rigorously validated for worry-free, fully supported use in Dell servers.
OCP 3.0 support
Table 30. OCP 3.0 feature list 
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen5
Max PCIe width x8, x16 (For Rear I/O configuration additional OCP cable is
required)
Max number of ports 4
Port type SFP28/QSFP56
Max port speed 25 GbE, 100 GbE (For Rear I/O configuration additional OCP
cable is required)
NC-SI Yes
SNAPI Yes
WoL Yes
Power consumption 15 W–35 W
OCP is also supported in front of the system for some configurations, called the Floating OCP Paddle Card (FLOP). Additionally,
the Front I/O OCP supports both internal latch and thumbscrew versions, providing flexibility in installation and maintenance.
Supported OCP cards
Table 31. Supported OCP cards 
Form factor Vendor Port type Port speed Port count
OCP 3.0 Mellanox QSFP56 25 GbE 2
Broadcom QSFP56 25 GbE 4
Mellanox QSFP56 100 GbE 2
Broadcom QSFP56 100 GbE 2
8
38 Networking
Table 31. Supported OCP cards (continued)
Form factor Vendor Port type Port speed Port count
Broadcom BT 1 GbE 4
Broadcom BT 10 GbE 4
Broadcom BT 10 GbE 2
Broadcom SFP28 25 GbE 2
Broadcom QSFP112 200 GbE 2
Intel BT 10 GbE 2
Intel BT 10 GbE 4
Intel BT 1 GbE 4
OCP NIC 3.0 vs 2.0
Table 32. OCP 3.0 and 2.0 NIC comparison 
Form Factor OCP 2.0 (LOM Mezz) OCP 3.0 Notes
PCIe Gen Gen3 Gen5 Supported OCP3 is SFF (small
form factor).
Max PCIe Lanes Up to x16 Up to x16 See server slot priority matrix.
Shared LOM Yes Yes Only OCP on slot 10 (rear
IO) can support iDRAC port
redirect as shared NIC.
Shared LOM Yes Yes Only OCP on slot 10 (rear IO)
and slot 38 (front IO) can
support iDRAC port redirect
as shared NIC.
Aux Power Yes Yes Used for Shared LOM
Networking 39
PCIe subsystem
Topics:
• PCIe risers
PCIe risers
Shown below are the riser offerings for the platform.
Figure 24. Riser connector location on system board
1. Front riser RF2a or rear riser 5
2. Front riser RF1a or rear riser 4
3. Front riser RF4a or rear riser 3
4. Rear riser 1
5. Front riser RF3a or rear riser 2
NOTE: The system can have front or rear risers, but not both at the same time.
9
40 PCIe subsystem
Figure 25. Riser 1A
1. Slot 1
2. Slot 2
Figure 26. Riser 1B
Figure 27. Riser 1B (FL)
1. Slot 2
PCIe subsystem 41
Figure 28. Riser 1d
1. Slot 1
Figure 29. Riser R2A
1. Slot 3
42 PCIe subsystem
Figure 30. Riser 2B
1. Slot 3
Figure 31. Riser 3A
1. Slot 4
2. Slot 5
PCIe subsystem 43
Figure 32. Riser 3C
1. Connector to HPM riser 3 2. HPM SL10 connector
3. Slot 5 4. Slot 4
Figure 33. Riser 3E
1. Slot 4
44 PCIe subsystem
Figure 34. Riser 3f
1. Slot 4
Figure 35. Riser 4A
1. Slot 9
PCIe subsystem 45
Figure 36. Riser 4B
1. Slot 9
Figure 37. Riser R4C
1. Slot 9
Figure 38. Riser R5A
1. Slot 7
2. Slot 8
46 PCIe subsystem
Figure 39. Riser R5B
1. Slot 7
Figure 40. Riser R5B (FL)
1. Slot 7
Figure 41. Riser R5C
1. Slot 7
2. Slot 8
PCIe subsystem 47
Figure 42. Riser 5e
1. Slot 7
2. Slot 8
Figure 43. Riser RF1A
1. Slot 31
48 PCIe subsystem
Figure 44. Riser RF3A
1. Slot 36
Figure 45. Riser RF2A
1. Slot 34
Figure 46. Riser RF4A
1. Slot 38
PCIe subsystem 49
Table 33. PCIe Riser Configurations 
Config No. Riser configuration No. of
Processors
PERC type supported Rear storage possible
0 No Risers 2 N/A No
1 RF1a+RF3a+RF4a 2 N/A No
2 RF1a+RF2a+RF3a+RF4a 2 N/A No
6-1 R1b+R2b+R3e+R4b+ R5b
(HL)
2 Front No
6-2 R1b+R2b+R3e+R4b+ R5b
(FL)
2 Front No
7 R1a+R2b+R3a+R4b+R5a 2 Front No
11-1 R1b+R2a+R3c+R4a+R5b(HL
)
2 Front No
11-2 R1b+R2a+R3c+R4a+R5b
(FL)
2 Front No
12 R1b+R2b+R3c+R4b+R5c 2 Front No
14 R2a+R3a+R4a+R5a 2 Front Yes
15 R3c+R4c 2 Front No
50 PCIe subsystem
Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps to regulate
temperature by reducing server noise and power consumption. The table below lists the tools and technologies Dell offers to
lower power consumption and increase energy efficiency.
Topics:
• Power
• Thermal
• Acoustics
Power
Table 34. Power tools and technologies 
Feature Description
Power Supply Units(PSU)
portfolio
Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
maintaining availability and redundancy. Find additional information in the Power supply units
section.
Tools for right sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most
efficient configuration possible. With Dell's EIPT, you can calculate the power consumption of
your hardware, power infrastructure, and storage at a given workload. Learn more at Dell EIPT .
Industry Compliance Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:
● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%
● More accurate reporting of power
Rack infrastructure Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
● AC Blind Mate
Find additional information at: Power and Cooling
Power Supply Units
Energy Smart power supplies are designed to maintain high availability while improving efficiency. They dynamically adjust power
delivery based on system demand and support redundant configurations for resiliency. Key capabilities include high-efficiency
power conversion, improved thermal management, and integrated power monitoring with precise telemetry.
10
Power, thermal, and acoustics 51
Table 35. R770 PSU specifications 
PSU Class Heat
dissipation
(maximum)
(BTU/hr)
Frequen
cy (Hz)
AC Voltage DC Voltage Current
(A)
200—
240 V
100—
120 V
277 V 240 V - (48—
60) V
336 V
800 W
mixed mode
Platinum 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2—4.5
N/A 3000 N/A N/A N/A N/A 800 W N/A N/A 3.7
Titanium 3000 50/60 800 W 800 W N/A N/A N/A N/A 9.2—4.5
N/A 3000 N/A N/A N/A N/A 800 W N/A N/A 3.7
1100 W
mixed mode
Platinum 4125 50/60 1100 W 1050 W N/A N/A N/A N/A 12—6.1
N/A 4125 N/A N/A N/A N/A 1100 W N/A N/A 5.1
Titanium 4125 50/60 1100 W 1050 W N/A N/A N/A N/A 12—6.1
N/A 4125 N/A N/A N/A N/A 1100 W N/A N/A 5.1
1400 W -48
VDC
N/A 5310 N/A N/A N/A N/A N/A 1400 W N/A 33
1500 W
mixed mode
Titanium 5625 50/60 1500 W 1050 W N/A N/A N/A N/A 12—8.2
N/A 5625 N/A N/A N/A N/A 1500 W N/A N/A 6.8
1500 W
277Vac &
HVDC
Titanium 5625 50/60 N/A N/A 1500
W
N/A N/A N/A 6.1
N/A 5625 N/A N/A N/A N/A N/A N/A 1500
W
4.91
1800 W
HLAC
Titanium 6750 50/60 1800 W N/A N/A N/A N/A N/A 9.8—8.2
1800 W
HVDC
N/A 6750 N/A N/A N/A N/A 1800 W N/A N/A 8.2
2400 W
mixed mode
Titanium 9000 50/60 2400 W 1400 W N/A N/A N/A N/A 16—13.2
N/A 9000 N/A N/A N/A N/A 2400 W N/A N/A 10.9
3200 W
mixed mode
Titanium 12000 50/60 2900
W**
3200
W***
N/A N/A N/A N/A N/A 16
N/A 12000 N/A N/A N/A N/A 3200 W N/A N/A 14.5
3200 W
277Vac &
HVDC
Titanium 12000 50/60 N/A N/A 3200
W
N/A N/A N/A 12.9
N/A 12000 N/A N/A N/A N/A N/A N/A 3200
W
10.47
NOTE:
● **200-220 V
● *** 220.1-240 V
NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Enterprise Infrastructure Planning Tool available at calc .
52 Power, thermal, and acoustics
Figure 47. PSU power cords
Figure 48. APP 2006G1 power cord
Figure 49. Lotes DC PSU connector
NOTE: For more information about how to install -(48—60) V DC power supply, see the 'Cabling instructions for –(48–60)
V DC power supply' at PowerEdge Manuals page > Browse all products > Infrastructure > PowerEdge > Rack Servers
>  PowerEdge R770 > Select This Product > Manuals and Documents
Table 36. PSU power cords 
Form factor Output Power cord
60 mm 800 W mixed mode C13
1100 W mixed mode C13
1400 W -48 VDC Lotes APOWA049
1500 W mixed mode C13
1500 W mixed mode 277Vac
& HVDC
APP/Saf-D-Grid
1800 W mixed mode C13
73.5 mm 2400 W mixed mode C19
3200 W mixed mode C19
3200 W mixed mode 277Vac
& HVDC
APP/Saf-D-Grid
Power, thermal, and acoustics 53
Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.
Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while
maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F
to 95°F) and to extended ambient temperature ranges.
Figure 50. Thermal design characteristics
The thermal design of the PowerEdge R770 reflects the following:
● Optimized thermal design: The system layout is architected for optimum thermal design.
● System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power.
● Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, and inventory for system configurations. Temperature
monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP.
● Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine
fan speed based on inlet air ambient temperature. Closed loop thermal control method uses feedback temperatures to
dynamically determine proper fan speeds.
● User-configurable settings: With the understanding and realization that every customer has unique set of circumstances
or expectations from the system. For more information, see the Dell PowerEdge R770 Installation and Service Manual at
PowerEdge Manuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on Dell.com.
● Cooling redundancy: The R770 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
● Environmental Specifications: The optimized thermal management makes the R770 reliable under a wide range of operating
environments.
Acoustics
Acoustical configurations of R770
The Dell PowerEdge R770 is a rack-mount server whose with acoustical output that spans from levels suitable for an office
environment to those found in data centers. Acoustical performance is provided in terms of eight configurations: Quietest
Configuration, GPU Quietest, Entry, Volume(2.5”), Volume(Front I/O), Volume(GPU), Feature Rich, and Feature Rich(ML).
Detailed information about these configurations can be found in 'Configurations tested for acoustical experience' table, while
acoustical performance data for each configuration is included in 'Acoustical experience of R770 edition configurations' table.
54 Power, thermal, and acoustics
Table 37. Configurations tested for acoustical experience 
Configurati
ons
Quietest
Acoustical
GPU
Quietest
Acoustical
Entry Volume
(2.5”)
Volume
(Front I/O)
Volume(GP
U)
Feature
Rich ML
Feature
Rich
CPU 2 x Intel 205
W
2 x Intel 205
W
2 x Intel 205
W
2 x Intel 205
W
2 x Intel 250
W
2 x Intel 330
W
2 x Intel 350
W
2 x Intel 250
W
Memory 16 x 32 GB
RDIMM
DDR5
32 x 64 GB
RDIMM
DDR5
16 x 32 GB
RDIMM
DDR5
16 x 32 GB
RDIMM
DDR5
16 x 32 GB
RDIMM
DDR5
32 x 64 GB
RDIMM
DDR5
32 x 64 GB
RDIMM
DDR5
16x 32 GB
RDIMM
DDR5
HDD/SSD 1 x 2.5” 2 x 2.5” 2x 2.5” 8x2.5”NVM
E
8xE3 8x2.5”NVM
E
24x2.5” 2xE3
BP 8x 2.5"
Universal
BP
8x 2.5"
Universal
BP
8x 2.5"
Universal
BP
8x 2.5"
Universal
BP
8x E3 BP 8x 2.5"
Universal
BP
24x2.5” 4x8xE3
PERC N/A H365i N/A N/A N/A H965i H965i N/A
BOSS N/A N/A N/A 17G BOSS 17G BOSS 17G BOSS 17G BOSS 17G BOSS
OCP 2-port 25
Gbe
N/A 2-port 25
Gbe
2-port 25
Gbe
N/A 2-port 25
Gbe
2-port 25
Gbe
2-port 25
Gbe
PSU 2x 1100 W 2x 3200 W 2x 1100 W 2x 1100 W 2x 1500 W 2x 3200 W 2x 3200 W 2x 1500 W
Bezel Yes Yes Yes Yes Yes Yes Yes Yes
PCI N/A 1 x Nvidia
H100
N/A 2-port
100Gbe
N/A 1 x Nvidia
H100
2-port
100Gbe
2-port
100Gbe
Table 38. Acoustical experience of R770 edition configurations 
Configuration Quietest
Acoustica
l
GPU
Quietest
Acoustica
l
Entry Volume
(2.5”)
Volume
(Front I/
O)
Volume(G
PU)
Feature
Rich ML
Feature
Rich
Acoustical Performance: Idle/ Operating @ 25 °C Ambient
LwA,m (B) Idle (4) 4.7 6.4 4.7 4.7 5.9 6.9 5.9 6.1
Operating
/
Customer
Usage
Operating
(5)(6)
4.7 9.2 4.7 5.4 5.9 8.7 6.0 6.4
Kv(B) Idle (4) 0.4 0.4 0.4 0.4 0.4 0.4 0.4 0.4
Operating
/
Customer
Usage
Operating
(5)(6)
0.4 0.4 0.4 0.4 0.4 0.4 0.4 0.4
LpA,m (dB) Idle (4) 34 51 34 34 43 51 42 44
Operating
/
Customer
Usage
Operating
(5)(6)
34 70 34 39 43 70 43 46
Prominent discrete
tones (3)
Prominence ratio < 15 dB
Power, thermal, and acoustics 55
Table 38. Acoustical experience of R770 edition configurations (continued)
Configuration Quietest
Acoustica
l
GPU
Quietest
Acoustica
l
Entry Volume
(2.5”)
Volume
(Front I/
O)
Volume(G
PU)
Feature
Rich ML
Feature
Rich
Acoustical Performance: Idle @ 28 °C Ambient
LwA,m (1)(B) 5.2 6.9 5.2 5.1 6.2 6.9 6.4 6.2
Kv (B) 0.4 0.4 0.4 0.4 0.4 0.4 0.4 0.4
LpA,m (2)(dB) 35 50 35 35 45 50 47 45
Acoustical Performance: Max. Loading @ 35 °C Ambient
LwA,m (1)(B) 7.4 9.1 7.4 7.4 7.2 9.1 7.5 8.3
Kv (B) 0.4 0.4 0.4 0.4 0.4 0.4 0.4 0.4
LpA,m (2)(dB) 58 74 58 57 56 73.7 57 70
(1)LwA, m: The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 with data collected
using the methods described in ISO 7779 (2010). Engineering data presented here may not be fully compliant with ISO 7779
declaration requirements.
(2)LpA, m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296
and measured using methods described in ISO 7779. The system is placed in a 24U rack enclosure, 25cm above a reflective
floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirements.
(3)Prominent discrete tones: Criteria of Annex D of ECMA-74 & Prominence Ratio method of ECMA-418 are followed to
determine if discrete tones are prominent and to report them, if so.
(4)Idle mode: The steady-state condition in which the server is energized but not operating any intended function.
(5)Operating mode: Operating mode is represented by the maximum of the steady state acoustical output at 50% of CPU TDP
or active storage drives for the respective sections of Annex C of ECMA-74.
(6) Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output
at 10%~50% of CPU TDP, 10~50% of Memory, 10% IOPs, and >50% GPU load as the components showed in the above
configurations.
56 Power, thermal, and acoustics
Rack, rails, and cable management
Topics:
• Rails and cable management information
Rails and cable management information
The rail offerings for the PowerEdge R770 consist of two general types: sliding and static. The cable management offerings
consist of an optional cable management arm (CMA) and an optional strain relief bar (SRB).
See the Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at rail-rack matrix for information regarding:
● Specific details about rail types.
● Rail adjustability ranges for various rack mounting flange types.
● Rail depth with and without cable management accessories.
● Rack types that are supported for various rack mounting flange types.
Key factors governing proper rail selection include the following:
● Spacing between the front and rear mounting flanges of the rack.
● Type and location of any equipment that is mounted in the back of the rack such as power distribution units (PDUs).
● Overall depth of the rack.
Sliding rails features summary
The sliding rails allow the system to be fully extended out of the rack for service. There are two types of sliding rails available,
ReadyRails II sliding rails and Stab-in/Drop-in sliding rails. The sliding rails are available with or without the optional cable
management arm (CMA) or strain relief bar (SRB).
B21 ReadyRails sliding rails for 4-post racks
● Supports drop-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of the Dell racks.
● Support for tooled installation in 19" EIA-310-E compliant threaded hole 4-post racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for optional strain relief bar (SRB).
● Support for an optional cable management arm (CMA).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the
sliding rails. This reduces the overall length of the rails and eliminates the potential interference with rear-mounted PDUs
or the rear rack door.
11
Rack, rails, and cable management 57
Figure 51. Sliding rails with optional CMA
Figure 52. Sliding rails with optional SRB
B22 Stab-in/Drop-in sliding rails for 4-post racks
● Supports drop-in or stab-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square, unthreaded round hole racks including all generations of
the Dell racks. Also supports tool-less installation in threaded round hole 4-post racks.
● Support for tool-less installation in Dell EMC Titan or Titan-D racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for an optional cable management arm (CMA).
● Support for optional strain relief bar (SRB).
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the
sliding rails. This reduces the overall length of the rails and eliminates the potential interference with rear-mounted PDUs
or the rear rack door.
58 Rack, rails, and cable management
B20 static rails summary
The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails because of their
reduced complexity and lack of need for CMA support. The static rails support a wider variety of racks than the sliding rails.
However, they do not support serviceability in the rack and are thus not compatible with the CMA. The static rails are also not
compatible with SRB.
Figure 53. Static rails
Static rails features summary
Static rails for 4-post and 2-post racks:
● Supports Stab-in installation of the chassis to the rails.
● Support tool-less installation in 19" EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks.
● Support tooled installation in 19" EIA-310-E compliant threaded hole 4-post and 2-post racks.
● Support for tooled installation in Dell Titan or Titan-D rack.
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types. The screws are
provided for mounting static rails in racks with threaded mounting flanges.
● Screw head diameter should be 10 mm or less.
2-Post racks installation
If installing to 2-Post (Telco) racks, the ReadyRails II static rails (B4) must be used. Sliding rails support mounting in 4-post
racks only.
Rack, rails, and cable management 59
Figure 54. Static rails in 2-post center mount configuration
Installation in the Dell EMC Titan or Titan-D racks
For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (B22) must be used. This rail collapses
down sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The
Stab-in/Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For
tooled installation, Stab-in Static rails (B20) must be used for bezel alignment with storage systems.
Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system
down into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.
Installing the system into the rack (option A: Drop-In)
1. Pull the inner rails out of the rack until they lock into place.
Figure 55. Pull out inner rail
2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.
60 Rack, rails, and cable management
Figure 56. Rail standoffs seated in J-slots
4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.
Figure 57. Slide system into the rack
Installing the system into the rack (option B: Stab-In)
1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.
Rack, rails, and cable management 61
Figure 58. Pull out the intermediate rail
Table 39. Rail component label 
Number Component
1 Intermediate rail
2 Inner rail
3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and
sliding forward on the system until they lock into place.
Figure 59. Attach the inner rails to the system
4. With the intermediate rails extended, install the system into the extended rails.
62 Rack, rails, and cable management
Figure 60. Install system into the extended rails
5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.
Figure 61. Slide system into the rack
B35 Blind Mate Power Rail features summary
These rails are compatible with the R770 Cold-Aisle-Service (front I/O) Configuration.
The Blind mate Power Rails are Static Rail which includes extra power pass-through, bracket assemblies to allow for the
ability to connect power, and then remove/service the R770 without needing Hot-Aisle access. These rails do not allow for
hot-swapping of internal components or in-rack serviceability, and are not compatible with SRB.
● Supports Stab-in installation of the chassis to the rails
● Supports tool-less installation in 19-inch EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks
● Supports tooled installation in 19-inch EIA-310-E compliant threaded hole 4-post
● Supports tooled installation in Dell Titan or Titan-D rack
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types.
Rack, rails, and cable management 63
● Screw head diameter should be 10 mm or less.
Figure 62. Blind Mate Rails, Rack cabinet members setup
B35 Blind Mate Power Rail Power Pass-Thru Setup
The Blind Mate Power Rails require extra setup to enable the blind mate ability and cold-aisle serviceability, by installing 2 power
pass-through brackets.
The "inner" bracket is installed behind the rear of the server, which is attached to the rail chassis members, and the cable
sub-assembly will be plugged into the server PSUs as shown below:
Figure 63. Attaching bracket to rails
64 Rack, rails, and cable management
Figure 64. Connecting power cable to system
The "outer" bracket will be installed to the rail cabinet members in the rack, after the individual cabinet members have been
installed. Users plug live power cable to the rear cable assembly, just as they would to the server in the standard setups, as
shown below:
Figure 65. Connecting rear bracket
Rack, rails, and cable management 65
Figure 66. Connecting live power cable to bracket
Figure 67. Sliding system to rear bracket
Installation of the server will follow the traditional Stab-in process, where the pass-thru brackets and connectors will mate as
the server rack ears meet the front rack flange. Visual Indicators are present to identify Blind Mate Power setups from the Cold
Aisle.
WARNING: Whenever you need to lift the system, get others to assist you. To avoid injury, do not attempt to lift
the system by yourself. Get others to assist you or use a mechanical lift.
NOTE: Begin installing the rails in the allotted space that is closest to the bottom of the rack enclosure.
Cable management arm (CMA)
The optional cable management arm (CMA) organizes and secures the cords and cables exiting the back of the systems. It
unfolds to allow the systems to extend out of the rack without having to detach the cables. Some key features of the CMA
include:
● Large U-shaped baskets to support dense cable loads.
● Open vent pattern for optimal airflow.
66 Rack, rails, and cable management
● Ability to mount on either side by swinging the spring-loaded brackets from one side to the other.
● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling.
● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position.
● Both the CMA and the tray mount without the use of tools by simple and intuitive snap-in designs.
The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier
access to it and the rear drives (if applicable) for service or replacement.
Figure 68. Sliding rails with CMA
Figure 69. CMA Cabling
Strain Relief Bar (SRB)
The optional strain relief bar (SRB) for the PowerEdge R770 organizes and supports cable connections at the rear end of the
server to avoid damage from bending.
Rack, rails, and cable management 67
Figure 70. Cabled strain relief bar
● Tool-less attachment to the rails
● Two depth positions to accommodate various cable loads and rack depths
● Supports cable loads and controls stresses on server connectors
● Cables can be segregated into discrete purpose-specific bundles
68 Rack, rails, and cable management
Operating Systems and Virtualization
Topics:
• Supported operating system
Supported operating system
The PowerEdge R770 system supports the following operating systems:
● Canonical Ubuntu Server LTS
● Microsoft Windows Server with Hyper-V
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi
● Dell NativeEdge OS*
NOTE: *Features marked with an asterisk (*) may not be available at product launch. Please refer to the product
configurator page on Dell.com to confirm feature availability.
For specifications and interoperability details, see OS support .
12
Operating Systems and Virtualization 69
Dell Systems Management
Dell delivers management solutions that help IT administrators deploy, update, monitor, and manage IT assets. OpenManage
solutions and tools enable you to solve and respond to problems quickly by manage Dell servers efficiently in physical and remote
environments, and operating in-band and out-of-band (agent-free).
The OpenManage portfolio includes innovative embedded management tools such as the integrated Dell Remote Access
Controller (iDRAC) and consoles like OpenManage Enterprise, OpenManage Power Manager Plugin, and tools like Repository
Manager. Dell has developed comprehensive systems management solutions that are based on open standards by connecting
and/or integrating it's offers with top system management vendors and frameworks such as Ansible, Microsoft, and
VMware, enabling advanced management of Dell hardware. The key tools for managing Dell PowerEdge servers are iDRAC
and OpenManage Enterprise (OME) console. OpenManage Enterprise helps the system administrators with the life cycle
management of multiple generations of PowerEdge servers. OME has additional functions that can be added with plugins
like OpenManage Enterprise Services, Update Manager, APEX AIOps Observability (formerly CloudIQ), and Power Manager. It
also offers integration with VMware vCenter and Microsoft System Center, and a set of tools, including Repository Manager,
enabling easy management of PowerEdge hardware. The four main pillars of Dell systems management closely align with the
issues and business challenges that are faced by many IT departments.
● Automating IT management.
○ Comprehensive automation management for reducing OPEX and increasing uptime and overall efficiency of systems.
○ Comprehensive suite of tools to automate according to your needs.
● Management made simple.
○ Simple but powerful tools for managing your Dell servers.
○ Integrated tools that streamline support engagements.
○ Innovative at-the-box management features.
● Secure by default.
○ Dell servers offer robust security defenses to prevent the next generation of malicious attacks.
○ Security is designed deep into the hardware and firmware architecture for optimal protection.
● Smarter infrastructure management.
○ It offers a next-generation 1-to-many console to manage your IT and server infrastructure.
○ Embedded intelligence that is infrastructure-aware to optimize troubleshooting and deployment.
This document provides an overview of the OpenManage Systems Management offerings to help IT administrators choose the
appropriate tools to completely manage Dell PowerEdge servers.
● The latest Dell Systems Management Overview Guide .
Topics:
• Integrated Dell Remote Access Controller (iDRAC)
• Systems Management software support matrix
Integrated Dell Remote Access Controller (iDRAC)
iDRAC10 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC10
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC10 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale management
of PowerEdge servers.
13
70 Dell Systems Management
Zero-Touch Provisioning (ZTP) is embedded in iDRAC. ZTP is an Intelligent Automation Dell's agent-free management. Once a
PowerEdge server is connected to power and networking that system can be monitored and fully managed, whether you are
standing in front of the server or remotely over a network. With no need for software agents, an IT administrator can:
● Monitor
● Manage
● Update
● Troubleshoot, and remediate Dell servers.
With features like zero-touch deployment and provisioning, and System Lockdown, iDRAC10 is purpose-built to simplify server
administration. For those customers whose existing management platform uses in-band management, Dell does provide iDRAC
Service Module, a lightweight service that can interact with both iDRAC10 and the host operating system to support legacy
management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server is
configured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC10 offers the following license tiers:
Table 40. iDRAC10 license tiers 
License Description
iDRAC10 Core ● Available for all servers.
● Core system management features for users who are cost conscious.
iDRAC10
Enterprise
● Available as an upsell on all servers.
● Includes all features of Core. Also, includes additional automation features and virtual console and security
features.
● Bundled with Secure Enterprise Key Management (SEKM) and Secure Component Verification (SCV)
licenses.
iDRAC10
Datacenter
● Available as an upsell on all servers.
● Includes all features of Core and Enterprise.
● Includes key features such as telemetry streaming and thermal management.
● Includes advanced accelerators (GPU and DPU) system management and advanced air and liquid cooling.
For a full list of iDRAC features by license tier, see the Integrated Dell Remote Access Controller 10 User's Guide at
Dell.com .
For more details on iDRAC10 including white papers and videos, see:
● Support for Integrated Dell Remote Access Controller 10 (iDRAC10) is on the Knowledge Base page at Dell.com
Systems Management software support matrix
Table 41. Systems Management software support matrix  
Categories Features PE mainstream
Embedded Management and In-band
Services
iDRAC10 (Express, Enterprise, and Datacenter licenses) Supported
iDRAC RESTful API with Redfish Supported
iDRAC Service Module (iSM) (available from RTS 1.2) Supported
Driver Pack (available from RTS 1.2) Supported
Tools Dell Repository Manager Supported
Dell System Update Supported
Enterprise Catalogs Supported
iDRAC RESTful API with Redfish Supported
IPMI Supported
Dell Systems Management 71
Table 41. Systems Management software support matrix  (continued)
Categories Features PE mainstream
RACADM CLI Supported
Security Cryptographically signed firmware Supported
Data at Rest Encryption (SEDs with local or external key
mgmt)
Supported
Secure Boot Supported
Secured Component Verification (Hardware integrity
check)
Supported
Silicon Root of Trust Supported
Secure Erase Supported
System Lockdown (requires iDRAC10 Enterprise or
Datacenter)
Supported
TPM 2.0 FIPS, CC-TCG certified Supported
Standard operating system Canonical Ubuntu Server LTS , Red Hat Enterprise Linux,
SUSE Linux Enterprise Server
Supported (Tier-1)
72 Dell Systems Management
Appendix A: Additional specifications
Topics:
• Chassis dimensions
• System weight
• NIC port specifications
• Video specifications
• USB Ports
• PSU rating
• Environmental specifications
Chassis dimensions
Figure 71. Chassis dimensions
14
Appendix A: Additional specifications 73
Table 42. PowerEdge R770 chassis dimensions 
Drives Xa Xb Y Za Zb Zc
● 8 x EDSFF
E3.S (Front I/
O)
● 16 x EDSFF
E3.S (Front I/
O)
482.0 mm (18.97
inches)
434.0 mm
(17.08 inches)
86.8 mm (3.41
inches)
42.9 mm (1.68
inches)
Without bezel
700.7 mm
(27.58 inches)
Ear to rear wall
771.62 mm
(30.37 inches)
Ear to PSU
handle
● 8 x 2.5-inch
SATA
● 8 x 2.5-inch
Universal
● 16 x 2.5-inch
SATA
● 16 x 2.5-inch
+ 8 x 2.5-inch
SATA
● 24 x 2.5-inch
SATA
● 16 x EDSFF
E3.S
● 32 x EDSFF
E3.S
● 40 x EDSFF
E3.S
482.0 mm (18.97
inches)
434.0 mm
(17.08 inches)
86.8 mm (3.41
inches)
30.78 mm (1.21
inches) With
bezel
29.89 mm (1.18
inches)
Without bezel
700.7 mm
(27.58 inches)
Ear to rear wall
771.62 mm
(30.37 inches)
Ear to PSU
handle
NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.
System weight
Table 43. PowerEdge R770 system weight 
System configuration Maximum weight (with all drives/SSDs)
8 x EDSFF E3.S 25.89 kg (57.07 lb)
16 x EDSFF E3.S 28.53 kg (62.89 lb)
8 x 2.5-inch SATA drives 27.2 kg (59.96 lb)
8 x 2.5-inch Universal 27.2 kg (59.96 lb)
16 x 2.5-inch SATA drives 29.5 kg (65.03 lb)
16 x 2.5-inch + 8 x 2.5-inch SATA drives 31.33 kg (69.07 lb)
24 x 2.5-inch SATA drives 32.08 kg (70.72 lb)
32 x EDSFF E3.S 31.24 kg (68.87 lb)
40 x EDSFF E3.S 30.96 kg (68.25 lb)
Table 44. PowerEdge R770 weight handling recommendations 
Chassis weight Description
40–70 lb Recommend two people to lift
70–120 lb Recommend three people to lift
≥ 121 lb Recommend to use a server-lift
74 Appendix A: Additional specifications
NIC port specifications
The PowerEdge R770 system supports Network Interface Controller (NIC) ports that are embedded on the Open Compute
Project (OCP) NIC cards.
Table 45. NIC port specification for the system 
Feature Specifications
OCP NIC 3.0 card 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4,
100 GbE x 2
NOTE: The OCP NIC card can be installed in front or rear of the system, depending on the system I/O configuration.
Video specifications
The PowerEdge R770 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.
Table 46. Supported video resolution options  
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
USB Ports
The front USB 2.0 port only supports output current up to 0.5 A and cannot support high-power consumption devices such as
CD-ROM.
Figure 72. Front USB Port
The bottom port of the rear USB connector can support USB3.1 to supply output current up to 0.9 A.
Appendix A: Additional specifications 75
Figure 73. Rear USB Port
An internal USB Type-A vertical connector on the HPM can support a small USB device. The maximum allowable height of the
USB device body is specified per configuration:
Figure 74. Internal USB Port
Table 47. USB card length 
Configuration card length limit (including connector)
2U 31.32 mm
NOTE: Internal USB design is USB device restriction, not for cable.
Table 48. PowerEdge R770 USB Specifications 
Front Rear Internal
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB 2.0-
compliant port
One (optional) USB 3.1-
compliant ports
Two Internal USB 3.1-
compliant port
One
USB 2.0 Type C
port
One
PSU rating
Below table lists the power capacity of the PSUs in high/low line operation mode.
76 Appendix A: Additional specifications
Table 49. PSUs highline and lowline ratings 
PSU 800 W
Platinu
m
800 W
Titaniu
m
1100 W
Platinu
m
1100 W
Titaniu
m
1400 W
-48VD
C
1500 W
Titanium
1500 W
277Vac
& HVDC
1800 W
HLAC
Titanium
2400
Titanium
3200 W
Titanium
3200 W
Titanium
277Vac
& HVDC
Peak
Power
(Highlin
e)
1240 W 1240 W 1705 W 1705 W N/A 2325 W 2325 W 2790 W 3720 W 5440 W 5440 W
Highline 800 W 800 W 1100 W 1100 W N/A 1500 W 1500 W 1800 W 2400 W 3200 W 3200 W
Peak
Power
(Lowlin
e)
1240 W 1240 W 1627 W 1627 W N/A 1627 W N/A N/A 2170 W N/A N/A
Lowline 800 W 800 W 1050 W 1050 W N/A 1050 W N/A N/A 1400 W N/A N/A
Highline
240
VDC
800 W 800 W 1100 W 1100 W N/A 1500 W N/A 1800 W 2400 W 3200 W N/A
Highline
380
VDC
N/A N/A N/A N/A N/A N/A 1500 W N/A N/A N/A 3200 W
DC-(48
—60)
V
N/A N/A N/A N/A 1400 W N/A N/A N/A N/A N/A N/A
Peak
Power
(DC -
(48-60)
V)
N/A N/A N/A N/A 2170 W N/A N/A N/A N/A N/A N/A
The PowerEdge R770 supports up to two AC power supplies with 1+0 or 2+0 non-redundancy, 1+1 redundancy, autosensing, and
auto switching capability.
Dell PSUs have achieved Platinum and Titanium efficiency levels as shown in the table below.
Table 50. PSU efficiency level 
Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
Redundant 60 mm 800 W Mixed mode Platinum N/A 90.00% 94.00% 91.00%
800 W mixed mode Titanium 90.00% 94.00% 96.00% 91.00%
1100 W Mixed mode Platinum N/A 90.00% 94.00% 91.00%
1100 W mixed mode Titanium 90.00% 94.00% 96.00% 91.00%
1400 W -48VDC N/A 85.00% 90.00% 94.00% 92.00%
1500 W Mixed mode Titanium 90.00% 94.00% 96.00% 91.00%
1500 W 277Vac &
HVDC
Titanium 90.00% 94.00% 96.00% 91.00%
1800 W HLAC mixed
mode
Titanium 90.00% 94.00% 96.00% 91.00%
Redundant 73.5 mm 2400 W Titanium Titanium 90.00% 94.00% 96.00% 91.00%
3200 W mixed mode Titanium 90.00% 94.00% 96.00% 91.00%
Appendix A: Additional specifications 77
Table 50. PSU efficiency level (continued)
Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
3200 W 277Vac &
HVDC
Titanium 90.00% 94.00% 96.00% 91.00%
Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet
located with the Manuals & Documents on Dell Support .
Table 51. Continuous Operation Specifications for ASHRAE A2 
Operational/non-operational conditions Allowable operations
Maximum temperature gradient (applies to both operation and
non-operation)
20 °C in an hour* (36 °F in an hour) and 5 °C in 15 minutes
(9 °F in 15 minutes), 5 °C in an hour* (9 °F in an hour) for
tape hardware.
Non-operational temperature limits -40(-5)** to 65 °C (-40(23)** to 149 °F)
Non-operational humidity limits (non-condensing at all times) 5% to 95% RH with 27 °C (80.6 °F) maximum dew point.
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3050 meters (10,006 feet)
Battery storage See appendix C
NOTE: * Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change.
NOTE: ** Liquid filled components, or systems/solutions containing liquid filled components are limited to approximately 5
°C above their freeze point. At this time, the only authorized liquid coolant is Recochem PG25 with a freeze point between
-9 °C and -13 °C, therefore the lower non-operational temperature limit is -5 °C. Components and systems/solutions that
can contain liquid but do not at the time of testing shall be tested to the -40 °C lower non-operational temperature limit.
Table 52. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged environment 
Temperature Allowable continuous operations
Maximum temperature gradient (applies to both
operation and non-operation)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (41°F in 15
minutes), 5°C in an hour* (41°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.
Non-operational temperature limits -40 to 65°C (-104 to 149°F)
Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,048 meters (10,000 feet)
Table 53. Maximum vibration specifications 
Maximum vibration Specifications
Operating 0.21 G rms at 5 Hz to 500 Hz (all operation orientations)
Storage 1.38 G rms at 7 Hz to 250 Hz for 15 minutes (all six sides tested)
78 Appendix A: Additional specifications
Table 54. Maximum shock pulse specifications 
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the
customer.
Table 55. Particulate contamination specifications 
Particulate contamination Specifications
Air filtration: Conventional Data Center only Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit
NOTE: Filtering room air with a MERV8 filter, as specified
in ANSI/ASHRAE Standard 127, is a recommended method for
achieving the necessary environmental conditions.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
NOTE: This condition applies to data center environments only. Air
filtration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an office or
factory floor.
Walk-Up Edge Data Center or Cabinet (sealed, closed
loop environment)
Filtration is not required for cabinets that are anticipated to be opened
six times or less per year. Class 8 per ISO 1466-1 filtration as defined
above is required otherwise.
NOTE: In environments commonly above ISA-71 Class G1 or that
may have known challenges, special filters may be required.
Conductive dust: data center and non-data center
environments
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: Conductive dust, which can interfere with equipment
operation, can originate from various sources, including
manufacturing processes and zinc whiskers that may develop on
the plating of raised floor tiles.
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust: data center and non-data center
environments
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
Table 56. Gaseous contamination specifications 
Gaseous contamination Specifications Notes
Copper coupon corrosion rate ISA-71 Class G1: <300 Å/month Per ANSI/ISA71.04
Silver coupon corrosion rate ISA-71 Class G1: <200 Å/month Per ANSI/ISA71.04
Appendix A: Additional specifications 79
Thermal restriction matrix
Table 57. Label reference 
Label Description
STD Standard
HPR (Silver) High performance Silver (HPR SLVR) fan
HPR (Gold) High performance Gold (HPR GOLD) fan
HSK Heat sink
LP Low profile
FH Full height
EXT Extend
L-type L-shaped
Table 58. Processor and heat sink matrix 
Heat sink Processor TDP
2U EXT HSK 1. For configs without rear GPUs and CPU TDP ≥ 200 W
2. For all CPUs in FIO RC 1/2 configs
1U EXT HSK ≤ 250 W (GPU shroud should be installed with rear GPU/FGPA/long PCIe cards)
L-type HSK > 250 W (GPU shroud should be installed with rear GPU/FGPA/long PCIe cards)
1U STD HSK For configs without rear GPUs and CPU TDP < 200 W
DLC Module Vendor DELTA. For all DLC configs
Vendor COOL-IT. For all DLC configs
NOTE: The configuration's ambient temperature is dictated by its critical component. For example, if the processor's
ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, the configuration's ambient temperature can only
be 30°C.
80 Appendix A: Additional specifications
Table 59. Thermal restriction matrix for Non-GPU Configurations E-Core processors 
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
6710E 205 W 64 HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
35°C
6756E 225 W 128 HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
35°C
6740E 250 W 96 HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
35°C
6746E 250 W 112 HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
35°C
6766E 250 W 144 HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
35°C
6780E 330 W 144 HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
SLVR
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
HPR
GOLD
+ 2U-
EXT
HSK
35°C
Appendix A: Additional specifications 81
Table 59. Thermal restriction matrix for Non-GPU Configurations E-Core processors (continued)
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
RDIM
M
1 DPC
power
2 DPC
power
DIMM configuration
32 GB 8 W N/A 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
64 GB 13 W 10 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
82 Appendix A: Additional specifications
Table 60. Thermal restriction matrix for Non-GPU Configurations P-Core processors 
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
6507P 150 W 8 HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
35°C
6505P 150 W 12 HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
35°C
6515P 150 W 16 HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
35°C
6714P 165 W 8 HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
SILVE
R
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
HPR
GOLD
Fan+
1U
STD
HSK
35°C
6517P 190W 16 HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
GOLD
Fan+
1U
HPR
GOLD
Fan+
1U
HPR
GOLD
Fan+
1U
HPR
GOLD
Fan+
1U
35°C
Appendix A: Additional specifications 83
Table 60. Thermal restriction matrix for Non-GPU Configurations P-Core processors (continued)
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
1U
STD
HSK
1U
STD
HSK
1U
STD
HSK
1U
STD
HSK
1U
STD
HSK
1U
STD
HSK
1U
STD
HSK
STD
HSK
STD
HSK
STD
HSK
STD
HSK
6736P 205 W 36 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6724P 210 W 16 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6520P 210 W 24 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6530P 225 W 32 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
84 Appendix A: Additional specifications
Table 60. Thermal restriction matrix for Non-GPU Configurations P-Core processors (continued)
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
6730P 250 W 32 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6527P 255 W 24 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6737P 270 W 32 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6740P 270 W 48 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6747P 330 W 48 HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
SILVE
R
Fan+
HPR
GOLD
Fan+
2U-
HPR
GOLD
Fan+
2U-
HPR
GOLD
Fan+
2U-
HPR
GOLD
Fan+
2U-
35°C
Appendix A: Additional specifications 85
Table 60. Thermal restriction matrix for Non-GPU Configurations P-Core processors (continued)
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
2U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
EXT
HSK
EXT
HSK
EXT
HSK
EXT
HSK
6760P 330 W 64 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6767P 350 W 64 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
6787P 350 W 86 HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
SILVE
R
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
HPR
GOLD
Fan+
2U-
EXT
HSK
35°C
RDIM
M
1 DPC
power
2 DPC
power
DIMM configuration
16 GB 6 W N/A 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
32 GB 8 W 6 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
64 GB 13 W 10 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
96 GB 15 11 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
86 Appendix A: Additional specifications
Table 60. Thermal restriction matrix for Non-GPU Configurations P-Core processors (continued)
Configuration No BP
FIO 8
x
EDSF
F
E3.S
NVMe
FIO 16
x
EDSF
F
E3.S
NVMe
8 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
16 x
2.5
inch
SAS/
SATA
+ 8 x
2.5
inch
U.2
24 x
2.5
inch
SAS/
SATA
16 x
EDSF
F
E3.S
NVMe
32 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
40 x
EDSF
F
E3.S
NVMe
+ 4 x
Rear
EDSF
F
E3.S
NVMe
Ambie
nt
temp
eratur
e
Storage
configuration
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
No
rear
drives
4 x
Rear
EDSF
F
E3.S
with
1x
Rear-
Fan
Storage
configuration number C0-01 C01-01 C02-01 C04-01~09 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-01/02/04 C10-01 C10-02
Riser configuration
RC
6/7/1
1
RC 2 RC 1/2/6 RC 0/6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11 RC 6/7/11/12 RC 6/7/11/12/15 RC7 RC14
Proce
ssor TDP Cores Fan
128
GB
16 12 HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
N/A
256
GB
N/A 15 HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
HPR
GOLD
35°C
N/A
NOTE: “High-Performance GOLD” is required for DIMM ≥ 128 GB
NOTE: Both Front I/O and Rear I/O configurations are supported, using the same chassis.
Appendix A: Additional specifications 87
Table 61. Thermal Restriction for GPU Configurations for E-core processors 
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
6710
E
205
W
64 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6756
E
225
W
128 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6740
E
250
W
96 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6746
E
250
W
112 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6766
E
250
W
144 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6780
E
330
W
144 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
RDI
MM
1
DPC
powe
r
2
DPC
powe
r
DIMM ambient temperature
32
GB
8 W N/A 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
88 Appendix A: Additional specifications
Table 61. Thermal Restriction for GPU Configurations for E-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
64
GB
13 W 10 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
GPU TDP GPU ambient temperature
L4 24 GB 72 W CPU
>=30
0 W,
30°C
35°C 35°C CPU
>=30
0 W,
30°C
CPU
>300
W,
30°C
30°C
NOTE
4
30°C
NOTE
2
30°C
NOTE
2
CPU
>300
W,
30°C
CPU
>300
W,
30°C
NOTE
4
30°C
NOTE
3
30°C 30°C N/A
H100 NVL 94
GB
400
W
35°C Not
supp
orted
Not
supp
orted
35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
N/A
L40S 48 GB 350
W
35°C Not
supp
orted
Not
supp
orted
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
35°C
A16 64 GB 250
W
35°C Not
supp
orted
Not
supp
orted
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
35°C
Nvidia H200
NVL NOTE 6
450
W
HPR
PLT
M
Fan
Not
supp
orted
Not
supp
orted
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan
Not
supp
orted
Not
supp
orted
35°C
Appendix A: Additional specifications 89
Table 61. Thermal Restriction for GPU Configurations for E-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
RTX Pro
6000 NOTE 6
450
W
HPR
PLT
M
Fan
Not
supp
orted
Not
supp
orted
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan,
30°C
Not
supp
orted
Not
supp
orted
35°C
DPU NOTE 5 Cabl
e
DPU ambient temperature
B3140H
(400G x 1P)
Activ
e
(70C
)
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
N/A
Passi
ve
35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
N/A
B3220
(200G x 2P)
Activ
e
(70C
)
35°C 35°C 35°C 35°C 35°C 35°C CPU
≤ 300
W,
30°C
CPU
≤ 300
W,
30°C
30°C 30°C 30°C Not
supp
orted
Not
supp
orted
N/A
Passi
ve
35°C 35°C 35°C 35°C 35°C 35°C CPU
≤ 300
W,
30°C
CPU
≤ 300
W,
30°C
30°C 30°C 30°C Not
supp
orted
Not
supp
orted
N/A
NOTE:
● Riser configurations RC 6-2 and RC 11-2 are the GPU ready configurations.
90 Appendix A: Additional specifications
● HPR Platinum FAN is required for GPU-ready configurations RC 6-2 and RC 11-2.
● NOTE 1: RC 1/2 supports front half-length GPU with power lower than 75 W with regular shroud and 2U EXT HSK.
● NOTE 2: L4 GPU supported on slot7/9 for riser config 6, supports CPU<300 W and slot9 only for riser config 7 and,
supports on slot5/7 for riser config 11.
● NOTE 3: L4 GPU supported on slot2/7/9 for riser config 6.
● NOTE 4: L4 GPU support on slot2/5/7/9 for riser config 11.
● NOTE 5: A full-length riser is required, and the blanks on the GPU shroud must be removed when DPU cards are
installed.
● NOTE 6: The HPR Platinum Fan is required when either the Nvidia H200 NVL or RTX Pro 6000 is installed.
Table 62. Thermal Restriction for GPU Configurations for P-core processors 
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
6507
P
150
W
8 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6505
P
150
W
12 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6515
P
150
W
16 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6714
P
165
W
8 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
Appendix A: Additional specifications 91
Table 62. Thermal Restriction for GPU Configurations for P-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
6517
P
190W 16 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6736
P
205
W
36 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6724
P
210
W
16 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6520
P
210
W
24 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6530
P
225
W
32 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6730
P
250
W
32 1U-
EXT
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
1U-
EXT
HSK
35°C
6527
P
255
W
24 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
6737
P
270
W
32 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
92 Appendix A: Additional specifications
Table 62. Thermal Restriction for GPU Configurations for P-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
6740
P
270
W
48 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
6747
P
330
W
48 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
6760
P
330
W
64 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
6767
P
350
W
64 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
6787
P
350
W
86 1U L-
TYPE
HSK
2U-
EXT
HSK
2U-
EXT
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
1U L-
TYPE
HSK
35°C
RDI
MM
1
DPC
powe
r
2
DPC
powe
r
DIMM ambient temperature
16 GB 6 W N/A 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
32
GB
8 W 6 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
64
GB
13 W 10 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
Appendix A: Additional specifications 93
Table 62. Thermal Restriction for GPU Configurations for P-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
96
GB
15 W 11 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
128
GB
16 W 12 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
256
GB
N/A 15 W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C N/A
GPU TDP GPU ambient temperature
L4 24 GB 72 W CPU
>=30
0 W,
30°C
35°C 35°C CPU
>300
W,
30°C
CPU
>=30
0 W,
30°C
30°C
NOTE
4
30°C
NOTE
2
30°C
NOTE
2
CPU
>300
W,
30°C
CPU
>300
W,
30°C
NOTE
4
30°C
NOTE
3
30°C 30°C N/A
H100 NVL 94
GB
400
W
35°C 35°C 35°C 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
35°C
L40S 48 GB 350
W
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
35°C
A16 64 GB 250
W
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
35°C
94 Appendix A: Additional specifications
Table 62. Thermal Restriction for GPU Configurations for P-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
Nvidia H200
NVL NOTE 6
450
W
HPR
PLT
M
Fan
Not
supp
orted
Not
supp
orted
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan
Not
supp
orted
Not
supp
orted
35°C
RTX Pro
6000 NOTE 6
450
W
HPR
PLT
M
Fan
Not
supp
orted
Not
supp
orted
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan,
30°C
HPR
PLT
M
Fan
HPR
PLT
M
Fan
HPR
PLT
M
Fan,
30°C
Not
supp
orted
Not
supp
orted
35°C
DPU NOTE 5 Cabl
e
DPU ambient temperature
B3140H
(400G x 1P)
Activ
e
(70C
)
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
Not
supp
orted
N/A
Passi
ve
35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C 35°C 35°C 35°C Not
supp
orted
Not
supp
orted
N/A
B3220
(200G x 2P)
Activ
e
(70C
)
35°C 35°C 35°C 35°C 35°C 35°C CPU
≤ 300
W,
30°C
CPU
≤ 300
W,
30°C
30°C 30°C 30°C Not
supp
orted
Not
supp
orted
N/A
Appendix A: Additional specifications 95
Table 62. Thermal Restriction for GPU Configurations for P-core processors (continued)
Configuration No BP
FIO 8
x
EDS
FF
E3.S
NVM
e
FIO 16 x
EDSFF E3.S
NVMe
8 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A
16 x
2.5
inch
SAS/
SAT
A + 8
x 2.5
inch
U.2
24 x
2.5
inch
SAS/
SAT
A
16 x EDSFF
E3.S NVMe
32 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Ambi
ent
temp
eratu
re
Storage
configuration
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No
rear
drive
s
No rear
drives
No
rear
drive
s
No
rear
drive
s
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-0
1
C01-
01 C02-01/02
C04-
01~0
9
C05-
01/0
2
C06-
01/0
2/06
/07
C07-
01/0
2
C09-
01
C09-
03
C08-
01/0
2/04
C10-
01
C10-
02
Riser
configuration
RC
6/7/
11
RC
2NOT
E 1
RC1/
2
NOTE
1
RC 6
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
6/7/
11
RC
7/11/
12
RC
6/12
/15
RC 7 RC 14
Air shroud type GPU Regular Regular GPU GPU GPU GPU GPU GPU GPU GPU GPU GPU
Proc
esso
r
TDP Cores Heat-sink
Passi
ve
35°C 35°C 35°C 35°C 35°C 35°C CPU
≤ 300
W,
30°C
CPU
≤ 300
W,
30°C
30°C 30°C 30°C Not
supp
orted
Not
supp
orted
N/A
NOTE:
● Riser configurations RC 6-2 and RC 11-2 are the GPU ready configurations.
● HPR Platinum FAN is required for GPU-ready configurations RC 6-2 and RC 11-2.
● NOTE 1: RC 1/2 supports front half-length GPU with power lower than 75 W with regular shroud and 2U EXT HSK.
● NOTE 2: L4 GPU supported on slot7/9 for riser config 6, supports CPU<300 W and slot9 only for riser config 7 and,
supports on slot5/7 for riser config 11.
● NOTE 3: L4 GPU supported on slot2/7/9 for riser config 6.
● NOTE 4: L4 GPU support on slot2/5/7/9 for riser config 11.
● NOTE 5: A full-length riser is required, and the blanks on the GPU shroud must be removed when DPU cards are
installed.
● NOTE 6: The HPR Platinum Fan is required when either the Nvidia H200 NVL or RTX Pro 6000 is installed.
96 Appendix A: Additional specifications
Table 63. Thermal restriction for Liquid-Cooling for Non-GPU Configurations (ALL processors). 
Configuration No BP
8 x 2.5
inch
SAS/
SATA
16 x 2.5
inch
SAS/
SATA
16 x 2.5
inch
SAS/
SATA +
8 x 2.5
inch U.2
24 x 2.5
inch
SAS/
SATA
16 x
EDSFF
E3.S
NVMe
32 x
EDSFF
E3.S
NVMe
40 x
EDSFF
E3.S
NVMe +
4 x Rear
EDSFF
E3.S
NVMe
Storage configuration No rear drives No rear drives No rear drives No rear drives No rear drives No rear drives No rear drives
4 x Rear
EDSFF
E3.S
with 1x
Rear-
Fan
Storage configuration number C0-01 C04-01/08 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-02 C10-02
Riser configuration RC 11 RC 0/ 11 RC 11 RC 11 RC 11 RC 11 RC 11 RC14
Air Shroud Type Regular
shroud
Regular
shroud
Regular
shroud
Regular
shroud
Regular
shroud
Regular
shroud
Regular
shroud
Regular
shroud
Processor
s
All HPR
SILVER
Fan 35°C
HPR
SILVER
Fan 35°C
HPR
SILVER
Fan 35°C
HPR
SILVER
Fan 35°C
HPR
SILVER
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
DDR5
Memory
16 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
32 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
64 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
96 GB RDIMM 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB RDIMM(3DS) HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
256 GB
RDIMM(3DS)
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
HPR
GOLD
Fan 35°C
NOTE: “High-Performance GOLD” is required for DIMM ≥ 128 GB.
Appendix A: Additional specifications 97
Table 64. Thermal restriction for Liquid-Cooling for GPU Configurations (ALL processors). 
Configuration No BP
8 x 2.5
inch SAS/
SATA
16 x 2.5
inch SAS/
SATA
16 x 2.5
inch SAS/
SATA + 8 x
2.5 inch
U.2
24 x 2.5
inch SAS/
SATA
16 x EDSFF
E3.S NVMe
32 x EDSFF
E3.S NVMe
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Storage
configuration
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-01 C04-01/08 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-02 C10-02
Riser
configuration
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC1
4
Air Shroud Type GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
Proc
essor
s
All HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
HPR
GOL
D
Fan
35°C
DDR
5
Mem
ory
16 GB
RDIMM
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
32 GB
RDIMM
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
64 GB
RDIMM
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
96 GB
RDIMM
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB
RDIMM(3D
S)
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
256 GB
RDIMM(3D
S)
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
GPU L4 24 GB 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
H100 NVL
94 GB
Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
L40S 48 GB Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
98 Appendix A: Additional specifications
Table 64. Thermal restriction for Liquid-Cooling for GPU Configurations (ALL processors). (continued)
Configuration No BP
8 x 2.5
inch SAS/
SATA
16 x 2.5
inch SAS/
SATA
16 x 2.5
inch SAS/
SATA + 8 x
2.5 inch
U.2
24 x 2.5
inch SAS/
SATA
16 x EDSFF
E3.S NVMe
32 x EDSFF
E3.S NVMe
40 x
EDS
FF
E3.S
NVM
e + 4
x
Rear
EDS
FF
E3.S
NVM
e
Storage
configuration
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
No rear
drives
4 x
Rear
EDS
FF
E3.S
with
1x
Rear
-Fan
Storage
configuration
number
C0-01 C04-01/08 C05-01/02 C06-01/02/06/07 C07-01/02 C09-01/03 C08-02 C10-02
Riser
configuration
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC
11-1
(HL)
RC
11-2
(FL)
RC1
4
Air Shroud Type GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
GPU
shro
ud
A16 64 GB Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
Nvidia H200
NVL NOTE 6
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
30°C
Not
supp
orted
HPR
PLT
M
Fan,
30°C
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
RTX Pro
6000 NOTE 6
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
30°C
Not
supp
orted
HPR
PLT
M
Fan,
30°C
Not
supp
orted
HPR
PLT
M
Fan,
30°C
Not
supp
orted
HPR
PLT
M
Fan,
35°C
Not
supp
orted
HPR
PLT
M
Fan,
30°C
Not
supp
orted
DPU B314
0H
(400
G
x1P)
Activ
e
(70C
)
Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
Passi
ve
Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
B322
0
(200
Gx
2P)
Activ
e
(70C
)
Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
30°C Not
supp
orted
30°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
Passi
ve
Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
35°C Not
supp
orted
NOTE:
Appendix A: Additional specifications 99
● “High-Performance GOLD” is required for DIMM ≥ 128 GB.
● A full-length riser is required, and the blanks on the GPU shroud must be removed when DPU cards are installed.
● NOTE 6: The HPR Platinum Fan is required when either the Nvidia H200 NVL or RTX Pro 6000 is installed.
NOTE: In front I/O configuration, RC 1/2 use regular air shroud and 2U EXT HSK, regardless of GPU presence.
Other Restrictions
● For rear IO configurations, 25Gb and above 25Gb PCIe/OCP cards require DAC or 85degC active optics.
○ 85degC active optics are M14MK(SFP28), 4WGYD(QSFP+)
● L4 GPU
○ Support up to 30degC system ambient when CPU≥300W in system configs No BP(C0), 8x2.5”(C04).
○ Support up to 30degC system ambient when CPU>300W in system configs FIO 16xE3.s(C02+RC6) and 16xE3.s(C09).
○ L4 GPU support on slot2/5/7/9 for riser config 11 in 16xE3.s(C09-03).
○ Support up to 30degC system ambient for all CPUs in system config 16x2.5”(C05); Support slot 2/5/7/9 only for riser
config 11
○ Support up to 30degC system ambient in system config (16+8)x2.5”(C06) and 24x2.5”(C07); Support on slot 7/9 only
for riser config 6; Support CPU<300 W and slot 9 only for riser config 7; Support on slot 5/7 for riser config 11
○ Support up to 30degC system ambient in system config 32xE3.s(C08); Support on slot 2/7/9 only for riser config 6
● DPU restrictions
○ “Long” riser cage is requested and “Removed” blanks on GPU shroud , when DPU cards installed.
○ DPUs are supported on designated riser configs of RC1, RC2, RC6-2 and RC11-2.
○ DPU BF-3 B3140H (6CMW1/KK4NR) restrictions
￭ Required DAC(passive cable), not support 70degC active optics until 85degC active optics available.
￭ Support up to 30degC system ambient with DAC(passive cable) in system configs (16+8)x2.5”(C06) and
24x2.5”(C07)
○ DPU BF-3 B3220 restrictions
￭ Support both active/passive cables
￭ Support up to 30degC system ambient and CPU up to 300 W in system configs (16+8)x2.5”(C06) and 24x2.5”(C07)
￭ Support up to 30degC system ambient for all CPUs in system configs 16xE3.s(C09) and 32xE3.s(C08)
● Single Port Network card restrictions
○ Support up to 35degC system ambient with DAC(passive cable)
○ Support up to 30degC system ambient with active cable
￭ FIO 8xE3(C01) and FIO 16xE3(C02) with RC1/2 which can support up to 35degC with active cable
￭ (16+8)x2.5"(C06)+(RC11-2): support on slot 3/5 only
￭ 24x2.5"(C07)+(RC11-2): support on slot 3/5 only
Thermal restriction for liquid cooling configurations
● Liquid cooling imposes no thermal restrictions and supports all available CPU SKUs.
● DPU restrictions
○ “Long” riser cage is requested and “Removed” blanks on GPU shroud , when DPU cards installed.
○ DPUs are supported on designated riser configs of RC1, RC2, RC6-2 and RC11-2.
○ DPU BF-3 B3140H (6CMW1/KK4NR) restrictions
￭ Support up to 30degC system ambient with temperature spec is 70degC active optics until 85degC active optics
available.
￭ Support up to 35degC system ambient with DAC(passive cable)
○ DPU BF-3 B3220 restrictions
￭ Support up to 30degC system ambient with temperature spec is 70degC active optics in system configs
(16+8)x2.5”(C06) and 24x2.5”(C07).
￭ Support up to 35degC system ambient in system configs 8x2.5”(C04), 16x2.5”(C06) and 16xE3.s(C09).
￭ Support up to 35degC system ambient with DAC(passive cable).
100 Appendix A: Additional specifications
Appendix B. Standards compliance
The system conforms to the following industry standards.
Table 65. Industry standard documents 
Standard URL for information and specifications
ACPI Advance Configuration and Power Interface
Specification, v6.4
ACPI
Ethernet IEEE Std 802.3-2022 IEEE Standards
MSFT WHQL Microsoft Windows Hardware Quality Labs Windows Hardware Compatibility Program
IPMI Intelligent Platform Management Interface, v2.0 IPMI
DDR5 Memory DDR5 SDRAM Specification DDR5 SDRAM
PCI Express PCI Express Base Specification, v5.0 PCIe specifications
PMBus Power System Management Protocol Specification,
v1.2
PMBus specifications
SMBIOS System Management BIOS Reference Specification,
v3.3.0
DMTF SMBIOS
TPM Trusted Platform Module Specification, v2.0 TPM specifications
UEFI Unified Extensible Firmware Interface Specification, v2.7 UEFI specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1
Gen1)
USB document library
NVMe Express Base Specification. Revision 2.0c NVMe specifications
NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express ® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0
15
Appendix B. Standards compliance 101
Appendix C: Additional resources
Table 66. Additional resources 
Resource Description of contents Location
Installation and Service Manual This manual, available in PDF format,
provides the following information:
● Chassis features
● System Setup program
● System indicator codes
● System BIOS
● Remove and replace procedures
● Diagnostics
● Jumpers and connectors
Dell.com/Support/Manuals
Getting Started Guide This guide ships with the system, and is
also available in PDF format. This guide
provides the following information:
● Initial setup steps
Dell.com/Support/Manuals
Rack Installation Guide This document ships with the rack kits,
and provides instructions for installing a
server in a rack.
Dell.com/Support/Manuals
System Information Label The system information label documents
the HPM board layout and system
jumper settings. Text is minimized due
to space limitations and translation
considerations. The label size is
standardized across platforms.
Inside the system chassis cover
MyDell label This code on the chassis can be scanned
by a phone application to access
additional information and resources for
the server, including videos, reference
materials, service tag information, and
Dell contact information.
Inside the system chassis cover
Enterprise Infrastructure Planning Tool
(EIPT)
The Dell online EIPT enables easier
and more meaningful estimates to
help you determine the most efficient
configuration possible. Use EIPT to
calculate the power consumption of
your hardware, power infrastructure, and
storage.
Dell.com/calc
16
102 Appendix C: Additional resources
Appendix D: Service and support
Topics:
• Why attach service contracts
• ProSupport Infrastructure Suite
• Specialty Support Services
• ProDeploy Infrastructure Suite
• Supplemental Deployment Services
• Unique Deployment Scenarios
• DAY 2 – Automation Services with Ansible
• Dell Technologies Consulting Services
Why attach service contracts
Dell PowerEdge servers include a standard hardware warranty that highlights our commitment to product quality by
guaranteeing repair or replacement of defective components. While industry-leading, our warranties are limited to 1 or 3 years,
depending on model, and do not cover software assistance. Call records show that customers are most often seeking Dell
technical support for software related issues like configuration guidance, troubleshooting, upgrade assistance or performance
tuning. Encourage customers to purchase ProSupport service contracts to supplement warranty coverage and ensure optimal
support for both hardware and software. ProSupport provides a complete hardware guarantee beyond the original warranty
period.
ProSupport Infrastructure Suite
ProSupport Infrastructure Suite is a set of support services that enable customers to build the solution that is right for their
organization. It is an industry-leading, enterprise-class support that aligns with the criticality of your systems, the complexity of
your environment, and the allocation of your IT resources.
17
Appendix D: Service and support 103
Figure 75. ProSupport Enterprise Suite
ProSupport Plus for Infrastructure
ProSupport Plus for Infrastructure is the ultimate solution for customers seeking preventative maintenance and optimal
performance on their business-critical assets. The service caters to customers who require proactive, predictive, and
personalized support for systems that manage critical business applications and workloads. When customers purchase
PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support service for business-critical
systems. ProSupport Plus provides all the benefits of ProSupport, including the following “Top five reasons to buy ProSupport
Plus (PSP)”
1. Priority access to specialized support experts: Immediate advanced troubleshooting from an engineer that understands
Dell infrastructure solutions.
2. Mission Critical Support: When critical (Severity 1) support issues happen, the customer is assured that we do all that we
can to get them back up and running as quickly as possible.
3. Technical Customer Success Manager: A customer’s #1 support advocate, ensuring they get the best possible proactive
and predictive support experience.
4. Systems maintenance: On a semiannual basis, we will keep a customer’s ProSupport Plus system(s) up to date by
installing the latest firmware, BIOS, and driver updates to improve performance and availability.
5. Third-party software support: Dell is a customer’s single point of accountability for any eligible third-party software that
is installed on their ProSupport Plus system, whether they purchased the software from us or not.
ProSupport for Infrastructure
Comprehensive 24x7 support for hardware and software – best for production, but not critical, workloads and applications. The
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
● 24x7 support through phone, chat and online
● A central point of accountability for all hardware and software issues
● Hypervisor, operating system, and application support
● Dell security advisories
104 Appendix D: Service and support
● Onsite response service levels 4 hour or Next Business Day options
● Proactive issue detection with automated case creation
● Predictive hardware anomaly detection
● Incident Manager assigned for Severity 1 cases
● Collaborative third-party support
● Access to AIOps Platforms - (MyService360, TechDirect, and CloudIQ)
● Consistent experience regardless of where customers are located or what language that they speak.
Basic Hardware Support
Provides reactive hardware support during normal business hours, excluding local national holidays. No software support or
software-related guidance. For improved levels of support, choose ProSupport or ProSupport Plus.
Specialty Support Services
Optional specialty support services complement the ProSupport Infrastructure Suite to provide additional proficiencies that are
critical for modern data center operations.
Hardware coverage add-ons to ProSupport or ProSupport Plus
● Keep Your Hard Drive (KYHD), Keep Your Component (KYC), or Keep Your GPU (KYGPU):
Normally if a device fails under warranty, Dell replaces it using a one-for-one exchange process.KYHD/KYCC/KYGPU gives
you the option to retain your device. It provides full control of sensitive data and minimizes security risk by letting you retain
possession of failed drives, components, or GPU when receiving replacement parts without incurring additional cost.
● Onsite Diagnosis Service:
Ideal for sites with non-technical staff. Dell field technician performs initial troubleshooting diagnosis onsite and transfers to
Dell remote engineers to resolve the issue.
● ProSupport Add-on for HPC:
Sold as an add-on to a ProSupport service contract, the ProSupport Add-on for HPC provides solution-aware support to
cover the additional requirements that are required to maintain an HPC environment such as:
○ Access to senior HPC experts
○ Advanced HPC cluster assistance: Performance, interoperability, and configuration
○ Enhanced HPC solution level end-to-end support
○ Remote pre-support engagement with HPC Specialists during ProDeploy implementation
● ProSupport Add-on for Telco (Respond & Restore):
An add-on service designed for the top 31 TELCO customers globally, Respond & Restore provides direct access to Dell
solution experts who specialize in TELCO carrier-grade support. This add-on also provides a hardware uptime guarantee,
meaning if a system fails, Dell has it installed and operational within 4 hours for Severity 1 issues. Dell incurs penalties and
fees if SLAs are not met.
Personalized Support and Supplemental Site-wide Expertise
● Technical Account Manager:
Designated technology lead who monitors and manages the performance and configuration of specific technology sets.
● Designated Remote Support:
Personalized support expert who manages all troubleshooting and resolution of IT assets.
● Multivendor Support Service:
Support your third-party devices as one service plan for servers, storage, and networking (includes coverage for: Broadcom,
Cisco, Fujitsu, HPE, Hitachi, Huawei, IBM, Lenovo, NetApp, Oracle, Quanta, SuperMicro and others).
Appendix D: Service and support 105
Services for large enterprises
● ProSupport One for Data Center:
ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000
assets (combined total of server, storage, networking, so forth). This offering is built on standard ProSupport features that
leverage our global scale and are tailored to specific customer needs. While not for everyone, this service option offers a
truly unique solution for our largest customers with the most complex environments.
○ Team of assigned Services Account Managers with remote or onsite options
○ Assigned technical and field engineers who are trained on the customer’s environment and configurations.
○ On-demand reporting and recommendations that are enabled by ProSupport AIOps tools (MyService360, TechDirect, and
CloudIQ)
○ Flexible onsite support and parts options that fit their operational model
○ A tailored support plan and training for their operations staff
● ProSupport One for Data Center – CSP (Cloud Serviced Provider) and AI Solution
ProSupport One for Data Center – CSP and AI Solution is a unique offer that is designed for a limited set of Dell accounts
purchasing AI computing solutions greater than 1,000 servers and $250M in sales. PS1DC - CSP and AI improves the entire
services experience combining support, deployment (rack integration), residency services, a designated support engineer, an
onsite service engineer, and an onsite parts service as one holistic offer. Special pricing has been determined to compete
effectively against competitors and provide the best customer experience. PS1DC for CSP and AI can only be sold with XE
Servers and all networking platforms (Dell and NVIDIA). All other products would be eligible for the standard PS1DC, not this
unique offer. More details on PS1DC for CSP and AI here .
● Onsite Parts Service (OPS)
Ideal for large organizations that have their own staff to support their data center. Dell offers a service that is called Onsite
Parts Service (OPS) from Dell Services. OPS manages parts inventory located at the customer’s designated facility. The
Logistics Online Inventory Solution (LOIS) program will use software to support the monitoring and automatic replenishment
of inventory stored on the customer site. . Each replacement part would automatically initiate a replenishment of the parts
inventory that is shipped the next day or delivered onsite by Dell during a regular scheduled visit (called Scheduled Onsite
Service). As part of the LOIS system, customers can integrate their systems directly to Dell TechDirect using APIs to help
streamline the support management process.
End-of-Life Services
● Post Standard Support (PSS)
Extend service life beyond the initial seven years of ProSupport, adding up to five more additional years of hardware
coverage.
● Data Sanitization & Data Destruction
Renders data unrecoverable on repurposed or retired products, ensuring security of sensitive data and enabling compliance
and provides NIST-compliant certification.
● Asset Recovery Services
Recycle, resale, and disposal of hardware. Helps you securely and responsibly retire IT assets that are no longer needed while
protecting both your business and the planet.
ProDeploy Infrastructure Suite
ProDeploy Infrastructure Suite provides various deployment offerings that satisfy a customer's unique needs. It is made up
of various sub-offers: Factory Configuration Services, Rack Integration, Basic Deployment, ProDeploy, ProDeploy Plus, and
optionally ProDeploy FLEX which allows for some customization of the features listed.
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Figure 76. ProDeploy Infrastructure Suite
Factory-based Services
Pre-configured systems or complete racks, customized prior to shipping to the customer's site.
Customer Rack Integration or ProDeploy FLEX Rack Integration
Dell offers robust custom rack integration services through two main programs: Enterprise Rack Integration Services and
Integrated Rack Scalable Systems (IRSS). These services are designed to streamline deployment, reduce complexity, and
optimize performance for data centers, edge environments, and AI workloads. These factory services are purchased as a custom
engagement or as ProDeploy Flex Rack Integration SKUs.
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Figure 77. Pre-configured system
Figure 78. Pre-configured system
Factory Configuration
Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, system
settings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers are packaged and bundled to meet
specific shipping and distribution requirements for each customer location to facilitate the rollout process. Once the server is
onsite, Dell can install and configure the server to the environment using any of the field-based deployment services outlined in
the next section.
Field-based services
Put PowerEdge servers to work faster with Dell field-based deployment services. Whether we are deploying one server to one
thousand – we have you covered. Dell provides versatile delivery options to fit every budget and operating model.
● ProDeploy Plus: Elevate Infrastructure deployments with our most complete service from planning through onsite hardware
installation and software configuration including the implementation of cybersecurity best practices. ProDeploy Plus provides
the skill and scale that is needed to successfully execute demanding deployments in today’s complex IT environments. The
deployment starts with a site readiness review and implementation plan. Certified deployment experts perform the software
configuration to include setup of leading operating systems and hypervisors. Dell will also configure PowerEdge software
tools to include iDRAC and OpenManage system utilities as well as support AIOps platforms: MyService360, TechDirect, and
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CloudIQ. Unique to ProDeploy Plus, the cybersecurity implementation helps customers understand potential security risks
and make recommendations for reducing product attack surfaces. The system is tested, validated prior to completion. The
customer will also receive full project documentation and knowledge transfer to complete the process.
● ProDeploy: ProDeploy provides remote software configuration and choice of hardware installation (onsite or guided).
ProDeploy is great for customers who are price sensitive or willing to participate in some portion of the deployment
to include providing remote access to their network. The ProDeploy remote software includes everything mentioned in
ProDeploy Plus except it does not include the added value, cybersecurity implementation, and implementatiod best practices.
● Basic Deployment: Basic Deployment delivers worry-free professional installation by experienced technicians. This service
is often sold to Competency Enabled Partners who will have Dell do the hardware installation while they complete the
software configuration. Furthermore, Basic Deployment tends to be purchased by large enterprises who have smart
technical staff. These companies just need Dell to install the hardware, and they will perform the software configuration. The
last use case for Basic Deployment is when paired with Factory Configuration services. The servers are preconfigured in the
factory, and the basic deployment service will install the system into the rack to finalize the deployment.
Figure 79. ProDeploy Infrastructure Suite - Field services
Supplemental Deployment Services
Additional ways to expand scope or deploy for unique scenarios.
Two Host Adder (requires PD/PDP)
Deploying new storage, compute, or networking devices may require interconnection to other servers (also called hosts). The
Dell delivery team will set up four hosts per device as part of every ProDeploy service. For example, if the customer is buying
two storage arrays the ProDeploy service will automatically include connectivity of four hosts each (4x2=8 total hosts per
project since there are two devices). This supplemental “Two Host Adder” service provides for the configuration of additional
hosts above what is already provided as part of the ProDeploy service. In many cases, customers can work with us while we set
up the included hosts, so they may understand how to do the rest themselves. Always ask the customer how many hosts are
being connected and sell the host adder depending on the customer’s technology skillset. Note that this service applies to the
connectivity of Dell devices not 3rd party devices.
Additional Deployment Services (ADT) – sold with or without PD/PDP
You can expand the scope of a ProDeploy engagement leveraging Additional Deployment Time (ADT). ADT covers additional
tasks above the normal deliverables of the ProDeploy offers. ADT can also be used as a standalone service without ProDeploy.
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SKUs are available for both Project Management and Technical Resource Expertise. SKUs are sold as blocks of four hours
remote or eight hours onsite. The delivery team can help in scoping the number of hours required for additional tasks.
Data Migration Services
Migrating data sets is no easy task. Our experts use proven tools and process to streamline data migrations and avoid
compromising data. A customer project manager works with our experienced team of experts to create a migration plan. Data
migration is part of every technology upgrade, platform change, and shift to the cloud. You can rely on Dell data migration
services to perform a seamless transition.
Residency Services
Certified technical professionals act like an extension of your IT staff to enhance internal capabilities and resources and
help you realize faster adoption and maximized ROI of new technology. Residency Services help customers transition to new
capabilities quickly by leveraging specific technology skill sets. Residency experts can provide post implementation management
and knowledge transfer that is related to a new technology acquisition or day-to-day operational management of the IT
infrastructure.
● Global experts available to serve in-person (onsite) or virtual (remote)
● Engagements starting at 2 weeks with flexibility to adjust
● Residency is available for project management needs, and many different technology skills sets such as: Server, storage, Gen
AI, networking, security, multi-cloud, data mgmt., and modern workforce application residents
Unique Deployment Scenarios
Custom Deployment Services
When a deployment is beyond the scope of the ProDeploy Infrastructure Suite, you can turn to the custom deployment services
team to address complex implementation scenarios and customer unique requirements. The Dell custom deployment team is
staffed with solution architects who will assist with customer scoping calls to define the project and develop the statement
of work. Custom services can handle a wide range of deployments that can be performed in the factory or onsite. All custom
engagement services are requested through SFDC.
Deployment of AI or HPC using Cluster Build Services
Once the integrated rack arrives the data center or is built onsite, Dell can also convert the racks into a large computing cluster.
Dell provides several deploy options for Artificial Intelligence (AI) or High-Performance Computing (HPC) implementations.
These complex environments require specialists that understand advanced feature sets to create a unified computing cluster for
the most demanding workloads. Choose one of the cluster build add-ons below.
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Figure 80. Deployment choices for cluster implementation
DAY 2 – Automation Services with Ansible
Dell solutions are built as “automation ready” with integrated APIs (Application Programming Interfaces) to allow customers
to programmatically call actions on the product through code. Although Dell has published Anisble automation use cases,
some customers need additional assistance with GitOps. By the end of the service, the customer will have the foundational
components required to accelerate automation and understand how the programming works together: Day 1 and Day 2 use case
automation scripts (ansible modules), CI/CD tool (Jenkins), and Version control (Git).
Dell Technologies Consulting Services
Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high-value workloads
Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can help
determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven
methodologies that are combined with the portfolio and partner ecosystem of Dell Technologies to help achieve real business
outcomes. From multicloud, applications, DevOps, and infrastructure transformations, to business resiliency, data center
modernization, analytics, workforce collaboration, and user experiences-we are here to help.
Dell Managed Services
Some customers prefer Dell to manage the complexity and risk of daily IT operations, Dell Managed Services utilizes proactive,
AI enabled delivery operations and modern automation to help customers realize desired business outcomes from their
infrastructure investments. With these technologies, our experts run, update, and fine-tune customer environments that are
aligned with service levels, while providing environment-wide and down-to-the-device visibility. There are two types of managed
service offers. First the outsourcing model or CAPEX model where Dell manages the customer owned assets using our people
and tools. The second is the as-a-Service model or OPEX model called APEX. In this service, Dell owns all technology and all the
management of it. Many customers will have a blend of the two management types depending on the goals of the organization.
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Figure 81. Dell Managed Services
Cyber-Security Services
Managed Detection and Response (MDR)
Dell Managed Detection and Response Pro Plus is our fully-managed, 360 ⁰ security operations solution comprised of our most
cutting-edge, preventive and responsive cybersecurity services. MDR Pro Plus was designed with your top security concerns in
mind, allowing you to focus on your core business goals while Dell handles your security operations. First, we have Vulnerability
Management. With this service, we’ll do ongoing scanning of the customer’s environment looking for software that needs to
be patched. Next is Pen Testing and Attack Simulation Management. This service will continuously validate security controls
and policies with automated Breach and Attack Simulation (BAS), because a misconfiguration can lead to an exposure which
an attacker can exploit. The service also includes an annual penetration test to determine if a skilled threat actor could
exploit pathways leading to critical assets or data. Third, Managed Security Awareness Training. This service will educate the
customer’s end users so that they don’t inadvertently put the customer at risk. If you think about our annual compliance
training modules, there is always a security module. This is the same type of thing, but rather than once a year, it will be
smaller, bite-size pieces of content delivered throughout the year.Fourth is our Managed Detection and Response service which
provides 24x7 threat detection and investigation, analysis of end-to-end activity by threat actors, threat hunting, and quick
initiation of cyber incident response when needed. Customers can choose between Secureworks Taegis XDR, CrowdStrike
Falcon XDR or Microsoft Defender XDR as the security analytics platform our analysts will use to monitor their environment.
All four of these services are delivered by experienced, certified Dell security experts using advanced technology such as the
Secureworks Taegis XDR, CrowdStrike Falcon XDR or Microsoft Defender XDR security platforms.
Dell Technologies Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with
the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and
certification that is required for real transformation.
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see Education.Dell.com .
Resources
Service for powerEdge
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