WORKSPACE / 근거
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MEMORY INDUSTRY INTELLIGENCE

근거

자료·원문이슈근거주장영향 분석
1134건 공개자료 기반 개인 관찰 기록
기록상태·범위수정일·발행일
Solidigm is a US-based company headquartered in Rancho Cordova, CA with 13 locations around th초안2026.10.10 13:52
“With the products we have in the pipeline, I’m so excited,” Fiza said. “They’re going to change the초안2026.10.10 13:51
A single board may contain tens of thousands of components; a rack may approach half a million.초안2026.10.10 13:51
Fiza describes validation — the process of ensuring a physical device works correctly before mass pr초안2026.10.10 13:51
“It literally just said, ‘NVIDIA Corporation Device,’” she recalls. “And everyone’s cheering and cel초안2026.10.10 13:51
One of Fiza’s earliest and most enduring memories of working at NVIDIA is the collective joy she exp초안2026.10.10 13:51
When Sakeena Fiza describes her work as a validation engineer at NVIDIA, she does so in terms more b초안2026.10.10 13:51
One of the things we are really interested in is that IMC allows for low power density dies with a l초안2026.10.10 13:51
Pat Gelsinger, former CEO of Intel, came on board as an angel investor in January in a significant b초안2026.10.10 13:51
London, United Kingdom초안2026.10.10 13:50
Bristol ### DRAM Product Engineer초안2026.10.10 13:50
Fractile raises $220M to build the next generation of inference hardware초안2026.10.10 13:50
The number of tokens we are processing with frontier AI models is growing by more than 10x every yea초안2026.10.10 13:50
Fractile is building the first of a new generation of processors, where memory and compute are physi초안2026.10.10 13:50
Run the most advanced models up to 25x faster and at 1/10th the cost.초안2026.10.10 13:50
* [ High Thermal-conductivity Underfills (encapsulants)](https://www.namics.co.jp/en/products/high초안2026.10.10 13:50
| U8439-105 | For low K, large ICs and tight spaces | 55 | 70 | 8.5 | 34 |초안2026.10.10 13:50
| U8439-1 | For low K and large ICs | 60 | 70 | 8 | 36 |초안2026.10.10 13:50
| U8410-377 | Low viscosity; for tight spaces | 15 | 128 | 8.6 | 30 |초안2026.10.10 13:50
| U8410-302 | For low-K, Cu-pillar and Pb-free bumps | 55 | 95 | 12 | 22 |초안2026.10.10 13:50
| U8410-99 | For low-K, Pb-free bumps | 50 | 100 | 11 | 29 |초안2026.10.10 13:50
| U8410-73CF3 | For low-K, Cu-pillar and Pb-free bumps and tight spaces | 33 | 88 | 8.8 | 31 |초안2026.10.10 13:50
| U8410-73C | For low K, Pb-free bumps and tight spaces | 50 | 88 | 11.5 | 31 |초안2026.10.10 13:50
| U8443-14 | Low viscosity; for tight spaces | 10 | 135 | 6.5 | 42 |초안2026.10.10 13:50
Custom formulated materials are also available for user specific applications.초안2026.10.10 13:50